Patent classifications
H05K2201/094
SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE, AND ELASTIC WAVE DEVICE
A substrate includes a substrate main body that includes a first main surface and a second main surface facing the first main surface. First electrode lands are disposed inside a recessed portion of the first main surface of the substrate main body. Second electrode lands are disposed in a region outside the recessed portion. The first electrode land and the second electrode land are connected to different electric potentials.
DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
A display panel includes: a display substrate including a display area and a pad area spaced apart from a side of the display area in a first direction; and first to (n)th signal pads (where n is an integer of 2 or more) in the pad area on the display substrate, extending in the first direction, and spaced apart from each other in a second direction perpendicular to the first direction, wherein a (k)th signal pad among the first to (n)th signal pads (where k is an integer between 1 and n) is between the first signal pad and the (n)th signal pad, wherein a length of each of (k)th to (n)th signal pads among the first to (n)th signal pads along the first direction gradually increases, and wherein a width of each of the (k)th to (n)th signal pads along the second direction gradually decreases.
ELECTRO-OPTICAL PANEL, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC DEVICE
An electro-optical panel including a display region includes a first terminal group including a plurality of first terminals arranged along a first side of a liquid crystal panel; and a second terminal group disposed between the first terminal group and the display region and including a plurality of second terminals arranged along the first side, in which the number of the plurality of second terminals is smaller than the number of the plurality of first terminals.
Flex on board anisotropic conductive adhesive interconnection
An apparatus includes a printed circuit board and a flexible printed circuit. A rigid structure component is on a first side of the printed circuit board. An interconnection interface is on a second side of the printed circuit board opposite to the rigid structure component and is configured to interconnect the flexible printed circuit and the printed circuit board. A conductive interconnection material is at the interconnection interface between the flexible printed circuit and the printed circuit board.
Single-row electrical wire structure
A single-row electrical wire structure includes a first circuit board and a wire assembly. A board-to-board connector is on the first circuit board. The first circuit board includes a first group of contacts arranged into a single row. A distance between center portions of adjacent two contacts of the first group of contacts forms a width. The wires assembly includes a plurality of high-speed signal pairs and at least one low-speed signal pair respectively connected to the first group of contacts. A first spacing between a contact in the first group of contacts corresponding to a first high-speed signal pair of the high-speed signal pairs and a contact in the first group of contacts corresponding to a second high-speed signal pair of the high-speed signal pairs adjacent to the first high-speed signal pair is at least equal to or greater than 2 times of the width.
Methods and systems for magnetic coupling
Systems and methods for magnetic coupling. One system includes an external computing device and a connector having a conductive end. The system also includes a printed circuit board. The printed circuit board includes a connector side opposite a back side. The connector side has a contact pad with an aperture. The printed circuit board also includes a magnet positioned on the back side of the printed circuit board. The magnet provides a magnetic field configured to provide magnetic attraction forces to a connector contacting the contact pad. The printed circuit board also includes a communication terminal. The system also includes a circuit in communication with the printed circuit board through the connector and contact pad.
DISPLAY APPARATUS
A display apparatus includes a display panel configured to display an image and including a first pad part, the first pad part including a plurality of first pads disposed at a first edge thereof, and a printed circuit board having an insertion hole in which at least a portion of the first edge of the first pad part is accommodated. The printed circuit board includes a plurality of first terminals disposed on an inner surface of the insertion hole to contact the plurality of first pads.
CONNECTOR ATTACHED MULTI-CONDUCTOR CABLE
A connector attached multi-conductor cable includes a multi-conductor cable and a connector, and the connector includes a circuit board including a first surface, a second surface, and a third surface provided at a tip in a direction of connector insertion to connect the first surface to the second surface. The circuit board includes a first group of pads including a plurality of first pads provided on the first surface and connected to central conductors of the electric wires; a second group of pads including a plurality of second pads provided on the first surface, arranged in a first direction parallel to the third surface, and connected to the first pads; a first ground layer provided between the first surface and the second surface, and extending in a second direction parallel to the first surface and perpendicular to the first direction; and a conductive member provided on a side apart from the first group of pads in the second direction with respect to the second group of pads, and connected to the first ground layer. The conductive member is positioned on the first surface side with respect to the first ground layer in a third direction perpendicular to the first surface.
Printed wiring board
A printed wiring board includes an insulation layer, conductive pads formed on the insulation layer and positioned to connect an electronic component, and a conductive wiring pattern including first and second conductive patterns and formed on the insulation layer such that the conductive wiring pattern is extending between the conductive pads. The first pattern includes first wiring lines, the second pattern includes second wiring lines, the first and second conductive patterns are formed such that the first wiring lines and the second wiring lines are alternately arrayed on the insulation layer, each of the first wiring lines includes a first metal layer formed on an interface with the insulation layer, each of the second wiring lines includes a second metal layer formed on an interface with the insulation layer, and the first metal layer includes a metal material which is different from a metal material forming the second metal layer.
PRINTED WIRING BOARD
A printed wiring board includes an insulating sheet, a conductive layer formed on one main surface of the insulating sheet, and an insulating film laminated with an adhesive layer on the main surface of the insulating sheet formed with the conductive layer. The position of an end part of the insulating film is located outside the position of an end part of the adhesive layer.