A first conductive layer includes a first signal wiring including, at a position except for an end portion, a wide portion having a width wider than that of the other portion. A second conductive layer includes a signal electrode electrically continuous with the end portion of the first signal wiring, a first ground plane overlapping the wide portion, and a ground terminal. A third conductive layer includes a second signal wiring including an end portion overlapping and bonded to the signal electrode, and a ground electrode overlapping and bonded to the ground terminal. A fourth conductive layer includes a second ground plane. The second ground plane includes a through hole overlapping the end portion of the second signal wiring. A fifth conductive layer includes a third groundplane. The third groundplane overlaps the end portion of the second signal wiring inside the through hole.

An electronic component is mounted on a surface layer of a multilayer substrate constituting a wiring substrate, and a signal wire of the surface layer is electrically connected to the electronic component. A conductor pad for contact with an inspection probe is composed of a via and a solder filled in an internal opening portion thereof. The via has a laser-processed taper-shaped hole with a metal-plated inner peripheral surface and connects the inter-layer connection between the signal wire of the surface layer and a signal wire of the inner layer. The solder is filled in the opening portion of the via by filling, heating and melting solder material therein. Since the peripheral edge portion is solidified first at the time of the cooling and the solidification, the middle part is recessed compared to the peripheral edge portion. This ensures a reliable contact of the inspection probe.

A printed circuit board (1) comprising an insulating layer (2) and a conducting layer (3) arranged on the insulating layer (2) and structured into a contact surface (4) for an electronic component (11) which is to be populated on the printed circuit board (1) has, in the area of the contact surface (4), at least one channel (8) that passes through the contact surface (4) and the insulating layer (2) and that is filled with a thermally conductive material. The process is characterized by the steps of preparing an insulating layer (2) and a conducting layer (3) connected with the insulating layer (2); producing at least one channel (8) passing through the conducting layer (2) and the insulating layer (3); lining the channel (8) with thermally conductive material; structuring the conducting layer (3) into a contact surface (4) for an electronic component (11) to be populated on the printed circuit board; preparing a solder deposit (9) at least minimally overlapping with the contact surface (4); setting down the electronic component (11); melting the solder, and cooling.

The present invention is an electronic device (10) comprising a printed circuit board (12) bearing at least one component comprising at least one of a power component (14) and at least one power conductor (18). The printed circuit board comprises an alternating succession of insulating (22) and conductive (24) layers, wells (30, 30) bearing an internal electrically and thermally conductive coating (32) which passes through the thickness of the board, and a cooling device (34) for the board. The interior of the wells are filled with a thermally conductive material (44) to produce a thermal bridge between the component and the cooling device (34).

An applique and system includes a substrate having an adhesive property and conductive gel. The conductive gel is contained within the substrate. The conductive gel is configured to electrically couple with a first electronic component and a second electronic component to electrically couple the first electronic component to the second electronic component. The adhesive property of the substrate is configured to adhere at least one of the first electronic component and the second electronic component to the substrate.

A power conversion device includes a first electrical component, a second electrical component, a housing, a board, and a guide part. The first and second electrical components are accommodated in and fixed to the housing. The board has first through holes into which first signal terminals of the first electrical components are inserted, and second through holes into which second signal terminals of the second electrical components are inserted. The guide part is connected to the board so that guide holes formed therein are aligned with the second through holes. The first signal terminals are connected to the board through a first connection portion, and the second signal terminals are connected to the board through a second connection portion. A number of the first through holes disposed per unit area is greater than a number of second through holes disposed per unit area.

A first conductive layer includes a first signal wiring including, at a position except for an end portion, a wide portion having a width wider than that of the other portion. A second conductive layer includes a signal electrode electrically continuous with the end portion of the first signal wiring, a first ground plane overlapping the wide portion, and a ground terminal. A third conductive layer includes a second signal wiring including an end portion overlapping and bonded to the signal electrode, and a ground electrode overlapping and bonded to the ground terminal. A fourth conductive layer includes a second ground plane. The second ground plane includes a through hole overlapping the end portion of the second signal wiring. A fifth conductive layer includes a third groundplane. The third groundplane overlaps the end portion of the second signal wiring inside the through hole.

A printed circuit board, a ball grid array package and a wiring method of a printed circuit board are provided. The printed circuit board comprises: a substrate, the substrate including a plurality of insulating layers stacked and a plurality of conductive layers disposed between adjacent insulating layers; a plurality of pads, disposed in a two-dimensional matrix on a surface of the substrate; and a plurality of via holes, disposed corresponding to each pad and running through the substrate and the corresponding pad. The ball grid array package according to an embodiment of the invention comprises the above-described printed circuit board.

In a method for manufacturing a multilayer substrate, first, a via hole is formed in a first insulating layer and a second insulating layer and filled with conductive paste. Subsequently, the first insulating layer and the second insulating layer are stacked on each other. Next, the conductive paste is cured to form a via conductor while the first insulating layer and the second insulating layer are integrated through thermal pressing. Then, a penetrating hole that penetrates the via conductor in the laminating direction is formed.

A circuit board includes a substrate defining a plurality of ground attaching holes and a plurality of first through-holes. The substrate includes a first surface and a side edge. Wherein, a plurality of parallel and spaced first conductive paths is formed on the first surface around each ground attaching hole. A first arcuate conductive portion is formed at each end of each first conductive path. An angle between each first conductive path and the side edge is 45 or 135. The first through-holes respectively extend through the first arcuate conductive portions and electrically couple with the first conductive paths.