Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

Provided is a current sensing device including: a laminate having a plurality of insulating layers laminated therein; a current sensing element provided in an inner layer of the laminate; a current wire configured to flow current to the current sensing element, the current wire being provided with respect to the current sensing element via an interlayer insulating layer; a plurality of current vias configured to connect the current sensing element and the current wire so as to penetrate through the interlayer insulating layer; and a voltage sensing via configured to obtain a voltage drop in the current sensing element, the voltage sensing via being electrically connected to the current sensing element.

A component carrier and a method of manufacturing the same are disclosed. The component carrier includes a stack having a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures and a coax structure with an electrically conductive substantially horizontally extending central trace and an electrically conductive surrounding structure at least partially surrounding the central trace with electrically insulating material in between. The coax structure is formed by material of the layer structures of the stack.

For example, an apparatus may include a Printed Circuit Board (PCB) including a Ball Grid Array (BGA) on a first side of the PCB, the BGA configured to connect a Surface Mounted Device (SMD) to the PCB; an antenna disposed on a second side of the PCB opposite to the first side, the antenna to communicate a Radio Frequency (RF) signal of the SMD; and an RF transition to transit the RF signal between the BGA and the antenna, the RF transition including a plurality of signal buried-vias; a first plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and a ball of the BGA, the first plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias; and a second plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and the antenna.

A circuit board includes an insulating substrate including a wiring conductor and a first resin substrate that is made of a resin different from the insulating substrate and is laminated on the insulating substrate. The first resin substrate has a plurality of internal conductors located from a surface thereof facing the insulating substrate to a surface on a side opposite to the insulating substrate. Each of the plurality of internal conductors includes a part that is inclined with respect to a perpendicular to the surface facing the insulating substrate. Intervals at which the plurality of internal conductors are located on the side opposite to the insulating substrate are narrower than intervals at which the plurality of internal conductors are located on an insulating substrate side.

A printed circuit board includes a plurality of layer structures disposed in a stacked manner, and the printed circuit board has a disposing face. A differential pair unit and a shielding structure for shielding the differential pair unit are disposed on the disposing face. The differential pair unit includes two signal via holes, each signal via hole passes through the plurality of layer structures, and an anti-pad corresponding to each signal via hole is disposed on a ground layer through which the signal via hole passes. A part of metal of a ground layer is spaced between two anti-pads. Each signal corresponds to one anti-pad, and a ground layer is spaced between anti-pads.

Provided is a circuit module including a power supply chip module, a load chip module, and a system board. A power supply output terminal group of the power supply chip module is arranged side by side in a row along a side of the power supply chip module board, the power supply input terminal group of a load chip module includes a specific terminal group arranged in a specific row that is a row along a side of the load chip module board, and a wiring width along an arrangement direction of the power supply output terminal group of a wiring pattern in which the power supply output terminal group is connected to the system board is equal to or more than a wiring width W31 along an arrangement direction of the specific terminal group of the wiring pattern in which the specific terminal group is connected to the system board.

Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

This anisotropic conductive sheet has: an insulation layer that has a first surface and a second surface and that is formed of a first resin composition; a plurality of resinous columns that are formed of a second resin composition and that are disposed so as to extend in the thickness direction within the insulation layer; and a plurality of conductive layers that are disposed between the insulation layer and the plurality of resinous columns and that are exposed outside the second surface and the first surface.