Embodiments disclosed herein include glass cores with through glass vias (TGVs). In an embodiment, an apparatus comprises a substrate that is a solid glass layer. In an embodiment, an opening is provided through a thickness of the substrate, and a liner with a first surface is on a sidewall of the opening and a second surface is facing away from the sidewall of the opening. In an embodiment, the liner comprises a matrix, and filler particles in the matrix. In an embodiment, a plurality of cavities are provided into the second surface of the liner. In an embodiment, a via is in the opening, where the via is electrically conductive.

A circuit board includes a metal substrate, a resin layer, an insulating layer, and a first conductive structure. The metal substrate has a first through hole, and the first through hole has a first width. A portion of the resin layer is disposed in the first through hole. The resin layer has a second through hole. The second through hole has a second width. The insulating layer is disposed on at least one surface of the metal substrate, and a portion of the insulating layer contacts the resin layer. The first conductive structure is disposed in the second through hole. The first conductive structure penetrates through the metal substrate. The first width is greater than the second width. A manufacturing method of the circuit board is also provided.

A circuit substrate including a glass substrate, a conductive post, and a dielectric layer is provided. The glass substrate has a through hole, the conductive post is located in the through hole, and the dielectric layer is located in the through hole, wherein the conductive post is separated from the glass substrate by the dielectric layer.

Provided is a glass circuit board and a manufacturing method thereof and an imaging device that achieve higher reliability. A glass circuit board including: a glass substrate serving as a core material including a first side, a second side located opposite from the first side, an outer end face located between the first side and the second side, and a through hole penetrating between the first side and the second side; an insulating first resin layer covering the first side; an insulating second resin layer covering the second side; a third resin layer that covers the inner surface of the through hole and is continuous with the first resin layer and the second resin layer; a fourth resin layer that covers the outer end face and is continuous with the first resin layer and the second resin layer; a first core wiring provided on the first side with the first resin layer interposed between the first core wiring and the first side; a second core wiring provided on the second side with the second resin layer interposed between the second core wiring and the second side; and a feed-through wiring provided on the inner surface of the through hole with the third resin layer interposed between the feed-through wiring and the inner surface.

A printed circuit board is provided. The printed circuit board includes a glass layer having a through-hole; an insulating material disposed within the through-hole and having a via hole; and a metal via disposed within the via hole. The metal via includes a first metal layer that is substantially conformally disposed on a wall surface of the via hole, a second metal layer that is substantially conformally disposed on the first metal layer, and a third metal layer disposed on the second metal layer and filling at least a portion of the via hole.