A memory card includes a substrate, first row terminals and second row terminals. The substrate has a first pair of side edges extending in a first direction and a second pair of side edges extending in a second direction perpendicular to the first direction. The first row terminals are arranged adjacent to an insertion side edge of the substrate, the first row terminals including a first power terminal, the insertion side edge being one of the first pair of side edges. The second row terminals are arranged further from the insertion side edge than the first row terminals, the second row terminals including a second power terminal. At least one recessed terminal among the first and second row terminals includes a recess area in an exposed surface of the at least one terminal.

The present disclosure relates to optical systems and methods of their manufacture. An example system includes a printed circuit board assembly (PCBA) and an image sensor package coupled to the PCBA by way of a plurality of bond members. The system additionally includes a sensor holder coupled to the PCBA. The image sensor package and the sensor holder are coupled to the PCBA so as to minimize thermally-induced stresses in at least one of: the plurality of bond members, the PCBA, the sensor holder, or the image sensor package.

A method for controlling a target switch assembly in a chain of switch assemblies includes distributing the chain of switch assemblies in a wellbore; placing a controller at a head of the wellbore; making a first decision, at the controller, to actuate a corresponding detonator of the target switch assembly; transmitting, from the controller to the target switch assembly, a fire command to activate the corresponding detonator; and making a second decision, locally, at the target switch assembly, to activate the detonator, after the fire command from the controller is received.

A flexible circuit board is provided. The flexible circuit board includes a base film with an outer lead region defined on either one surface or the other surface and an outer lead provided in the outer lead region and connected to an electronic device, in which the outer lead includes a plurality of first outer leads and a plurality of second outer leads formed to be spaced apart from each other so as to face each other in the outer lead region, and in which the number of the plurality of first outer leads is greater than the number of the plurality of second outer leads.

A connector for clothing includes a first substrate and a first connector being mounted on the first substrate. The first connector includes a first conductive metallic case with a first bottom portion surrounded by an annular first side portion. At least two first wire through holes are configured to the first side portion. A first wire module including at least three first wires and at least one ground wire is configured to the first connector. Three first wires are passed through one of the first wire through hole and the ground wire is electrically connected with a surface of the first case. A first circular board is configured inside but insulated from the first case. At least three first electric junctions are electrically attached on a surface of the first circular board and each first wire is electrically connected with each first electric junction.

An interposer includes a stacked body including first and second mounting surfaces that face each other, a first electrode on the first mounting surface, and a second electrode on the second mounting surface. The stacked body includes flexible insulating layers stacked on each other, and a folded portion. The first and second electrodes are electrically connected to each other. The stacked body includes an upright portion between the first and second mounting surfaces and in which a stacking direction in which the insulating layers are stacked is parallel to the first and second mounting surfaces, and a bent portion bent in a plan view of the first and second mounting surfaces.

A circuit board pad resonance control system includes a board. A signal transmission line is included on the board. A plurality of connector pads are positioned on the board. A first connector pad receives the signal transmission line adjacent a first end of that connector pad. The first connector pad includes a mounting surface that mounts directly to a coupling element that is configured to couple a subsystem to the board, and reduces a resonance that is produced by an open portion of a signal transmission path that is created when the coupling element is directly mounted to the mounting surface of the first connector pad in a first orientation. In a specific example, the mounting surface may include a plurality of protrusions, a plated surface, and/or a mask that reduces the conductivity of the connector pad which reduces signal integrity issues due to resonance.

A downhole system includes a controller located at the surface, a gun string located in a wellbore, the gun string including plural gun assemblies, a thru-line connecting the controller to the gun string, and a detonator block attached to a given gun assembly. The detonator block includes an addressable switch assembly. The gun assembly includes an end plate mechanism that electrically connects to the detonator block. The detonator block has at least one spring-loaded contact connected to the thru-line and the end plate mechanism includes a round electrical contact made as a printed circuit board, and the spring-loaded contact touches the printed circuit board.

Disclosed is a display device which is capable of preventing an encapsulation film from being formed in a scribing line, and a method for manufacturing the same. The display device includes a substrate having a display area provided with pixels, a non-display area surrounding the display area, an encapsulation film including an inorganic film which covers the display area, and a buffer layer. The buffer layer is provided at a predetermined interval from the display area in the non-display area and is brought into contact with the edge of the inorganic film.

A plug connector assembly includes: a plug connector having a cage, and a PCB received in the cage, the PCB including a mating end for being mated with a mating connector and an opposite connecting end, the connecting end comprising a first row of pads and a second row of pads disposed at one side of the PCB; at least one cable electrically connected to the connecting end, the at least one cable comprising a number of core wires, the core wires comprising a first group of core wires and a second group of core wires extending beyond the first group of core wires, the first group of core wires soldered to the first row of pads, the second group of core wires soldered to the second row of pads; and an insulative member isolating a soldering area of the first and second group of core wires.