A differential trace pair system includes a board including a board structure having a first, a second, a third, and a fourth board structure member, wherein a distance between the first and the third board structure members is longer than a distance between the second and the fourth board structure members. The differential trace pair system further includes a differential trace pair that includes a first differential trace extending between the first and the third board structure members and a second differential trace extending between the second and the fourth board structure members. The second differential trace having a serpentine structure that includes a first portion that continuously transitions away from the first differential trace and a second portion that is contiguous with the first portion, the second portion continuously transitions towards the first differential trace.

An electronic device (100) comprises a stretchable substrate (30) with a flap (30f) formed by a cut (40) in the substrate (30). The flap (30f) is disconnected by the cut (40) from a surrounding main section (30m) of the substrate (30) except on one side. The flap (30f) is exclusively connected to the main section (30m) via a connected section (30c) of the substrate (30) between two ends (40a, 40b) of the cut (40). An electronic component (10) is disposed on the flap (30f) with electrical contacts (11,12) connected to conductive tracks (21,22) disposed on the substrate (30). The conductive tracks (21,22) extend between the component (10) disposed on the flap (30f), and other parts (10r) of the electronic device (100) outside the flap (30f) via the connected section (30c). The flap (30f) with the component (10) is disposed in a pocket formed by surrounding lamination layers (31,32).

Provided are a circuit board component and a terminal. The circuit board component includes: a circuit board and a wire disposed on the circuit board, where the wire includes a first portion and a second portion, a line width of the first portion is greater than or equal to a line width threshold, and a line width of the second portion is less than the line width threshold.

In one embodiment, a system includes a ground layer, a first layer, a second layer, and a plurality of vias. The first layer includes a first insulating material and a plurality of first metallic strips. The second layer includes a second insulating material and a plurality of second metallic strips. The plurality of vias electrically connect one or more of the plurality of first metallic strips of the first layer to one or more of the plurality of second metallic strips of the second layer. The plurality of first metallic strips of the first layer and the plurality of second metallic strips of the second layer form a plurality of capacitors and a plurality of conductors. Each capacitor is located in the first layer. Each conductor is partially located in the first layer and partially located in the second layer.

Embodiments of the disclosure are directed to a harness assembly including a substrate having a plurality of vias, and a trace formed atop the substrate, the trace extending between each of the plurality of vias. The harness assembly may further include a surface mounted device disposed within a via of the plurality of vias.

Provided is a conductive pattern having at least one unit conductive pattern forming one touch pixel according to an aspect of the present invention. The at least one unit conductive pattern includes a plurality of nanostructures each having opposite ends. A ratio of nanostructures, both opposite ends of which are in contact with edges of the at least one unit conductive pattern to all nanostructures included in the at least one unit conductive pattern is 70% or more.

A flexible substrate includes a plurality of unit wiring structures. Each of the unit wiring structures includes: a central section; and at least four curved strips disposed at an outer side of the central section, each of the curved strips having a first end connected to the central section. The central section includes: an insulation layer; interlayer connection via that passes through the insulation layer; first wiring section connected to the interlayer connection via; and second wiring section electrically connected to the first wiring section by way of the interlayer connection via. The first wiring section, insulation layer and second wiring section are disposed in this order, and two of the at least four curved strips extending in a first direction are connected to the first wiring section, other two of the at least four curved strips extending in a second direction are connected to the second wiring section.

A flexible display panel and a display device are provided. The flexible display panel includes a bent portion. The bent portion includes a substrate layer group and a conductive wire group. The conductive wire group is located on the substrate layer group. The conductive wire group includes a plurality of conductive wires in a curved shape. At least two of the plurality of conductive wires cross and surround at least one closed region. The at least one closed region is provided at least corresponding to a bent region of the bent portion.

A wiring board comprising an insulation substrate comprising a main surface and a penetrating portion that has an insulation property; and an external connection conductor, a portion of which is positioned in the insulation substrate and a different portion of which is exposed at the main surface, wherein the penetrating portion penetrates into the external connection conductor.

A wiring structure includes a first dielectric layer, a second dielectric layer adjacent to the first dielectric layer, and a conductive region. The first dielectric layer defines a first opening, and the second dielectric layer defines a second opening. The conductive region includes a conductive via filling the first opening and the second opening. The conductive region further includes a first conductive trace embedded in the second dielectric layer and electrically connected with the conductive via. The conductive region includes a sidewall traversing through a thickness of the second dielectric layer with a substantial linear profile. A method of manufacturing a wiring structure is also disclosed.