An RFID tag is provided that includes an RFIC module with a base substrate and an RFIC chip, and an antenna element. A principal surface of the base substrate is provided with a first chip connection terminal connected to a first input/output terminal of the RFIC chip, a second chip connection terminal connected to a second input/output terminal, a first module-side terminal connected by direct current or capacitively coupled to a first antenna-side terminal of the antenna element, a second module-side terminal connected by direct current or capacitively coupled to a second antenna-side terminal, a first wiring pattern connecting the first chip connection terminal and the first module-side terminal, a second wiring pattern connecting the second chip connection terminal and the second module-side terminal, and a third wiring pattern connecting the first module-side terminal and the second module-side terminal.

Methods for fabricating flexible/stretchable circuits can include identifying one or more regions of a printed circuit board (PCB) for selectively removing insulation material. The PCB can include one or more electrically conductive structures arranged on an insulation layer. The method can include applying, within each region of the one or more regions, thermal energy via a heat source to a surface of the PCB within the region such that insulation material of the insulation layer is removed from the region while a portion of the insulation layer beneath the one or more electrically conductive structures is maintained. The flexible/stretchable circuit can be laminated on a soft actuator to form a soft robotic device.

Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). The detector monitors the tamper-respondent sensor(s) by applying an electrical signal to the conductive lines of the at least one tamper-respondent sensor to monitor for a non-linear conductivity change indicative of a tamper event at the tamper-respondent sensor(s). For instance, the detector may monitor a second harmonic of the electrical signal applied to the conductive lines for the non-linear conductivity change indicative of the tamper event, such as an attempted shunt of one or more conductive lines of the tamper-respondent sensor(s).

A flexible printed circuit and printed circuit board soldered structure is provided. The structure includes signal transmission lines which dispense with any through hole, thereby enhancing integrity of high-frequency signals. The special design of the signal line structure of the flexible printed circuit and the printed circuit board together provides a satisfactory high-frequency signal transmission interface and enables a soldering technique which is highly practicable and compatible with the flexible printed circuit and printed circuit board soldered structure.

A filter element is mounted on a module substrate. The filter element includes a ground terminal and a pair of signal terminals. The module substrate includes a ground plane, a ground land, and an inductance adjusting line that connects the ground land to the ground plane. The ground terminal of the filter element is connected to the ground land of the module substrate. The inductance adjusting line includes an in-plane extending portion that extends in an in-plane direction of the module substrate.

Provided is a self-adhesive sheet including a 4-methyl-1-pentene-based polymer. In the self-adhesive sheet, it is preferable that at least one or more temperatures showing a local maximum value of a loss tangent (tan δ) , which is obtained by dynamic viscoelasticity measurement under conditions of a temperature rising rate of 4° C./min, a frequency of 1.59 Hz, and a strain amount of 0.1%, are present in a range of 10° C. or higher and 100° C. or lower, the local maximum value of the loss tangent is 0.5 or more and 3.5 or less, an arithmetic average roughness Ra on one surface of the self-adhesive sheet is in a range of 0.01 to 10 .Math.m, and a ten-point average roughness Rz is in a range of 0.1 to 50 .Math.m.

Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.

A multi-layer printed circuit board (PCB) includes a laminate between a PCB heating core and a PCB signal core. The PCB heating core includes an electrically conductive resistive heating element upon a first core substrate. During a lamination cure PCB fabrication stage, a platen contacts the PCB and a power supply is electrically connected to the resistive heating element. The laminate is cured with heat transferred by the platen and heat from the resistive heating element. The PCB heating core may be located within an inner layer of the multi-layer PCB to normalize a thermal gradient across the multi-layer PCB that may otherwise occur during the laminate cure fabrication stage. As a result of the normalized thermal gradient, the degree of laminate cure and material characteristics of the cured laminate material are more consistent throughout the multi-layer PCB thickness.

There is provided a method for manufacturing a component interconnect board (150) comprising a conductor structure for providing electrical circuitry to at least one component (114) when mounted on the component board, the method comprising providing a conductor sheet (100) with a first predetermined pattern (115), providing a solder resist sheet (112) with a second predetermined pattern for defining solder areas (125) of the component board, forming a subassembly (120) by laminating the solder resist sheet on top of the conductor sheet, applying solder onto the subassembly, placing the at least one component onto the subassembly, performing soldering, and laminating the subassembly to a substrate (130). The solder resist sheet is further arranged to act as a carrier for the conductor sheet.

Disclosed is a flexible and stretchable electronic device based on a biocompatible film. The biocompatible film is utilized as an encapsulation layer and a substrate layer of the device; a bonding layer is provided between the encapsulation layer and a functional layer; and an adhesion layer is arranged under the substrate layer. The functional layer employs a flexible and stretchable structure. Solution-based transfer printing technology is primarily used during the preparation of such a device to achieve integration of the functional layer and the flexible substrate layer. This device retains and even enhances the flexibility and stretchability structurally. Meanwhile, the biocompatibility properties thereof, such as being waterproof and air permeable, hypoallergenic, etc., allow it to work normally on the human body surface for more than 24 hours without foreign body sensation and discomfort, and thus, skin maceration, redness or other allergic reactions due to poor biocompatibility can be avoided.