A circuit board has an electrical circuit and a connector that is attached to the circuit board. The connector has metal contacts. A housing of the connector has an embedded reference metal layer that is disposed under a single-ended metal contact or differential metal contacts. The reference metal layer sets the impedance of the single-ended metal contact or the differential metal contacts.

Embodiments of negative pressure wound therapy systems and methods are disclosed. In one embodiment, an apparatus includes a housing, negative pressure source, circuit board, and one or more controllers. The circuit board can be supported by the housing and include a conductive pathway extending around at least part of a perimeter of a first side of the circuit board. The conductive pathway can be electrically coupled to an electrical ground for the circuit board. The one or more controllers can be mounted on the circuit board and activate and deactivate the negative pressure source.

Apparatus having at least one breakout structure are provided. In one example, an apparatus includes a dielectric layer, first and second contact pads, and first and second vias. The first and second contact pads are disposed on the dielectric layer. The first via is disposed through the dielectric layer and coupled to the first contact pad. The first via is offset from the first contact pad in a first direction. The second contact pad is immediately adjacent the first via. The second via is disposed through the dielectric layer immediately adjacent the first contact pad and coupled to the second contact pad. The second via is offset from the second contact pad in a second direction that is opposite of the first direction. The first and the second contact pads define a first differential pair of contact pads that is configured to transmit a first differential pair of signals.

A module includes a substrate including a first surface, a first land electrode arranged on the first surface, and a first electronic component mounted on the substrate with the first land electrode being interposed. The substrate is provided with a first opening that passes through the substrate in a direction of thickness within a projection area of the first land electrode.

Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.

An electronic device and associated methods are disclosed. In one example, the electronic device can include an assembly having asymmetrically situated conductors. In selected examples, the assembly includes a ground plane, a central shield portion, a first side shield portion on a first side, a second side shield portion on a second side, a first conductor asymmetrically situated between the central shield portion and the first side shield portion, a second conductor asymmetrically situated between the central shield portion and the second side shield portion, and dielectric within the assembly.

An electronic control device includes a plurality of drive control components and a substrate. The plurality of drive control components are grouped into systems. Each of systems is configured to control a control target independently. The substrate is divided into areas, corresponding to the systems, on which at least a part of the drive control components is mounted by each of the systems, and has layers stacked.

A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted. The first passive component may be an inductor, a capacitor or a resistor. The first passive component is operable as a heat sink, a heat shield, an electromagnetic shield, or as a tuning inductor.

A disclosed apparatus may be a circuit board that includes (1) a first unique sublaminate that includes a plurality of ground layers and a plurality of signal layers, (2) a second unique sublaminate that includes a plurality of power layers and another plurality of signal layers, and (3) a symmetry axis that bisects the circuit board between the first unique sublaminate and the second unique sublaminate, wherein the first unique sublaminate and the second unique sublaminate are distinct from one another. Various other apparatuses, systems, and methods are also disclosed.

A compact electronic device for wireless communication is disclosed. The compact electronic device includes a main printed circuit board, one or more antennas, at least one conductor, and a shell. The one or more antennas are configured for wireless communication. The at least one conductor being configured to provide at least one of control signals and power to a fan. The shell mounts the fan relative to the main printed circuit board. The shell includes walls forming a cavity. The walls encapsulate the conductor in the cavity.