This application provides an electronic device. The electronic device comprises a first component, a second component and a circuit board. The circuit board includes a main board, a first type of solder pad, and a second type of solder pad. Both the first type of solder pad and the second type of solder pad are formed on a surface of the main board, and are electrically connected to the main board. The first type of solder pad includes a first solder pad and a first common solder pad, and the second type of solder pad includes a second solder pad and the first common solder pad. The first solder pad and the first common solder pad are configured to be simultaneously connected to the first component, and the second solder pad and the first common solder pad are configured to be simultaneously connected to the second component.

A printed board includes a plurality of through holes including a first through hole and a second through hole are arranged adjacently in an arrangement direction, a plurality of lands disposed corresponding to the plurality of through holds, and one through fourth pads. The plurality of lands includes a first land corresponding to the first through hole and a second land corresponding to the second through hole. The first land is provided with a first land portion electrically connected to the first pad, and a second land portion electrically connected to the second pad and not electrically connected to the first land portion. The second land is provided with a third land portion electrically connected to the third pad, and a fourth land portion electrically connected to the fourth pad and not electrically connected to the third land portion.