Patent classifications
H05K2201/09272
Electronic device including wiring on a stretchable/contractible base
An electronic device including a stretchable/contractible base and a wiring formed on the base, the wiring being divided into a first region having a shape extending in a proceeding direction and a second region in which the proceeding direction is curved. The wiring includes a first conductive layer and a second conductive layer formed of a material that makes the second conductive layer easier to be curved than the first conductive layer. The first conductive layer is formed in the first region and the second conductive layer is formed in the second region.
Wired circuit board and production method thereof
An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle θ satisfies 0<θ<1 deg.
Printed circuit board having a ground plane with angled openings oriented between 30 to 60 degrees
A printed circuit board that includes conductive layers separated by insulation layers of dielectric material, at least one conductive layer being patterned and having at least one signal line embedded in an insulation material, whereby a conductive ground plan layer, separated by the insulation material and lying in a predetermined distance (d) from the at least one signal line includes a ground plane area associated to and extending along the at least one signal line, the conductive layer associated to and extending along the at least one signal line is provided with openings therein. Preferably the openings are spaces between conducting stripes, extending, seen from above, across the at least one signal line, the conducting stripes being integrally connected with the conductive remainder of the conductive layer.
Wiring board, flexible display panel and display device
The present disclosure discloses a wiring board used to connect a driving chip and a display panel, a flexible display panel and a display device. Signal output ends on the driving chip and signal input ends on the display panel may be arranged in pairs; and the wiring board may include fanout lines each of which is configured to connect a pair of signal output end and the signal input end. The wiring board may include a substrate; a plurality of segments of first connection lines having first resistivity is arranged on a first surface of the substrate; a plurality of segments of second connection lines having second resistivity is arranged on a second surface of the substrate opposite to the first surface. At least parts of the fanout lines are formed by connecting the first connection lines and the second connection lines.
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.
Disk device
According to one embodiment, a disk device includes a recording medium, a first magnetic head, a first wiring member, a flexible printed circuit board, and a wire. The first wiring member is electrically connected to the first magnetic head. The flexible printed circuit board includes a surface, a first fixed part fixed to a first component, and a second fixed part fixed to a second component, and is electrically connected to the first magnetic head through the first wiring member. The wire on the flexible printed circuit board extends along the surface such that the wire extends between the first fixed part and the second fixed part in a direction intersecting at an angle of larger than 45 degrees and not larger than 90 degrees with an extending direction of a virtual shortest line that connects the first fixed part to the second fixed part along the surface.
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.
CIRCUIT BOARD HAVING A GROUND LAYER INCLUDING A PLURALITY OF POLYGONAL OPENINGS
A circuit board includes an insulating layer, a ground layer formed on a first surface of the insulating layer and including a plurality of openings arranged in first and second surface directions, each of the openings having a shape of a polygon having five or more sides, and a wiring layer formed on a second surface of the insulating layer opposite to the first surface.
MULTILAYER SUBSTRATE
According to one embodiment, there is provided a multilayer substrate including a signal layer. The signal layer includes a first line and a second line which form a differential pair. The first line electrically connects a first node and a second node in the signal layer. The second line electrically connects a third node and a fourth node in the signal layer. The interval between the first line and the second line is approximately constant from the first node to the second node. A physical length from the third node to the fourth node in the second line is shorter than a physical length from the first node to the second node in the first line. A width of the second line is thicker than a width of the first line.
PRINTED CIRCUIT BOARD, DISPLAY PANEL AND WIRING METHOD FOR PRINTED CIRCUIT BOARD
A printed circuit board, a display panel and a wiring method are provided by embodiments of the disclosure. The printed circuit board includes: a first multichannel circuit connecting terminal; a second multichannel circuit connecting terminal; and a plurality of connecting wires connecting a plurality of second channel connecting pins of the second multichannel circuit connecting terminal with a part of a first channel connecting pins of the first multichannel circuit connecting terminal in one-to-one correspondence, the rest of the first channel connecting pins being spare, where at least one of the plurality of connecting wires has a first portion, which is bent to extend through a spare region, on the printed circuit board, between the spare first channel connecting pins and the second multichannel circuit connecting terminal.