Method of constructing a printed circuit board, preferably with one lamination step: constructing multilayer cores wherein each multilayer core includes a sheet of cured dielectric material having a layer of metal on each side of the sheet of cured dielectric material; patterning each layer of metal to form wiring traces; forming a sheet of uncured dielectric material; embedding a solder element in the sheet of the uncured dielectric material; alternately stacking the multilayer cores with the sheets of uncured dielectric material, the sheet of the uncured dielectric material having the embedded solder element positioned so as to be aligned with wiring traces in adjacent layers of metal in adjacent multilayer cores; heating the solder element so as to cause the solder element to melt; and hot pressing the stack of multilayer cores and sheets of uncured dielectric material to cause curing of the sheets of uncured dielectric material.

A printed board includes an insulating layer, and radiation vias penetrating printed board are formed in both a first region overlapping electronic component and a second region outside the first region. A plurality of conductor layers included in printed board are cross-connected to a plurality of radiation vias. Diffusion radiator includes a thermal diffusion plate, a radiation member, and a cooling body. Radiation member is in close contact with one of main surfaces of cooling body, and thermal diffusion plate is in close contact with one of main surfaces of radiation member on the opposite side to cooling body. One of main surfaces of thermal diffusion plate on the opposite side to radiation member is bonded to a conductor layer on the other main surface of printed board so as to close the plurality of radiation vias.

A substrate on which an electronic component is soldered, includes an electronic component, a through hole positioned on the substrate and passing through the substrate, a solder that joins the through hole and a terminal of the electronic component inserted in the through hole, a pattern formed on a first surface of the substrate, the first surface facing a second surface on which the electronic component is placed, a first resist superimposed on the pattern, an exposed portion of which the pattern is exposed from the first resist around the through hole, and a second resist superimposed on the pattern and arranged between the through hole and the exposed portion.

A semiconductor package includes: a first substrate, disposed so as to be opposed to a second substrate, on which a semiconductor chip is mounted; and a solder ball formed on the first substrate, wherein the solder ball is joined to a pin that penetrates through the second substrate.

Solder (12) joins together a second conductive pattern (4) of a flexible substrate (1) and a third conductive pattern (7) of a print substrate (6) and joins together a second GND pattern (5) of the flexible substrate (1) and a third GND pattern (8) of the print substrate (6). A through hole (11) passes through the flexible substrate (1) and connects the first and second GND patterns (3,5) together. In an extension direction in which the second conductive pattern (4) extends, an end portion of a solder joint portion between the second conductive pattern (4) and the third conductive pattern (7) is in a position corresponding to the through hole (11) and is shifted from an end portion of the through hole (11).

An electronic device can include a plurality of pad electrodes provided at at least one side of a substrate, at least one circuit film configured to have a plurality of connection electrodes provided at an insulating film to correspond to the plurality of pad electrodes, a plurality of solders to conductively connect the plurality of connection electrodes to the plurality of pad electrodes exposed from the circuit film one-to-one, and an insulating adhesive to fill spaces between the plurality of pad electrodes and the plurality of connection electrodes. Also, each of the plurality of solders has an edge horizontally protruding from the insulating film.

A flexible circuit board, a circuit board assembly, and an electronic device are provided. The flexible circuit board includes at least a flexible dielectric layer and a first connection metal layer. The flexible dielectric layer includes a through hole extending along a thickness direction of the flexible dielectric layer. The through hole includes a middle basic hole and outer auxiliary holes. Two or more outer auxiliary holes are distributed and arranged along a circumferential direction of the middle basic hole. The middle basic hole is in communication with the two or more outer auxiliary holes. The first connection metal layer is arranged on an inner wall of the through hole and is connected to the flexible dielectric layer. The first connection metal layer includes a middle channel extending along a thickness direction.

A module includes a substrate, a first wiring, a second wiring, and an interlayer connection section. The substrate includes a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and an inner surface of a hole extending between the first surface and the second surface. The first wiring is provided on the first surface. The second wiring is provided on the second surface. The interlayer connection section includes a first conductor provided on the inner edge, connected to the first wiring and the second wiring, thinner than the first wiring, and thinner than the second wiring, and a second conductor disposed in the hole and electrically connected to the first conductor.

The present disclosure relates to a structure and a method for filling a via hole formed in a multilayer printed circuit board, and more particularly, to a structure and a method for filling a via hole formed in a multilayer printed circuit board, the structure and method enabling high-current transmission even in a narrow space in such a way that a via hole formed when a typical multilayer printed circuit board is manufactured is first filled with Cu and Ag plating, and the remaining vacant space is completely filled with a solder cream, thereby increasing the amount of conductors.

In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion of a solder ball's surface is melted when the connection is formed on one structure and/or when the connection is being attached to another structure. In some embodiments, non-solder balls are joined by an intermediate solder ball (140i). A solder connection may be surrounded by a solder locking layer (1210) and may be recessed in a hole (1230) in that layer. Other features are also provided.