An embroidery machine with on-board electronics executing layout and alignment software provides for automated thread installation to establish textile-to-pad contact through the use of anisotropic conductive threads characterized by electrically conductive segments alternating with electrically insulating segments. Present embodiments provide for garments or other fabrics and textiles having flexible circuits integrated on a flexible substrate that bends and moves with the garment in a way not seen with stiff printed circuit boards, which may include multiple textile circuits attached to fabric to impart desired electronic features including connectivity to a printed circuit board external to a garment formed according to the present embodiments, as well as imparting electrical conductivity across seams of a garment sewn together from fabric, while maintaining electrical integrity of neighboring circuits on the same garment.

In one or more embodiments, a circuit board may include a trace pair and a serpentine region of the trace pair, which may include: a first subregion in which the first trace includes a first portion that has a third width and a first length and in which the second trace includes a second portion, at least substantially parallel to the first portion, that has a fourth width, greater than the second width, and a second length; and a second subregion, adjacent to the first subregion, in which the first trace includes a third portion that has the third width and a third length and in which the second trace includes a third portion that has the fourth width and a third length, different from the second length.

Disclosed is an inter-board connection structure including a signal line conductor (22) provided in an outer layer of a printed circuit board (100), a signal line conductor (24) extending in a direction from the signal line conductor (22) to a signal pad (21), and forming a capacitive component between itself and a signal pad (21), and a signal line conductor (23) branching and extending from a connecting portion between the signal line conductor (22) and the signal line conductor (24), and electrically connected to the signal pad (21).

A circuit device includes a circuit board and a conductive plate that are laminated via an insulating layer, and a circuit component. A conductive path is formed on the insulating layer using a conductive adhesive, and a portion of the conductive path is interposed between the insulating layer and the back side of the circuit board. A first terminal of the circuit component is electrically connected to the conductive path, and a second terminal is electrically connected to the conductive plate through a missing portion formed in the insulating layer. The conductive pattern extends to the back side of the circuit board, and the extended conductive pattern and the conductive path are adhered to each other where the respective surfaces overlap each other.

A wearable power management system includes: a bottom coating layer; a bottom center layer disposed above the bottom coating layer; a circuit layer disposed above the bottom center layer;

a top center layer disposed above the circuit layer, and a top coating layer disposed above the top center layer. The Young's modulus of the bottom coating layer and the top coating layer is greater than the Young's modulus of the bottom center layer and the top center layer. The circuit layer includes a device layer and a connection layer disposed above the device layer.

A circuit substrate includes an insulating body, a wiring enclosed by the insulating body, a conductive layer formed within the insulating body on a same plane as the wiring, and electrically insulated from the wiring by the insulating body, and one or more conductive vias extending through an edge portion of the conductive layer in a thickness direction intersecting the plane. A first width of the insulating body between the wiring and the conductive layer at a first position in the plane direction that does not correspond to any of said one or more conductive vias is smaller than a second width of the insulating body between the wiring and the conductive layer at a second position in the plane direction that corresponds to one of said one or more conductive vias.

Disclosed is an inter-board connection structure including a signal line conductor (22) provided in an outer layer of a printed circuit board (100), a signal line conductor (24) extending in a direction from the signal line conductor (22) to a signal pad (21), and forming a capacitive component between itself and a signal pad (21), and a signal line conductor (23) branching and extending from a connecting portion between the signal line conductor (22) and the signal line conductor (24), and electrically connected to the signal pad (21).

The present invention discloses an array substrate, a liquid crystal panel and a liquid crystal display. The array substrate includes a main substrate and an auxiliary substrate, and a plurality of gate scan lines are provided on the main substrate; a gate driver circuit and a plurality of first wires connected to the gate driver circuit are provided on the auxiliary substrate; wherein the auxiliary substrate is bonded to the main substrate so that the plurality of first wires are electrically connected to the plurality of gate scan lines, and the auxiliary substrate is a flexible substrate and is capable of being bent and disposed corresponding to the main substrate. The present invention can realize the ultra-narrow frame of the liquid crystal panel and improve the driving ability of the display.

The present disclosure concerns a flexible electronic circuit (100) and method of manufacturing. A flexible substrate (30) with conductive tracks is provided with a rigid electronic component (10). The component (10) comprises electrical contacts (11, 12) on either sides. The conductive tracks connect to the contacts via an arced section that originates from respective sides of the contacts but swirls partially around the component to approaches the component along a centerline (CL) separating the contacts (11, 12).

A contaminant detector is capable of sending a signal or alert when a contaminant is detected within a housing of a utility meter, a meter transmission unit (MTU), or other associated equipment. Circuitry enclosed within the housing is capable of detecting utility usage, transmitting information between one or more utility meters and a utility provider, and/or otherwise monitoring or tracking utility usage. The contaminant detector includes a resistive voltage divider network having a resistance that varies when in contact with a contaminant such as a form of water or metal. The variable resistor has a serpentine structure comprising a plurality of detective fingers that are formed from conductive material and separated by a non-conductive substance.