There is provided a method of forming a semiconductor package and a semiconductor package. The semiconductor package includes a package substrate. The package substrate includes a base layer, a first group of conductive lines disposed on a first surface of the base layer, and a second group of conductive lines disposed on a second surface of the base layer and electrically connected to respective ones of the first group of conductive lines. The package substrate further includes a plating lead line connected to one of the first group of conductive lines.

A conductive terminal is adapted to electrically connect a wire to a circuit board. The circuit board has a through hole and solder pads on a surface of the circuit board. The conductive terminal comprises a base, a pair of mounting portions, and a pair of clamping portions. The base has a pair of opposing first edges, a pair of opposing second edges, and an insertion hole aligned with the through hole of the circuit board. The mounting portions include a pair of solder portions extending outwardly from the first edges and parallel to the base. The solder portions are each adapted to be soldered to one of the solder pads of the circuit board. The clamping portions extend obliquely toward each other from the two second edges of the base and are adapted to clamp a conductor of the wire inserted through the insertion hole and the through hole.

A display device including a film substrate including first and second surfaces, the first surface being opposite to the second surface; a semiconductor chip disposed on the first surface and including an input terminal and a test terminal, which are arranged in a first direction; a first wire extending from the input terminal on the first surface along a second direction, which intersects the first direction; and a second wire including a first extended portion, which extends along the first surface, a second extended portion, which extends along the second surface, and a first via, which penetrates the film substrate and connects the first extended portion and the second extended portion, wherein the first extended portion extends from the test terminal in the second direction and is connected to the first via, and the second extended portion extends from the first via to an edge of the second surface.

A printed wiring board includes a laminate including resin insulating layers and conductor layers such that the resin insulating layers and the conductor layers are laminated alternately and that the laminate has a through hole opening to a first surface of the laminate and a component accommodating cavity that accommodates an electronic component and having an opening part formed on a second surface of the laminate on the opposite side with respect to the first surface. The through hole is formed through the laminate such that the through hole is extending to the component accommodating cavity, and the laminate has a resin coating formed on an inner wall surface of the through hole.

A printed circuit board includes vias of first and second differential pairs, and vias of third and fourth differential pairs. The vias of the first and second differential pairs are arranged in a first via pattern based on a first crosstalk signature of a first connector to be coupled to the vias of the first and second differential pairs. The vias of the third and fourth differential pairs are arranged in a second via pattern based on a second crosstalk signature of a second connector to be coupled to the vias of the third and fourth differential pairs.

Apparatus and methods for nanoplasma switches are disclosed. In certain embodiments, a nanoplasma switching system includes a nanoplasma radio frequency (RF) switch that receives an RF signal, and a nanoplasma DC switch that receives a DC bias voltage. The nanoplasma DC switch is positioned adjacent to but spaced apart from the nanoplasma RF switch. The nanoplasma DC switch induces a nanoplasma through the nanoplasma RF switch when the DC bias voltage is set to a first voltage level. By implementing the nanoplasma switching system in this manner, DC bias to turn on or off the nanoplasma RF switch can be realized without needing to use passive components such as DC blocking capacitors, choke inductors, or baluns for isolation.

A camera module is provided and includes an image sensor and a printed circuit board (PCB) structure electrically coupled to the image sensor. The PCB structure may include a first layer disposed under the image sensor, a second layer disposed between the first layer and the image sensor, a first conductive pattern formed on the first layer and electrically coupled to the image sensor through one end portion of the first conductive pattern so as to transfer a signal obtained from the image sensor to an external electronic component, and a first open space formed in the second layer such that the one end portion of the first conductive pattern is exposed to a surface of the PCB structure.

A printed wiring board includes a laminate including resin insulating layers and conductor layers such that the resin insulating layers and the conductor layers are laminated alternately and that the laminate has a through hole opening to a first surface of the laminate and a component accommodating cavity that accommodates an electronic component and having an opening part formed on a second surface of the laminate on the opposite side with respect to the first surface. The through hole is formed through the laminate such that the through hole is extending to the component accommodating cavity, and the laminate has a resin coating formed on an inner wall surface of the through hole.

A method of manufacturing a part-mounting package includes: forming a first through-hole in a first insulating sheet and forming a second through-hole whose opening area is larger than the first through-hole in a second insulating sheet; forming a penetration conductor covering an inner surface of the second through-hole and forming a conductor layer on a surface of at least the second insulating sheet; laminating the first insulating sheet and the second insulating sheet where center positions of the first through-hole and the second through-hole are matched to each other; causing linear laser division grooves to pass through a center of the first through-hole and the second through-hole; and dividing the sheet laminated body along the laser division grooves, and causing the side surface recess part and the end face through-hole conductor to appear.

A component-mounting resin substrate includes a resin substrate and a component. The resin substrate includes a thermoplastic resin body. The component is mounted on the resin substrate by ultrasonic bonding. In a mounting area of the resin body in which the component is mounted, a cavity that is hollowed from a mounting surface on which the component is mounted is defined. A plating layer that includes a material harder than the resin body is disposed on at least a portion of a wall surface of the cavity.