Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

An in-cell touch panel and a display device are disclosed. In the in-cell touch panel, a plurality of mutually independent self-capacitance electrodes arranged in the same layer are disposed on an array substrate in accordance the self-capacitance principle; a touch detection chip can determine the touch position by the detection of the capacitance variation of the self-capacitance electrodes; leads arranged in the same layer as pixel electrodes are disposed at gaps between the pixel electrodes and configured to connect the self-capacitance electrodes to the touch detection chip. The touch panel can reduce the manufacturing cost and improve the productivity.

The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

Provided is a printed circuit board including a first semiconductor device and a second semiconductor device mounted on a printed wiring board, the printed wiring board including a first and a second differential signal wirings each formed of a pair of signal transmission lines. The pair of signal transmission lines forming the first differential signal wiring are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other at least once in the first differential signal wiring in a wiring direction thereof. The pair of signal transmission lines forming the second differential signal wiring are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other at least once in the second differential signal wiring in a wiring direction thereof.

In a suspension board, a ground layer and a first insulating layer are formed on a support substrate. The ground layer has electric conductivity higher than that of the support substrate. A power wiring trace is formed on the first insulating layer. A second insulating layer is formed on the support substrate to cover the ground layer and the first insulating layer. A write wiring trace is formed on the second insulating layer to at least partially overlap with the ground layer. A distance between the ground layer and the write wiring trace in a stacking direction of the support substrate, the first insulating layer and the second insulating layer is set larger than a distance between the power wiring trace and the write wiring trace in the stacking direction.

The present disclosure discloses a wiring board used to connect a driving chip and a display panel, a flexible display panel and a display device. Signal output ends on the driving chip and signal input ends on the display panel may be arranged in pairs; and the wiring board may include fanout lines each of which is configured to connect a pair of signal output end and the signal input end. The wiring board may include a substrate; a plurality of segments of first connection lines having first resistivity is arranged on a first surface of the substrate; a plurality of segments of second connection lines having second resistivity is arranged on a second surface of the substrate opposite to the first surface. At least parts of the fanout lines are formed by connecting the first connection lines and the second connection lines.

A wiring substrate includes an insulating base that has a plate surface; a first circuit that is provided on the plate surface; a first terminal that is provided on the plate surface, and to which a mounting member is attached; a second terminal that is provided on the plate surface; a first wiring that connects the first circuit and the first terminal to each other; and a second wiring that connects the first terminal and the second terminal to each other, is electrically connected to the first wiring in the first terminal, and has a parallel section in which the second wiring is disposed close to and parallel to the first wiring without being electrically connected to the first wiring outside the first terminal.

A flat cable (100) includes an insulative carrier (20) extending along a front-to-back direction, a set of signal conductors (10) held by the insulative carrier, and a metal grid layer (30) attached to the insulative carrier. The insulative carrier has a top face facing upwardly and a bottom face facing downwardly. The insulative carrier defines a set of receiving passageways (210) disposed along a transverse direction perpendicular to the front-to-back direction. The set of signal conductors extend along the front-to-back direction and have different pitches along the transverse direction. The metal grid layer is attached to the top face or the bottom face. The metal grid layer has different densities along the front-to-back direction in order to make the impedance of the flat cable consistent along the front-to-back direction.

In the mesh pattern of the conductive sheet of the invention in which openings having different shapes are arrayed in plan view, a standard deviation of an area of each of the openings is equal to or greater than 0.017 mm.sup.2 and equal to or less than 0.038 mm.sup.2, in a two-dimensional distribution of centroid positions of the openings; a standard deviation for a root mean square deviation of each of the centroid positions which are disposed along a predetermined direction, with respect to a direction perpendicular to the predetermined direction is equal to or greater than 15.0 μm; or a standard deviation over a radial direction of a value expressed by a common logarithm of a standard deviation along an angular direction in a power spectrum of the mesh pattern is equal to or greater than 0.965 and equal to or less than 1.065.

An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.