Disclosed are a PCB, a PCB mounting box, a case assembly, and a case. The PCB includes: a PCB body and a grounding region on a side surface of the PCB body. The grounding region is connected to a GND network in the PCB body. By providing an additional grounding region connected to the GND network of the PCB body on the side surface of the PCB body, the PCB can be grounded by means of the grounding region on the side surface instead of a grounding hole running through the PCB. In this way, the PCB is allowed to be grounded by means of the grounding region on the side surface in a pluggable mounting mode, so that the mounting mode of the PCB becomes more flexible, and the grounding of the PCB becomes more convenient.

An add-in card includes a card-edge connector including a signal contact finger and a ground contact finger coupled to a ground plane of the add-in card, a plurality of metal layers, and first and second ground vias. The metal layers include a surface metal layer, a first ground metal layer, and a second ground metal layer. The surface metal layer includes the signal contact finger and the ground contact finger. The first ground metal layer is a closest metal layer to the surface metal layer, and the second ground metal layer is farther from the surface metal layer than the first ground metal layer. The first ground via is coupled to a first end of the ground contact finger, the first ground metal layer, and the second ground metal layer. The second ground via is coupled to a second end of the ground contact finger and the second ground metal layer, but is not coupled to the first ground metal layer.

A process of manufacturing a multilayer circuit board includes patterning insulating substrates on which conductors are formed to provide a signal conductor, a first ground conductor, and a second ground conductor. The insulating substrates including the signal conductor, the first ground conductor, and the second ground conductor are stacked and thermally crimped to form a laminate. An interlayer connection conductor is formed on a surface of the laminate by a Laser Direct Structuring process.

An intrinsically safe mobile device having a form factor, speed, and functionality comparable to a conventional non-intrinsically safe mobile device, includes non-intrinsically safe electronic components mounted on an unprotected part of a printed circuit board (PCB) contained within the mobile device, the non-intrinsically safe electronic components are encapsulated to reduce risk of sparking and to minimize surface heating to enable the encapsulated electronic components to be certified as intrinsically safe, wherein the encapsulated electronic components are connected using a trace with intrinsically safe electronic components mounted on a protected part of the PCB and are connected with user interface components using FPC cabling, wherein the trace and the FPC cabling are certified as intrinsically safe using one or more protection techniques chosen from a resistor, a double MOSFET clamping circuit, a capacitor, a fuse, and maintaining a minimum clearance space.

A PCB underneath the display panel includes a plurality of insulation layers and one or more metal layers disposed between two adjacent insulation layers out of the plurality of insulation layers. A lower structure is disposed between the display panel and the PCB. At least a portion of a metal layer among the one or more metal layers that is most adjacent to the lower structure is exposed, and the lower structure is electrically connected to the exposed portion of the metal layer. Such exposed portion of the metal layer is electrically connected to the lower structure, so that the area where the PCB is referenced to the ground potential is increased. As a result, residual voltage, residual current in the PCB and noise caused by electromagnetic fields generated thereby can be reduced.

An electrical component may be mounted on a substrate such as a ceramic substrate. Contacts may be formed on upper and lower surfaces of the substrate. The electrical component may be soldered to the contacts on the upper surface. The contacts on the lower surface may be used to solder the substrate to a printed circuit. During manufacturing, it may be desirable to use metal traces on a ceramic panel to make connections to contacts on the substrate. Following singulation of the ceramic panel to form the ceramic substrate, some of the metal traces may run to the edge of the ceramic substrate. A folded tab of the printed circuit may form a shield that covers these exposed traces. A divided metal-coated groove or a row of divided metal-coated vias running along each edge of the substrate may also provide shielding.

A multilayer body includes insulator layers including a first insulator layer laminated in a vertical direction. Electrodes include a signal electrode and are provided at an upper main surface of the first insulator layer and arranged in a transverse direction. At least a portion of each of the electrodes is exposed to outside from a circuit board. First and second interlayer connection conductors extend through the first insulator layer in the vertical direction and electrically connect the signal electrode and a signal conductor layer. Mounting portions are located at the portions of the electrodes that are exposed to the outside from the circuit board. The first and second interlayer connection conductors are electrically connected to the signal electrode so as not to overlap the mounting portion that is provided at the signal electrode.

An electronic component includes: an insulating substrate including a first main surface and a second main surface opposite to each other in a thickness direction and a side surface with a plurality of ground electrodes exposed thereto; conductive films each covering a surface of a corresponding one of the plurality of ground electrodes exposed to the side surface of the insulating substrate; and a shielding film covering the first main surface and the side surface of the insulating substrate and surfaces of the conductive films. The plurality of ground electrodes includes a first ground electrode and a second ground electrode, the first ground electrode and the second ground electrode being exposed to the side surface of the insulating substrate at a position closest to the first main surface and at a position closest to the second main surface, respectively.

A camera module comprises: a first body including a lens; a second body coupled to the first body; and a printed circuit board arranged in the first body, wherein the first body includes a first ground portion protruding downward, and the second body includes a second ground portion protruding upward to contact the first ground portion.

An electronic device includes an antenna radiator, a printed circuit board, an antenna contact, and impedance circuitry. The printed circuit board includes a first PCB portion including at least one ground layer electrically connected to a ground of the electronic device, a second PCB portion electrically insulated from the at least one ground layer, an opening defined by a lateral side of an edge portion of the first PCB portion and a lateral side of an edge portion of the second PCB portion, and a conductive material, plated on the lateral side of the edge portion of the first PCB portion, and electrically connected to the at least one ground layer. The impedance circuitry is electrically connected to the at least one ground layer through the conductive material.