A wiring substrate includes an insulating layer, and a conductor layer formed on the insulating layer and including a mesh-like conductor pattern and conductor pads such that the mesh-like conductor pattern has openings exposing the insulating layer and that the conductor pads are formed at substantially centers of selected ones or all of the openings respectively. The conductor layer is formed such that each of the openings has a polygonal shape, that gaps are formed between the conductor pads and the conductor pattern surrounding the conductor pads, and that each of the conductor pads has a curved outer edge.

Systems and methods for magnetic coupling. One system includes an external computing device and a connector having a conductive end. The system also includes a printed circuit board. The printed circuit board includes a connector side opposite a back side. The connector side has a contact pad with an aperture. The printed circuit board also includes a magnet positioned on the back side of the printed circuit board. The magnet provides a magnetic field configured to provide magnetic attraction forces to a connector contacting the contact pad. The printed circuit board also includes a communication terminal. The system also includes a circuit in communication with the printed circuit board through the connector and contact pad.

A conductive structure of a massage roller includes a working circuit board, a conductive base, a conductive plate, two first conductive parts and two second conductive parts. The working circuit board and the conductive plate are positioned at upper and lower ends of the conductive base respectively. The conductive base is provided with at least a pair of accommodating cavities, and conductors are placed in the accommodating cavities. The two first conductive parts are positioned on the bottom surface of the working circuit board, and the first conductive parts are connected with the working circuit board. The two second conductive parts are positioned on the top surface of the conductive plate, and the second conductive parts are connected with the conductive plate; and the top surfaces of the conductors abut against the two first conductive parts, and the bottom surfaces of the conductors abut against the two second conductive parts.

Provided are a nano-scale LED assembly and a method for manufacturing the same. First, a nano-scale LED device that is independently manufactured may be aligned and connected to two electrodes different from each other to solve a limitation in which a nano-scale LED device having a nano unit is coupled to two electrodes different from each other in a stand-up state. Also, since the LED device and the electrodes are disposed on the same plane, light extraction efficiency of the LED device may be improved. Furthermore, the number of nano-scale LED devices may be adjusted. Second, since the nano-scale LED device does not stand up to be three-dimensionally coupled to upper and lower electrodes, but lies to be coupled to two electrodes different from each other on the same plane, the light extraction efficiency may be very improved. Also, since a separate layer is formed on a surface of the LED device to prevent the LED device and the electrode from being electrically short-circuited, defects of the LED electrode assembly may be minimized. Also, in preparation for the occurrence of the very rare defects of the LED device, the plurality of LED devices may be connected to the electrode to maintain the original function of the nano-scale LED electrode assembly.

A downhole system including a gun string configured to be deployed into a wellbore, the gun string including plural gun assemblies. A detonator block attached to a given gun assembly of the plural gun assemblies. The detonator block includes a switch assembly. The switch assembly includes a communication unit (CU) configured to receive, from an external controller, a fire command to activate a detonator associated with the detonator block, a measuring unit configured to measure a parameter (V) at the switch assembly, and a computing core (CC) configured to locally make a decision whether to activate or not the detonator, after the fire command is received from the external controller, based on whether a voltage measured by the measuring unit at the switch assembly is larger or not than a threshold voltage.

A display device and a manufacturing method thereof are provided. The display device includes a display panel and a flexible circuit board electrically connected with the display panel. The flexible circuit board includes a first circuit board, a second circuit board and a conductive portion; the first circuit board includes a first substrate, and a main contact pad, a first wire and a second wire provided on the first substrate; the second circuit board includes a second substrate, a relay contact pad and a third wire provided on the second substrate; and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.

A switch assembly, which is part of a chain of switch assemblies, includes a communication unit (CU) configured to receive, from an external controller, a fire command to activate a detonator, a voltage measuring unit configured to locally measure a voltage (V) at the switch assembly after receiving the fire command to activate the detonator, a computing core (CC) configured to locally make a decision whether or not to activate the detonator, after receiving the fire command to activate the detonator and after measuring the voltage (V), based on whether or not the measured voltage (V) at the switch assembly is larger than a threshold value.

A display device and a manufacturing method thereof are provided. The display device includes a display panel (20) and a flexible circuit board electrically connected with the display panel (20). The flexible circuit board includes a first circuit board (11), a second circuit board (22) and a conductive portion; the first circuit board (11) includes a first substrate (100), and a main contact pad, a first wire (501) and a second wire (502) provided on the first substrate (100); the second circuit board (22) includes a second substrate (200), a relay contact pad and a third wire (210) provided on the second substrate (200); and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.

In an electric component embedded structure, a first electrode terminal provided on a first main surface includes an intra-area terminal, and the intra-area terminal is electrically connected to an overlap portion of an overlap wiring in a formation area of an electric component. Accordingly, a decrease in mounting area of the electric component embedded structure is achieved. The intra-area terminal can be electrically connected to a second electrode terminal provided on a second main surface via a first via-conductor, the overlap wiring, and a second via-conductor. The intra-area terminal is connected to a wiring (an overlap wiring) of a first insulating layer without additionally providing a rewiring layer causing an increase in thickness, and the increase in thickness is curbed, whereby a decrease in size of the electric component embedded structure is achieved.

A switch assembly, which is part of a chain of switch assemblies, includes a communication unit (CU) configured to receive, from an external controller, a fire command to activate a detonator, a voltage measuring unit configured to locally measure a voltage (V) at the switch assembly after receiving the fire command to activate the detonator, a computing core (CC) configured to locally make a decision whether or not to activate the detonator, after receiving the fire command to activate the detonator and after measuring the voltage (V), based on whether or not the measured voltage (V) at the switch assembly is larger than a threshold value.