A memory module includes a printed circuit board (PCB) including a multi-layer having a wiring structure formed therein. A length of the PCB in a first direction is longer than a length of the PCB in a second direction perpendicular to the first direction. A plurality of memory chips includes a plurality of solder balls. The plurality of memory chips is arranged in a first row and a second row respectively extending in the first direction on the PCB. The plurality of solder balls is continuously arranged in the first direction. The wiring structure alternately zigzag-connects the plurality of memory chips arranged in the first row and the second row.

A wiring substrate includes an insulating layer, a conductor layer formed on a surface of the insulating layer such that the conductor layer includes a conductor pad, and a solder resist layer formed on the surface of the insulating layer such that the solder resist layer is covering the conductor layer and having an opening exposing the conductor pad. The conductor pad of the conductor layer has a substantially rectangular planar shape such that the conductor pads has a main surface, a pair of long sides, a pair of short sides and four corner portions, and the solder resist layer is formed such that the opening is exposing side surfaces at the long sides and 50% or more of the main surface and that the solder resist layer is covering side surfaces at the short sides.

An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.

Methods and apparatus relating to a high density cable structure and wire termination are described. In one embodiment, a plug structure includes a paddle card to couple two wires to two gold fingers and a first add-on plug to couple a first wire to a first gold finger. The paddle card and the first add-on plug are to be stacked to form a single plug structure having a first row of gold fingers and a second row of gold fingers. Other embodiments are also claimed and disclosed.

An electro-optical panel including a display region includes a first terminal group including a plurality of first terminals arranged along a first side of a liquid crystal panel; and a second terminal group disposed between the first terminal group and the display region and including a plurality of second terminals arranged along the first side, in which the number of the plurality of second terminals is smaller than the number of the plurality of first terminals.

A display device including a display panel including a base layer, a circuit layer disposed on the base layer, and a pad part having a plurality of pads disposed on the base layer; and a driving chip disposed on the pad part and including a plurality of chip pads. The plurality of pads include a first pad having a smaller area than a corresponding chip pad among the plurality of chip pads and a second pad electrically connected to the circuit layer.

A base member includes a via having a first hole and a second hole. When viewed from a direction in which a base surface extends, the first hole and the second hole have shapes becoming wider as getting closer to a first surface and a second surface of the base surface from a portion at which a lower end of the first hole and an upper end of the second hole are in contact with each other. When the first hole and the second hole are viewed from the direction in which the base surface extends, a smaller angle of angles formed by a generatrix of the first hole and a generatrix of the second hole is smaller in a thin region of the base member than in a thick region of the base member.

A disk device according to one embodiment includes a recording medium, a magnetic head, a wiring member, and a flexible printed circuit board. The magnetic head is configured to read/write information from/to the recording medium. The wiring member includes a plurality of first terminals, and a plurality of first wires that electrically connect the magnetic head to the first terminals. The flexible printed circuit board includes a surface, a plurality of second terminals located on the surface to be connected to the first terminals by means of a conductive adhesive, and a ground plane spaced apart from the second terminals in a direction along the surface.

In accordance with various embodiments, lighting systems features multiple inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels features one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals.

A light source unit for a display device includes: a printed circuit board including a soldering pad located on a substrate of glass and including a copper layer, and a first diffusing barrier pattern located on the soldering pad and including a molybdenum alloy; and a light emitting diode mounted on the soldering pad through a solder resist. In one embodiment, the printed circuit board is a glass printed circuit board.