An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.

A semiconductor device includes: an annular or partially annular substrate; a first control circuit provided on the substrate and configured to control a first phase of a motor; a second control circuit provided on the substrate so as to be adjacent to the first control circuit in a circumferential direction of the substrate and configured to control a second phase of the motor; a power supply wiring disposed on one of outer and inner circumferential sides of the first and second control circuits in a radial direction of the substrate, the power supply wiring being connected to the first and second control circuits, and extending in the circumferential direction; and a ground winding disposed on another one of the outer and inner circumferential sides of the first and second control circuits in the radial direction, being connected to the first and second control circuits, and extending in the circumferential direction.

A touch screen includes a first shield wiring surrounding a plurality of sensor wirings and a plurality of lead wirings, and capacitors. The distance between the first shield wiring and the outermost lead wiring which is the outermost wiring, out of the plurality of lead wirings, is larger than the intervals between the plurality of lead wirings. The capacitors are constituted by first and second electrodes including extending portions which extend in the extending direction.

A multilayer substrate includes plural layers of circuit patterns. Each circuit pattern includes a ground conductor surrounding a wiring region provided with a conductive wiring pattern. Each ground conductor includes a slit connecting between the outside of the multilayer substrate and the wiring region. In the multilayer substrate, the slit of the ground conductor provided at one of adjacent two layers of the circuit patterns and the slit of the ground conductor provided at the other circuit pattern are formed at positions not overlapping with each other. That is, these slits are formed at such positions that a view in an upper-to-lower direction is blocked. The shape of the slit of each ground conductor is in such a shape that a view from an end side of the multilayer substrate to a wiring region side is blocked.

The electronic device includes: a substrate having an electronic circuit formed therein; a housing for housing the substrate; and a connector disposed on the substrate and serving as an interface between outside and inside of the housing. The substrate has a main circuit pattern portion that forms a main circuit and a frame ground pattern portion that forms a frame ground. The main circuit pattern portion and the frame ground pattern portion are disposed so as not to overlap each other on the substrate and in the substrate. A terminal of the connector is disposed in the frame ground pattern portion.

A wireless power receiver for wirelessly receiving power from a wireless power transmitter comprises: a power reception circuit receiving electromagnetic waves emitted from the wireless power receiver so as to output power having an alternating current waveform; a rectifier for rectifying the power, having an AC waveform, outputted from the power reception circuit into power having a direct current waveform; a DC/DC converter for converting, into a voltage of a preset level, a voltage of the power having a direct current waveform, the power being rectified by the rectifier; a charger for charging a battery by using the power having a DC waveform, converted from the DC/DC converter; an alternating current ground connected to the power reception circuit and/or the rectifier so as to receive at least a portion of the power having an alternating current waveform; and a direct current ground connected to the DC/DC converter and/or the charger so as to receive at least a portion of the power having a direct current waveform, wherein the alternating current ground and the direct current ground can be disposed on different PCB layers, respectively.

An improved intrinsically safe mobile device is designed to reduce sparking risk and surface heating while still maintaining a form factor, processing speed, and functionality comparable to conventional mobile devices. Non-intrinsically safe electronic components are mounted on an unprotected part of a printed circuit board (PCB) contained within the mobile device and are encapsulated to reduce risk of sparking and to minimize surface heating to enable the encapsulated electronic components to be certified as intrinsically safe. The encapsulated electronic components are connected using a trace with intrinsically safe electronic components mounted on a protected part of the PCB and are connected with user interface components using FPC cabling. The trace and FPC cabling are certified as intrinsically safe using one or more protection techniques, such as through use of a resistor, a double MOSFET clamping circuit, a capacitor, a fuse, or maintaining a minimum clearance space.

A process of manufacturing a multilayer circuit board includes patterning insulating substrates on which conductors are formed to provide a signal conductor, a first ground conductor, and a second ground conductor. The insulating substrates including the signal conductor, the first ground conductor, and the second ground conductor are stacked and thermally crimped to form a laminate. An interlayer connection conductor is formed on a surface of the laminate by a Laser Direct Structuring process.

An optical device includes a connection pad, which is connected to a conductor pattern on the circuit substrate, at one edge. The connection pad includes one ground pad, and two or more signal pads between which the ground pad is interposed from its both sides. The ground pad includes a concave portion including an opening at the edge. The circuit substrate is provided with a metal columnar member in the conductor pattern to which the ground pad is connected. The conductor pattern and the connection pad are fixed to each other with solder in a state in which the columnar member is fitted into the concave portion. Solder, which gradually rises from the ground pattern to a lateral surface of the columnar member, is formed between the columnar member and the ground pattern that is formed in the flexible printed circuit.

An optical device includes a connection pad, which is connected to a conductor pattern on the circuit substrate, at one edge. The connection pad includes one ground pad, and two or more signal pads between which the ground pad is interposed from its both sides. The ground pad includes a concave portion including an opening at the edge. The circuit substrate is provided with a metal columnar member in the conductor pattern to which the ground pad is connected. The conductor pattern and the connection pad are fixed to each other with solder in a state in which the columnar member is fitted into the concave portion. Solder, which gradually rises from the ground pattern to a lateral surface of the columnar member, is formed between the columnar member and the ground pattern that is formed in the flexible printed circuit.