According to various examples, a device is described. The device may include a printed circuit board. The device may also include a first recess in the printed circuit board, wherein the first recess comprises a circular side surface and a bottom surface. The device may also include a first solder ball disposed in the first recess. The device may also include a first conductive wall positioned behind the circular side surface of the first recess, wherein the first conductive wall surrounds a side surface of the first solder ball.

A mounting board includes an electronic component having at least a pair of first terminals, and a circuit board having at least a pair of second terminals. The first terminal and the second terminal are bonded to each other by a bonding material. The first terminal, the second terminal, and the bonding material are disposed inside a recessed portion formed in a resin layer such that the periphery thereof is surrounded by the resin layer. When a total thickness of the first terminal, the second terminal, and the bonding material is a dimension h1, the dimension h1 is 1 μm to 20 μm. When a width of the first terminal is a dimension d1 and a width of the recessed portion of the resin layer is a dimension d2, a value of (dimension d2—dimension d1) is 10 μm or smaller.

A printed circuit board connector for orthogonal mating of two or more printed circuit boards. The connector utilizes interior perimeter trace connections of a main printed circuit board and internal trace connections of a mating printed circuit board in conjunction with external trace connections. The main board may utilize surface connections, where both external trace connections and internal trace connections are exposed on a surface of the main board to couple to the mating board. The main board may include a slot or pocket, allowing for the partial insertion of the mating board into the main board, with internal trace connections disposed within the slot or pocket. The slot or pocket may extend through the main board, such that the internal trace connections are disposed along a side of the pocket to couple with corresponding internal trace connections of the mating board.

A relay includes a relay main body (10) including a base (20) having a first surface (21), and a relay substrate (30) extending, in a direction intersecting the first surface (21), from a second surface (22) on the opposite side of the base (20) from the first surface (21), the relay substrate (30) being united with the base (20), and a case (50) attached to the relay main body (10) to cover the relay substrate (30), and the case (50) being filled with sealant. The relay main body (10) includes a board connector (23) provided on the first surface (21) of the base (20), an electronic component mounting portion (33) provided on the relay substrate (30), a conducting portion (40) provided on respective surfaces of the base (20) and the relay substrate (30), and an electronic component (34) mounted on the electronic component mounting portion (33).

A semiconductor package is provided. The semiconductor package includes a semiconductor device bonded to a base through a first conductive structure. The semiconductor device includes a carrier substrate including a conductive trace. A portion of the conductive trace is elongated. The semiconductor device also includes a second conductive structure above the carrier substrate. A portion of the second conductive structure is in contact with the portion of the conductive trace. The semiconductor device further includes a semiconductor body mounted above the conductive trace. The semiconductor body is connected to the second conductive structure.

A printed circuit board connector for orthogonal mating of two or more printed circuit boards. The connector utilizes interior perimeter trace connections of a main printed circuit board and internal trace connections of a mating printed circuit board in conjunction with external trace connections. The main board may utilize surface connections, where both external trace connections and internal trace connections are exposed on a surface of the main board to couple to the mating board. The main board may include a slot or pocket, allowing for the partial insertion of the mating board into the main board, with internal trace connections disposed within the slot or pocket. The slot or pocket may extend through the main board, such that the internal trace connections are disposed along a side of the pocket to couple with corresponding internal trace connections of the mating board.

An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

A method for manufacturing a printed wiring board includes forming a base insulating layer, forming a conductor layer on the base layer, forming a solder resist layer on the base layer such that the resist layer covers the conductor layer, forming first opening exposing a first pad of the conductor layer, forming second opening exposing a second pad of the conductor layer and having diameter smaller than diameter of the first opening, forming a first bump on the first pad, and forming a second bump on the second pad such that the second bump has diameter smaller than diameter of the first bump. The first bump includes a first base plating layer and a first top plating layer, and the second bump includes a second base plating layer and a second top plating layer having upper surface higher than the uppermost position of upper surface of the first top layer.

A relay includes a relay main body (10) including a base (20) having a first surface (21), and a relay substrate (30) extending, in a direction intersecting the first surface (21), from a second surface (22) on the opposite side of the base (20) from the first surface (21), the relay substrate (30) being united with the base (20), and a case (50) attached to the relay main body (10) to cover the relay substrate (30), and the case (50) being filled with sealant. The relay main body (10) includes a board connector (23) provided on the first surface (21) of the base (20), an electronic component mounting portion (33) provided on the relay substrate (30), a conducting portion (40) provided on respective surfaces of the base (20) and the relay substrate (30), and an electronic component (34) mounted on the electronic component mounting portion (33).

A semiconductor package is provided. The semiconductor package includes a semiconductor device bonded to a base through a first conductive structure. The semiconductor device includes a carrier substrate including a conductive trace. A portion of the conductive trace is elongated. The semiconductor device also includes a second conductive structure above the carrier substrate. A portion of the second conductive structure is in contact with the portion of the conductive trace. The semiconductor device further includes a semiconductor body mounted above the conductive trace. The semiconductor body is connected to the second conductive structure.