The present disclosure relates to a chip, a circuit board and an electronic device. The chip includes a chip substrate and a plurality of pads arrayed on the chip substrate. At least one of the plurality of pads on the chip is a polygonal pad.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

Disclosed is an apparatus and methods for making same. The apparatus includes a substrate, a set of electrical contacts disposed on the surface of the substrate, and an electromagnetic interference (EMI) shield pedestal structure, disposed between an outer periphery of the set of electrical contacts and an outer portion of the substrate.

An electronic device includes display layers such as liquid crystal display layers and a backlight unit that provides illumination for the display layers. The backlight unit includes light-emitting diodes that emit light into the edge of a light guide film. To minimize the inactive area of the display, the light-emitting diodes are tightly spaced to approximate a line light source instead of point light sources. Color and/or luminance compensation layers are incorporated at various locations within the backlight structures to ensure that the backlight provided to the display layers is homogenous. A thin-film transistor layer of the display is coupled to a printed circuit board by a flexible printed circuit. The flexible printed circuit has additional solder mask layers to improve robustness, encapsulation, and traces with a varying pitch.

A printed circuit board includes a circuit board body and a solder pad row disposed on a back of the circuit board body. The solder pad row includes a solder thief pad and a plurality of circular pin solder pads. An outline of an edge, on the solder thief pad proximate to the pin solder pads is an arc that is concave toward the solder thief pad.

A display device includes a display panel including a plurality of display pads, a portion of the plurality of display pads being extended along a first direction and arranged along a second direction intersecting the first direction, and a flexible circuit board including a plurality of substrate pads electrically connected to the plurality of display pads, and a plurality of dummy pads spaced apart from the plurality of substrate pads and arranged in parallel to the plurality of substrate pads along the second direction, a portion of the plurality of dummy pads have an extension length in the first direction and a width in the second direction substantially same as an extension length in the first direction and a width in the second direction, respectively, of the plurality of substrate pads.

A Printed Circuit Board (PCB) includes a via extending through at least one layer of the PCB. The PCB may also include a first catch pad connected to the via and located within a first metal layer of the PCB. The first catch pad may have a first size. The PCB may further include a second catch pad connected to the via and located within a second metal layer of the PCB. The second catch pad may have a second size greater than the first size. The second catch pad may overlap horizontally with a portion of a metallic feature in the first metal layer to obstruct light incident on a first side of the PCB from transmission to a second side of the PCB through a region of dielectric material near the via.

An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.

A connector attached multi-conductor cable includes a multi-conductor cable and a connector that includes a circuit board including first to third surfaces. The circuit board includes first pads provided on the first surface and connected to central conductors of wires; second pads provided on the first surface, arranged in a first direction parallel to the third surface, and connected to the first pads; a first ground layer provided between the first and second surfaces, and extending in a second direction parallel to the first surface and perpendicular to the first direction; and a conductive member provided apart from the first pads in the second direction with respect to the second pads, and connected to the first ground layer. The conductive member is positioned on the first surface side with respect to the first ground layer in a third direction perpendicular to the first surface.

An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.