A printed circuit board (PCB) includes: an insulation substrate; a first pad on the insulation substrate; and a second pad on the insulation substrate and spaced apart from the first pad, wherein the second pad has a size substantially the same as a size of the first pad, wherein the first pad includes a first recess configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate.

A semiconductor device includes a substrate including a signal pad and a non-signal pad, a semiconductor housing portion including a signal pin and a first non-signal pin, and first bonding members configured to bond the signal pad and the signal pin and to bond the first non-signal pad and the first non-signal pin. The first non-signal pad and the first non-signal pin each have an L shape in a plan view.

A detection device is provided including first substrate including first region, second region and third region arranged in first direction, second region arranged between first and third regions; first detection electrode arranged on first substrate; second detection electrode arranged on first substrate and being adjacent to first detection electrode; first electrode coupled to first detection electrode and continuously formed from first to third regions; second electrode coupled to second detection electrode, and continuously formed from first to third regions, convex portions located between first electrode and second electrode in second region and spaced away from first and second electrodes; and protective layer formed on first and second electrodes in first region and not formed on first electrode and second electrode in third region, wherein at least one of convex portions is covered with protective layer, and at least another one of convex portions is not covered with protective layer.

A detection device is provided including first substrate including first region, second region and third region arranged in first direction, second region arranged between first and third regions; first detection electrode arranged on first substrate; second detection electrode arranged on first substrate and being adjacent to first detection electrode; first electrode coupled to first detection electrode and continuously formed from first to third regions; second electrode coupled to second detection electrode, and continuously formed from first to third regions, convex portions located between first electrode and second electrode in second region and spaced away from first and second electrodes; and protective layer formed on first and second electrodes in first region and not formed on first electrode and second electrode in third region, wherein at least one of convex portions is covered with protective layer, and at least another one of convex portions is not covered with protective layer.

An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

An electronic control device includes a conductive casing; a circuit board which is provided in the casing, and on which an electronic component including an integrated circuit is mounted; and a conductive conductor component that is provided on the circuit board, is disposed at a position higher than the electronic component, and has an elongated shape, in which a distance between the conductor component and the casing is shorter than a distance between the conductor component and the circuit board.

A board terminal electrode component includes a board, and a pair of land pads spaced apart from each other on a surface of the substrate. The pair of land pads respectively include inner ends which are proximal to each other in an arrangement direction, and outer ends farther from each other in the arrangement direction than the inner ends. The pair of land pads respectively include expanding width portions expanding in a width direction from the inner end toward the outer end. The pair of land pads respectively include insulators on a surface of an end portion of the outer end of the land pads.

The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.