A wiring board includes: first and second insulating layers; a first wiring conductor layer located between the first and second insulating layers and including a first via land; a second wiring conductor layer located on the second insulating layer and including a second via land; a via hole penetrating from the upper to lower surfaces of the second insulating layer; and a via conductor located in the via hole and electrically connecting the first second via lands. The via conductor is located on the inner surface of the via hole and on the first via land via a first base layer containing nichrome and a second base layer located on the upper surface of the first base layer and containing the same metal as the via conductor. An alloy layer containing tin and nichrome is located between the first via land and the first base layer.

A printed board includes a main printed board, and a flexible printed board fixed to the main printed board. The flexible printed board includes a box part formed in a box shape whose main printed board side is opened and a fixed part extended to an outer side and fixed to the main printed board. The flexible printed board is formed with a plurality of tamper detection patterns for detecting at least one of disconnection of the tamper detection pattern itself and a short circuit with other tamper detection pattern. An internal land of the tamper detection pattern is connected with the main printed board and is disposed on an inner side of the box part, an external land of the tamper detection pattern is formed in the fixed part and is fixed to and connected with the main printed board, and the external lands are insulated from each other.

Disclosed is a printed circuit board (PCB) having backdrill reliability anchors comprising nonfunctional pads to provide mechanical reinforcement for signal pads on backdrilled plated through hole (PTH) vias, as well as associated method and machine readable storage medium.

A wiring board includes a glass substrate having first and second surfaces and provided with through-holes; a first conductor layer including a first copper layer facing the first surface and a hydrofluoric acid resistant metal layer interposed between them, and covering openings of the through-holes on the first surface side, the first conductor layer having recesses at positions of the through-holes in a surface on the glass substrate side, each recess having an opening with a contour wider than and surrounding the opening of the corresponding through-hole on the first surface side; and a second conductor layer including an adhesion layer covering the side walls of the through-holes, inner surfaces of the recesses, and regions of the second surface surrounding the openings of the through-holes on the second surface side, a seed layer provided on the adhesion layer, and a second copper layer provided on the seed layer.

A wiring substrate includes: a glass substrate, a conductor layer and an insulator. The glass substrate has a first surface and a second surface serving as a back surface of the first surface and is provided with one or more through holes each extending from the first surface to the second surface. The conductor layer is provided on a side wall of each of the one or more through holes and the second surface. The insulator is provided on an inside of each of the one or more through holes. A surface roughness of the conductor layer provided on the side wall of each of the one or more through holes is larger than a surface roughness of the conductor layer provided on the second surface.

A wiring board according to the present disclosure has a layered structure in which a plurality of insulation layers and a plurality of electrical conductor layers are alternately layered. The plurality of electrical conductor layers include a first signal wire. The first signal wire includes a first electrode, a second electrode, a protruding portion, a wire-shaped electrical conductor having a first end and a second end, a third electrode, a first via-hole electrical conductor, a second via-hole electrical conductor, and a third via-hole electrical conductor. The first electrode and the third electrode are connected by a first wiring pattern including the first via-hole electrical conductor. The protruding portion and the first end of the wire-shaped electrical conductor are connected by the second via-hole electrical conductor. The second end of the wire-shaped electrical conductor and the second electrode are connected by the third via-hole electrical conductor.

A wiring substrate includes a conductor layer including a via land, a conductor film formed on the via land of the conductor layer, an insulating layer covering the conductor layer and the conductor film formed on the via land, and a via conductor formed in the insulating layer such that the via conductor is penetrating through the insulating layer and is connecting to the via land via the conductor film. A ratio of the shortest distance between an upper surface of the conductor film and an end surface of the via conductor on the opposite side with respect to an end surface connected to the conductor film to the shortest distance between an upper surface of the via land and the end surface of the via conductor on the opposite side with respect to the end surface connected to the conductor film is in the range of 0.4 to 0.7.

A method for manufacturing a printed wiring board includes forming a resin insulating layer on a first conductor layer, forming a protective film on a surface of the insulating layer, forming an opening through the film and the resin insulating layer, removing the film, treating the surface of the insulating layer, forming a second conductor layer on the surface of the resin insulating layer, and forming a via conductor connecting the first and second conductor layers. The insulating layer includes resin and inorganic particles including first and second particles. The surface of the insulating layer includes a surface of the resin and substantially flat exposed portions of the first particles, and the forming the second conductor layer includes forming a seed layer by sputtering, forming a plating resist using DI exposure, forming an electrolytic plating layer, removing the resist, and removing the seed layer exposed from the electrolytic plating layer.

A laminated substrate includes multilayer substrates stacked, wherein the multilayer substrates are each provided with a through hole which penetrates the multilayer substrates, an inner wall surface of which is plated, and which is filled with resin, and bonding lands formed on upper and lower surfaces of the through hole and electrically coupled to the through hole, an insulating adhesive layer and a conductive paste via for electrically coupling the bonding lands of the multilayer substrates opposed to each other with a conductive paste with which a through hole formed in the insulating adhesive layer is filled are disposed between the multilayer substrates, and the conductive paste via is disposed at a position different from a position at which the through hole is formed.