A display panel includes: a display substrate having a display area, and a pad area disposed on at least one side of thereof; and a plurality of pad groups arranged on the pad area in a first direction and including: a first pad group having a plurality of first pads, at least some of the plurality of first pads have a first inclination with respect to a reference line extending in a second direction different from the first direction, and the plurality of first pads being spaced from each other at a first pitch; and a second pad group having a plurality of second pads, at least some of the plurality of second pads having a different second inclination with respect to the reference line, and the plurality of second pads being spaced from each other at a second pitch different from the first pitch.

A wiring board includes a substrate, a connector on the substrate, and at least one monolithic ceramic capacitor including a pair of electrodes and mounted at a mounting angle on the substrate. The connector has an insertion-removal position at which a stress starts in insertion and removal of a counterpart connector into and from the connector. When a first line segment connects centers of the electrodes in a plan view, and a second line segment connects a center of the insertion-removal position and a center of the first line segment in the plan view, the mounting angle is an angle between the first line segment and the second line segment and is from 0 to 90 degrees. The mounting angle is from 0 to 5 degrees or from 85 to 90 degrees in an area within 10 mm from a periphery of the connector on the substrate.

A medical circuit board includes a substrate on which a wiring pattern is formed, a plurality of electronic components mounted in a mounting area on the substrate, a resinous sealing member covering the plurality of electronic components, with which the plurality of electronic components are sealed to the substrate, and a detection unit provided in an area other than the mounting area on the substrate and detecting an infiltration of a liquid from an interface between the substrate and the sealing member into the mounting area. At least a part of the detection unit is covered with the sealing member and sealed with the sealing member to the substrate.

Systems and methods are provided for reducing crosstalk between differential signals in a printed circuit board (PCB) using fine pitch vias. A pair of contact pads are on the top surface of the PCB and configured to couple a PCB component to the PCB, the contacts a first distance from each other. A first via of a plurality of vias is electrically coupled to a first contact of the pair of contacts and a second via is electrically coupled to a second contact, the first via and second via a second distance from each other, the second distance being less than current standards for minimum via pitch. Each via comprises a via pad on the top surface and a plated through-hole extending from the top surface to a termination point. A separator gap is between the first via and the second via.

A substrate connection structure includes a wiring substrate, a base having an insulating property, a first terminal portion, and a second. terminal portion, in which a plurality of first terminal portions are disposed side by side in a first array direction, and extend by being inclined relative to the first array direction so that extended lines of the first terminal portions in an extension direction cross at a first intersection, a plurality of second terminal portions are disposed side by side in a second array direction, and extend by being inclined relative to the second array direction so that extended lines of the second terminal portions in an extension direction cross at a second intersection, and a first intersection direction directed from a first. center position to the first intersection and a second intersection direction directed from a second center portion to the second intersection are forward directions.

A relay circuit board includes: a plurality of first pads arranged in parallel in a first direction; a plurality of second pads arranged in parallel in a second direction; and wirings connecting the plurality of first pads and the plurality of second pads, respectively.

The second direction is inclined at a predetermined angle with respect to the first direction, and the predetermined angle is greater than 0 degree and smaller than 90 degrees.

A battery, for example, a rechargeable battery (e.g. lithium ion battery) having a casing with battery terminals. The casing, for example, includes an upper section, middle section, and lower section connected together. The battery can be connected to one or more battery trays having the same height or different heights for various applications.

A manufacturing method for a circuit board in which a pin inserted in a through-hole of a land is welded to the land is disclosed. The land is covered with a white layer, and an irradiation angle of a laser beam with respect to the circuit board is adjusted so that reflected light of the laser beam emitted to the pin reaches the white layer on the land. As the reflected light of the laser beam is allowed to reach a white region provided on the land, the reflected light is scattered on the white region. A rate of absorption of the laser beam by the land is decreased, and a temperature increase of the land is restrained. As a result, a damage of an insulating part around the land is restrained.

A non-rectangular connection pad for coupling discrete components to connection pads reduces the capacitance in the connection pad area, and thus maintains a more uniform characteristic impedance along the length of the trace. The pad shape is changed to reduce the area of the pad. The reduced area reduces or eliminates change in characteristic impedance of the trace incorporating the connection pad and discrete component attached to the connection pad. An irregular pad shape may be used to decrease the soldering area of the discrete component, while still maintaining wettability of the solder. One example of such a non-rectangular connection pad is a C-shaped connection pad. Such connection pad shapes can be used on traces for high-speed circuits (e.g., PCIe, USB, SATA, and other traces carrying signals above 1 GHz).

A control unit that controls a motor includes a semiconductor device, the semiconductor device includes a semiconductor package including a plurality of first electrodes, a wiring board including a plurality of second electrodes arranged so as to correspond to each of the plurality of first electrodes, and solder joints connecting the plurality of first electrodes and the plurality of second electrodes, and a tip end of a second electrode arranged at an outermost corner of the wiring board is located outside an outer peripheral end of the semiconductor package.