A method is disclosed for mounting and cooling a circuit component having aplurality of contacts. The method comprises mounting the circuit component on a rigid substrate of a thermally conductive and electrically insulating material with a circuit board arranged between the circuit component and the substrate. The circuit board, which has a flexible base and carries conductive traces that terminate in contact pads, is secured to the rigid substrate with at least some of the contact pads on the circuit board disposed on the side of the circuit board facing the rigid substrate, at least some of the latter contact pads being bonded to the substrate. To establish both an electrical and a thermal connection between the contacts of the circuit component and the contact pads bonded to the substrate, blind holes are formed in the flexible base of the circuit board, each hole terminating at a respective one of the contact pads bonded to the substrate. The side of the contact pads exposed by the holes is plated to form conductive vias that fill the holes and that are soldered to the contacts of the circuit component.

Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

An electro-optical panel including a display region includes a first terminal group including a plurality of first terminals arranged along a first side of a liquid crystal panel; and a second terminal group disposed between the first terminal group and the display region and including a plurality of second terminals arranged along the first side, in which the number of the plurality of second terminals is smaller than the number of the plurality of first terminals.

Provided is a double-sided plastic package power supply product, including a PCB, a plastic package body, electric contacts and pins, wherein the electric contact is connected to the pin and the PCB; the pin includes a plastic body and a metal body; the metal body is embedded in the plastic body; the plastic body is used to limit the metal body; and one end of the metal body is connected to the electric contact, and the other end of the metal body is used as a plug pin. A metal terminal is connected to a PCB substrate and wrapped in the plastic package body, and the surface of the portions of the metal terminal that protrude from the PCB substrate can be exposed on the surface of the product by means of cutting or thinning so as to form the electric contacts.

In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.

Provided is a display device including a display panel including a plurality of first pads, and a plurality of second pads spaced apart from the first pads, a first circuit board including first circuit pads respectively bonded to the first pads, a first driving chip electrically connected to the first circuit pads, and a first heat radiation member, and a second circuit board including second circuit pads respectively bonded to the second pads, and a second driving chip electrically connected to the second circuit pads, wherein the first heat radiation member overlaps the first driving chip and the second driving chip.

A control circuit board includes first and second elements on each surface of a board member. The first and the second elements respectively have first and third edge portions, which are opposite to each other and second and fourth edge portions which are opposite to each other. A plurality of signal input pins are provided to the first edge portion, a plurality of signal output pins are provided to the third edge portion, a plurality of between-element communication input pins are provided to the second edge portion, and a plurality of between-element communication output pins are provided to the fourth edge portion, respectively. A common signal is input to the first and second elements and a communication is performed between the first element and the second element. Loss of control function can be surely prevented while suppressing enlargement of the board and increase of development/production cost.

An electro-optical panel including a display region includes a first terminal group including a plurality of first terminals arranged along a first side of a liquid crystal panel; and a second terminal group disposed between the first terminal group and the display region and including a plurality of second terminals arranged along the first side, in which the number of the plurality of second terminals is smaller than the number of the plurality of first terminals.

Provided is a master printed circuit board (PCB). The master PCB includes panels defined by grooves cut in the master PCB, the grooves separating one panel from another. A final PCB is formable via use of one or more jumpers, wherein the jumpers are configured to extend across at least one of the grooves to electrically connect one panel to another panel. The electrically connected panels form the final PCB.

Provided is a display device including a display panel including a plurality of first pads, and a plurality of second pads spaced apart from the first pads, a first circuit board including first circuit pads respectively bonded to the first pads, a first driving chip electrically connected to the first circuit pads, and a first heat radiation member, and a second circuit board including second circuit pads respectively bonded to the second pads, and a second driving chip electrically connected to the second circuit pads, wherein the first heat radiation member overlaps the first driving chip and the second driving chip.