Package substrates are provided. The package substrate may include a power line and a ground line on a first surface of a substrate body; a plurality of signal lines on the first surface between the power line and the ground line; and a lower ground pattern and a lower power pattern positioned on a second surface of the substrate body opposite to the first surface. The lower ground pattern may be disposed to be opposite to the power line and the lower power pattern may be disposed to be opposite to the ground line. Related semiconductor packages are also provided.

A signal processing board includes a six-layer substrate. A plurality of signal transmission planes are formed in a first layer, a third layer, a fourth layer, and a sixth layer. A first ground plane is formed in a second layer. A first power supply plane is formed in a fifth layer and electrically connected to the first semiconductor element. A second power supply plane is formed in the fifth layer and electrically connected to the second semiconductor element. A second ground plane is formed in the fifth layer. A first bypass capacitor is electrically connected to the first power supply plane and the second ground plane. A second bypass capacitor is electrically connected to the second power supply plane and the second ground plane.

Techniques to move high current power distribution layers for integrated circuit core power and serializer-deserializer (SERDES) power into a center area of the integrated circuit footprint. This provides a more reliable and higher current distribution into the center of a large integrated circuit footprint, without causing disruption of high speed signal routing or increased signal integrity burden to the high speed signals. Arrangements and methods for routing out the core power area of a main printed circuit board under an integrated circuit and replacing it with a custom power printed circuit board (power plug) that is attached by a metalized paste sintering process. This provides a more reliable and higher current distribution into the center of a large integrated circuit or other high-power component, without causing disruption of high speed signal routing.

An electronic control device includes a plurality of circuit boards that transmit signals to each other and a power supply connector for direct-current power. A ground line connected to a ground terminal of the power supply connector is connected to a ground of one of the plurality of circuit boards by way of a ground of another one of the plurality of circuit boards. In this way, the electronic control device including the plurality of circuit boards needs fewer noise reduction components while enabling easier routing of ground lines.

In a multilayer substrate including a motor drive circuit, a second conductive layer being a common ground pattern is formed over a substrate entire region in a second layer. In a third layer, a third conductive layer being the common ground pattern is formed to surround an outer periphery of a power-related circuit by an entire periphery of the third conductive layer. In the fourth layer, a fourth conductive layer being the common ground pattern is formed to surround the outer periphery of the power-related circuit by an entire periphery of the fourth conductive layer. The third conductive layer includes a noise guard portion extending along the outer periphery of the power-related circuit to a substrate outer edge. The noise guard portion is connected to the second conductive layer and the fourth conductive layer by multiple through holes arranged on the substrate outer edge to surround the power-related circuit.