A display device is provided and includes a display panel including a display area that displays an image and a pad area disposed at least at a side of the display area, and a flexible circuit film electrically connected to the pad area. The flexible circuit film includes connection pads, a first measurement pad, and a second measurement pad. The connection pads are arrayed in a first direction and inclined with respect to a reference line extending in a second direction different from the first direction, the first measurement pad is disposed adjacent to a first side of the connection pads, and the second measurement pad is disposed adjacent to a second side of the connection pads. The connection pads are between the first measurement pad and the second measurement pad.

A display apparatus includes a printed circuit board including first to fourth output pad regions and a flexible circuit board having a first end connected to a display panel and a second end connected to the printed circuit board. The first output pad region includes a 1.sup.st-1.sup.st output pad group and a 1.sup.st-2.sup.nd output pad group, the second output pad region includes a 2.sup.nd-1.sup.st output pad group and a 2.sup.nd-2.sup.nd output pad group, the fourth output pad region includes a 4.sup.th- 1.sup.st output pad group and a 4.sup.th-2.sup.nd output pad group, and the printed circuit board includes a first input terminal electrically connected to the 1.sup.st-1.sup.st output pad group, a second input terminal electrically connected to the 2.sup.nd-2.sup.nd output pad group, a third input terminal electrically connected to the first input terminal, and a fourth input terminal electrically connected to the 4.sup.th-2.sup.nd output pad group.

A mounting structure of an electronic component includes a multilayer ceramic capacitor including lands on a board and spaced apart from each other, solder on the lands, and a component main body including external electrodes on both end portions of the component main body in a length direction, each of the pair of external electrodes being connected to a corresponding one of the pair of lands via the solder. When a separation direction of the lands is an X direction and a direction orthogonal or substantially orthogonal to the X direction is a Y direction, when a width dimension of the land along the Y direction is c, a dimension of each of the external electrodes in the X direction is e, and a gap between the land and the external electrode is Gap, 3.4<(c×e)/Gap<258.8 is satisfied.

A display device includes a display panel including a plurality of display pads at least some of which at least a portion extend in a first direction and are arranged in a second direction intersecting the first direction, and a flexible circuit board including circuit pads, at least some of which at are electrically connected to the display pads, and circuit lines connected to the circuit pads. The circuit pads include at least one dummy pad, and the circuit lines include a dummy circuit line, of which at least a portion of is connected to the at least one dummy pad. The dummy circuit line includes a first portion connected to the at least one dummy pad and a second portion spaced apart from the first portion by a gap.

An electronic device is provided, including a working area and a peripheral area. The peripheral area is adjacent to the working area. The peripheral area includes a bonding area. The bonding area includes a first bonding pad area. The first bonding pad area includes a plurality of first bonding pads. A part of the first bonding pads are arranged along a first direction, and another part of the first bonding pads are arranged along a second direction. There is an included angle between the first direction and the second direction, and the included angle is greater than 0 degrees and less than 90 degrees.

A pad arranging method and a pad arrangement structure for a wire bonding of a chip is provided. The method includes following steps. A soldered component and a circuit board are provided. A plurality of pads is arranged on the circuit board. a number of the pads is corresponding to a number of a plurality pins of the soldered component. The pads are disposed in a plurality of rows toward or away from the soldered component according to a predetermined arranging position, and the number of the pads on one of the rows at outer side is equal to that on one of the rows at inner side, or greater than that on one of the rows at inner side by one or more than one

An electrical contact pad for electrically contacting a connector includes a first region having a first length in a longitudinal direction, and a second region having a second length in the longitudinal direction that is greater than the first length. The first region is arranged to contact a first arm of the connector and the second region is arranged to contact a second arm of the connector. The first length being smaller than the second length results in an increase in the impedance of the electrical contact pad as compared to typical contact pads which tend to correspond to low impedance regions.

The present disclosure provides a display substrate, a chip-on-film, a display apparatus and methods for manufacturing them. The display apparatus includes: a base substrate; a bonding structure disposed on the base substrate; and a chip-on-film COF, wherein the COF and a side of the bonding structure that is away from the base substrate are clamped with each other, and the COF is bonded to the side of the bonding structure that is away from the base substrate; wherein when the COF and the bonding structure are bonded, the COF contacts both a first surface and a second surface of the bonding structure at the side of the bonding structure that is away from the base substrate, wherein the first surface is parallel to the base substrate, and the second surface is at an angle with the first surface.

The present application provides a flexible display panel including a flexible substrate and a flexible circuit board electrically connected to the flexible substrate. Pins on the flexible substrate and the flexible circuit board are disposed to be inclined at a certain angle. When pitches of the pins on the flexible circuit board are changed due to expansion and contraction of the flexible circuit board itself, an accurate alignment of the pins on the flexible substrate and the flexible circuit board can be realized by adjusting the position of the flexible circuit board relative to the flexible substrate before connecting the flexible circuit board to the flexible substrate, thereby ensuring the quality of the flexible display panel and improving product yield of the display panel.

A wiring board manufacturing method includes forming a conductor pattern within a waste board section of a wiring board including a product section and the waste board section, the conductor pattern in which a plurality of polygonal lands made of a conductor are arranged along a first direction and a second direction crossing the first direction, each of the plurality of polygonal lands making contact with an adjacent one of the plurality of polygonal lands at each apex of the plurality of polygonal lands; and selectively removing the conductor at the apex of at least part of the plurality of polygonal lands.