H05K2201/09245

Anti-Interference Circuit Board and Terminal
20220117077 · 2022-04-14 ·

An anti-interference circuit board and a terminal are provided. The circuit board specifically includes a substrate (10). The substrate (10) has a first surface, and a first region (14) for placing a magnetometer (2) is disposed on the first surface. A plurality of circuit layers (11, 12, 15) are disposed in the substrate (10), and the plurality of circuit layers (11, 12, 15) are disposed in a stacked manner. For example, at least a first functional circuit (20) that is configured to generate a magnetic field in a first direction and a second functional circuit (30) that is configured to generate a magnetic field in a second direction are disposed in a stacked manner and are disposed in the substrate (10). When positions of the first functional circuit (20) and the second functional circuit (30) are specifically disposed, the following is met: the first region (14) is located in vertical projections of the first functional circuit (20) and the second functional circuit (30) on the first surface. It can be learned from the foregoing descriptions that the first functional circuit (20) and the second functional circuit (30) are disposed to compensate for interference to the magnetometer (2) in the first region (14), and during disposing, the first functional circuit (20) and the second functional circuit (30) are located below the magnetometer (2), to reduce an occupied surface area of the anti-interference circuit board.

Display device
11275469 · 2022-03-15 · ·

A display device may include a display panel including a display area and a non-display area in a periphery of the display area, a digitizer under the display panel, the digitizer having a first opening, a first wiring extending in a first direction and disconnected at the first opening, and a second wiring extending in a second direction crossing the first direction and disconnected at the first opening, a sensor under the display panel and in the first opening, and a first flexible circuit board under the sensor, the first flexible circuit board including a long side extending in the second direction, a short side crossing the long side, a first connection pad on the long side and electrically coupled to the first wiring, and a second connection pad on the long side and electrically coupled to the second wiring.

DISPLAY DEVICE
20220083167 · 2022-03-17 ·

A display device may include a display panel including a display area and a non-display area in a periphery of the display area, a digitizer under the display panel, the digitizer having a first opening, a first wiring extending in a first direction and disconnected at the first opening, and a second wiring extending in a second direction crossing the first direction and disconnected at the first opening, a sensor under the display panel and in the first opening, and a first flexible circuit board under the sensor, the first flexible circuit board including a long side extending in the second direction, a short side crossing the long side, a first connection pad on the long side and electrically coupled to the first wiring, and a second connection pad on the long side and electrically coupled to the second wiring.

Flexible printed circuit board and display touch apparatus

A flexible printed circuit board and a display touch apparatus are provided. The flexible printed circuit board includes a binding terminal region, a first circuit region and a second circuit region; the binding terminal region includes multiple terminals, the first circuit region includes a driver circuit, multiple first signal lines, multiple second signal lines, and multiple third signal lines, and the second circuit region includes an external connector; first ends of the multiple first signal lines, the multiple second signal lines and the multiple third signal lines are respectively connected to the terminals of the binding terminal region; second ends of the multiple first signal lines and the multiple second signal lines are respectively connected to the driver circuit; and second ends of the multiple third signal lines are connected to the connector.

PRINTED WIRING

In printed wiring that is formed, on a surface of a base member, by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.

INTEGRATING GRAPHENE INTO THE SKIN DEPTH REGION OF HIGH SPEED COMMUNICATIONS SIGNALS FOR A PRINTED CIRCUIT BOARD

A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.

Flexible display panels and display devices
11153969 · 2021-10-19 · ·

A flexible display panel and a display device are provided. The flexible display panel includes a bent portion. The bent portion includes a substrate layer group and a conductive wire group. The conductive wire group is located on the substrate layer group. The conductive wire group includes a plurality of conductive wires in a curved shape. At least two of the plurality of conductive wires cross and surround at least one closed region. The at least one closed region is provided at least corresponding to a bent region of the bent portion.

ELECTRONIC DEVICE
20210318374 · 2021-10-14 ·

An electronic device includes a first substrate having a first bonding region, a first circuit, a second circuit, a third circuit, and a plurality of first conductive contacts. The first and second circuit are located at a first edge and a second edge of the first bonding region, the third circuit is located between the first and the second circuits. A second substrate having a second bonding region corresponding to the first bonding region in position and a fourth circuit, a fifth circuit, a sixth circuit, and a plurality of second conductive contacts. When the first substrate is bonded with the second substrate, the first circuit, the second circuit, the third circuit, the fourth circuit, the fifth circuit, and the sixth circuit form a loop, and the first and second conductive contacts are electrically connected to a plurality of signal circuits.

STRETCHABLE CONDUCTOR CIRCUIT
20210259099 · 2021-08-19 ·

This disclosure provides a stretchable conductor structure, a garment with a stretchable conductor structure, and a method for producing a stretchable conductor structure. The conductive structure includes a set of conductive wires and a stretchable laminate. The set of conductive wires, each including a protective surface, the set of conductive wires patterned in a mesh structure to accommodate a manipulation while providing electrical conductivity across the set of conductive wires. The stretchable laminate encapsulates the mesh structure, the stretchable laminate can return the mesh structure of the set of conductive wires to an original state after the manipulation.

VIA PATTERN FOR FRAMEBUFFER INTERFACES
20210243895 · 2021-08-05 ·

This disclosure provides a multi-layered printed circuit board (PC) that has signal array region. The signal array region has a width and circumscribes a power core region and has signal vias connected to respective signal ball pads, and ground vias connected to respective ground ball pads within the signal array region that have an associated ball pad pitch. The PCB also has an inner current power layer. The signal and ground vias are arranged on the component layer in a pattern and extend into the inner current layer. The pattern forms current power paths across the width of the signal array region, such that the current power paths have a width that is at least about 50% as wide as the ball pad pitch.