An inhomogeneous dielectric medium high-speed signal trace system includes first and second ground layers. A first dielectric layer has a first dielectric constant and is located adjacent the first ground layer, and a second dielectric layer has a second dielectric constant that is different than the first dielectric constant and is located between the first dielectric layer and the second ground layer. A first differential trace pair is located between the first and second dielectric layer. A plurality of first vias extend between the first ground layer and the second ground layer and are spaced part from each other and the first differential trace pair. A plurality of second vias extend between the first ground layer and the second ground layer, are spaced part from each other and the first differential trace pair, and are located opposite the first differential trace pair from the plurality of first vias.

The chip on film assembly provided in the present disclosure comprises a substrate which includes a first auxiliary area, a second auxiliary area, and a chip on film area. The first auxiliary area, the chip on film area, and the second auxiliary area are disposed in sequence along a first direction. A plurality of signal wirings are disposed on one side of the chip on film area adjacent to the first auxiliary area and one side of the chip on film area that is adjacent to the second auxiliary area; the first auxiliary area and the second auxiliary area are used to prevent the signal wirings from breaking.

A transmission line includes a first structure including a first flexible resin base material, and a first ground conductor thereon, a second structure including a second flexible resin base material, and a first signal line and an interlayer connection conductor in or on the second resin base material, a first spacer between the first and second structures, and a first metal joining material joining the first and second structures with the first spacer interposed therebetween. A first hollow portion is between the first and second structures with the first spacer interposed therebetween. The first signal line and the first ground conductor face each other in a joining direction with the first hollow portion interposed therebetween. The first resin base material and the second resin base material are not in contact with each other. The first metal joining material has a melting point lower than that of the interlayer connection conductor.

A method for manufacturing a circuit board circuit board for transmitting high-frequency signal, including: providing a first-line circuit board (20), a second circuit board (40), at least one third circuit board (50), a fourth circuit board (60), a fifth circuit board (61), and a sixth circuit board (62); stacking the first circuit board (20), the second circuit board (40), and third circuit board (50) in that order, and stacking the fourth circuit board (60), the sixth circuit board (62), and the fifth circuit board (61) on the third circuit board (50), and pressing them together to obtain the circuit board circuit board for transmitting high-frequency signal. The method manufacturing the circuit board circuit board for transmitting high-frequency signal can reduce a width of the transmission line. The present disclosure further provides the circuit board circuit board for transmitting high-frequency signal obtained by the above method.

In printed wiring that is formed, on a surface of a base member. by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.

A backplane connector includes a housing, a number of terminal modules assembled to the housing, and a mounting block. The housing includes a base, a first side wall and a second side wall. Each terminal module includes a first signal terminal and a second signal terminal. The first signal terminal has a first mounting foot, and the second signal terminal has a second mounting foot. The housing includes a receiving groove at a bottom end of the base. The mounting block is received in the receiving groove. The mounting block is made of electroplated plastic. The mounting block has an opening for the first mounting foot and the second mounting foot to extend through. As a result, the backplane connector has a better shielding effect.

A display panel and a bezel substrate thereof are disclosed. The bezel substrate includes a bending section and a plurality of wirings. Each of the wirings includes a first line section and a second line section, the first line section and the second line section are disposed on the bending section, a width of the first line section to each of the wirings is greater than a width of the second line section of the wirings, and the first line sections of the adjacent wirings are staggered with respect to each other.

An interposer substrate includes a metal member; and a connection substrate disposed on at least portion of one side surface of the metal member. The connection substrate includes circuit patterns exposed from each of one surface of the connection substrate and the other surface of the connection substrate opposing the one surface, and one of a plurality of side surfaces of the connection substrate connecting one side and the other side of the connection substrate is attached to at least a portion of the one side surface of the metal member.

Apparatus and methods are provided for providing provide high-speed traces in inner layers of semiconductor packages or PCBs. In an exemplary embodiment, there is provided an circuit assembly that may comprise a first ground reference plane, a second ground reference plane and a dielectric layer between the first ground reference plane and the second ground reference plane. The dielectric layer may comprise a pair of traces embedded therein and the first ground reference plane may have an opening corresponding to the pair of traces. The opening may have a width equal to or larger than a width of the pair of traces, which may be equal to widths of respective traces of the pair of traces and a gap between the pair of traces.

Apparatus and methods employing twisted differential compensation for routing high-speed signals near power delivery inductors. Traces used for a high-speed differential signal including a P trace and an N trace are routed through one or more layers in a multi-layer printed circuit board (PCB) substrate and employ a twisted portion proximate to the centerline of an inductor under which portions of the P and N traces are swapped horizontally in a layer parallel to the top plane and/or are swapped vertically by swapping layers. The signal paths are routed such that a level of noise inductively coupled into the P trace and the N trace from the inductor is approximately equally. Stripline structures may be used for signals that are routed under an inductor, while stripline and microstrip structures may be used for signals routed adjacent to an inductor.