An electrical connector includes an insulative housing forming plural rows of passageways wherein each row of passageways extends along a transverse direction while the plural rows are spaced from one another in a front-to-back direction perpendicular to the transverse direction. Each passageway is dimension to receive a unified contact having three sets of spring arms spaced from one another in the transverse direction. The three sets of spring arms are categorized with two outer sets and one inner set therebetween in the transverse direction. The pitch between the two neighboring sets of spring arms of each unified contact is essentially one half of the distance between one outer set of spring arms of one unified contact and another outer set of spring arms of the neighboring unified contact.

An electronic device and an electromagnetic shielding frame are provided. The electromagnetic shielding frame includes a ring-shaped portion and a plurality of soldering tabs that extend from the ring-shaped portion along a protruding direction. The soldering tabs are spaced apart from each other and are in a ring-shaped arrangement. At least one of the soldering tabs has a patterned slot layout so as to be defined as a patterned tab. A portion of the patterned slot layout of the patterned tab arranged away from the ring-shaped portion has a layout distance. The patterned slot layout is arranged along a first direction and a second direction. The first direction and the protruding direction have a first angle therebetween that is smaller than 90 degrees, and the second direction and the protruding direction have a second angle therebetween that is smaller than 90 degrees.

A display panel includes: a display substrate having a display area, and a pad area disposed on at least one side of thereof; and a plurality of pad groups arranged on the pad area in a first direction and including: a first pad group having a plurality of first pads, at least some of the plurality of first pads have a first inclination with respect to a reference line extending in a second direction different from the first direction, and the plurality of first pads being spaced from each other at a first pitch; and a second pad group having a plurality of second pads, at least some of the plurality of second pads having a different second inclination with respect to the reference line, and the plurality of second pads being spaced from each other at a second pitch different from the first pitch.

A wiring substrate has a substrate body formed by a single or a plurality of insulating layers and having front and back surfaces located at opposite sides of the substrate body; a plurality of pads formed on at least one of the front surface, the back surface and an inner layer surface that is located between the front and back surfaces, and having a staggered arrangement in plan view; and a plurality of via conductors formed at each of the pads, extending in a thickness direction of the substrate body with the plurality of via conductors being parallel to each other and connecting the pads located on different surfaces. Arrangement, in plan view, of the plurality of via conductors connecting to the pad and arrangement, in plan view, of the plurality of via conductors connecting to an adjacent pad located on the same surface are different from each other.

A flexible assembly for a display device and the display device are provided. The flexible assembly includes a flexible substrate, and a first output pad, a second output pad, a third output pad and a fourth output pad that are arranged on the substrate. The first output pad, the second output pad, the third output pad and the fourth output pad are sequentially arranged along a first direction and are spaced apart from each other. A pitch is between each output pad and an adjacent output pad, and the pitch is a sum of a spacing distance between each output pad and the adjacent output pad and a width of the adjacent output pad in the first direction. The pitch between the first output pad and the adjacent second output pad is smaller than the pitch between the third output pad and the adjacent fourth output pad.

A wiring board includes a substrate and a plurality of monolithic ceramic capacitors connected in series on the substrate. The plurality of monolithic ceramic capacitors includes a first monolithic ceramic capacitor oriented in a first direction and a second monolithic ceramic capacitor oriented in a second direction. The second direction is at an angle of 45±5 degrees relative to the first direction.

Disclosed are film packages and methods of fabricating package modules. The film package includes a film substrate that includes a chip region and a peripheral region facing each other in a first direction, a plurality of output pads that are arranged in the first direction on the chip region and on the peripheral region, and a semiconductor chip on the chip region and electrically connected to the output pads. The output pads on the chip region are arranged at regular first intervals along the first direction. The output pads include a plurality of first output pads that are arranged at a first pitch along the first direction on the chip region and a plurality of second output pads on the peripheral region. The second output pads are arranged at a second pitch greater than the first pitch of the first output pads.

Surface mount device (SMD) placement to control a signal path in a printed circuit board (PCB), including: adding, to a PCB, a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and coupling, via a discrete SMD, the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments.