A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.

An electronic device includes: a multilayered base substrate including a plurality of substrate bases stacked on each other; a first conductive via and a second conductive via penetrating the substrate bases and spaced from each other; a conductive line electrically connecting the first conductive via and the second conductive via to each other and disposed on at least one of the substrate bases of the plurality of substrate bases; and an open stub including a first end and a second end, wherein the first end is connected to a connector of the conductive line, and the second end is opened.

Provided is a printed circuit board realizing selective inhibition of electromagnetic noise and enabling high-density arrangement of differential transmission lines without increasing cost. The printed circuit board includes a pair of strip conductors (first layer), a first resonance conductor plate, a ground conductive layer (together with a second layer) including an opening portion, a second resonance conductor plate (third layer), a third resonance conductor plate (fourth layer), first via holes connecting the first and second resonance conductor plates, a second via hole connecting the second and third resonance conductor plates, and third via holes connecting the third resonance conductor plate and the ground conductive layer, wherein a polygon obtained by sequentially connecting centers of the adjacent third via holes overlaps so as to include the first resonance conductor plate, and center-to-center distance between the adjacent third via holes is 0.5 wavelength or less at frequency corresponding to the bit rate.

The present invention provides an inductor device comprising one or more interconnected columns of conductive material embedded in a supporting structure, wherein the one or more columns comprise an input terminal and an output terminal; and wherein each column is surrounded by a first magnetic layer.

A printed circuit board assembly and a terminal are provided. The printed circuit board assembly includes: a first printed circuit board and a second printed circuit board, where the second printed circuit board is electrically connected to the first printed circuit board through at least four solder joints; the at least four solder joints include a first solder joint, a second solder joint, a third solder joint, and a fourth solder joint, the first solder joint communicates with the second solder joint, the third solder joint communicates with the fourth solder joint, and at least one solder joint and/or at least one printed circuit board cavity is provided between the second solder joint and the third solder joint; and the printed circuit board cavity is a recess structure that is recessed inwards from a surface of the printed circuit board.

A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.

A printed circuit board assembly and a terminal are provided. The printed circuit board assembly includes: a first printed circuit board and a second printed circuit board, where the second printed circuit board is electrically connected to the first printed circuit board through at least four solder joints; the at least four solder joints include a first solder joint, a second solder joint, a third solder joint, and a fourth solder joint, the first solder joint communicates with the second solder joint, the third solder joint communicates with the fourth solder joint, and at least one solder joint and/or at least one printed circuit board cavity is provided between the second solder joint and the third solder joint; and the printed circuit board cavity is a recess structure that is recessed inwards from a surface of the printed circuit board.

A method may include receiving a first and a second complementary signal to provide differential signaling. The method may further include providing a first conductor trace to transport the first complementary signal; providing a second conductor trace to transport the second complementary signal, the second conductor trace immediately adjacent to the first conductor trace; providing a third conductor trace to transport the first complementary signal, the third conductor trace immediately adjacent to the second conductor trace; and providing a fourth conductor trace to transport the second complementary signal, the fourth conductor trace immediately adjacent to the third conductor trace.

In a printed circuit board (1), thermal vias (19) are formed between the lower surface (A) and an upper surface (B) of the substrate plate (10) of the printed circuit board through the steps of: applying a respective solder resist mask (21, 31) to the lower surface (A) and the upper surface (B); applying solder to the lower surface (A) and reflow soldering the solder, wherein the solder penetrates into the boreholes (20) and forms convex menisci (26) protruding beyond the edge (22) of the respective boreholes on the lower surface (A); and creating regions (35) on the upper surface (B), which are freed from solder resist material, and which are intended for contacting at least one electronic component (17) on the upper surface and each of which comprise at least one of the thermal vias. Subsequently, the upper surface (B) can be provided with electrical components (17) on these regions (35). The first solder resist mask (21) has a respective region (23) that is free of solder resist on the lower surface around the edge of every borehole (20).

Disclosed is an elastic connecting component, including an elastomer, and an elastic conductor in the elastomer, wherein the elastic conductor includes a first conductor, a second conductor, and a third conductor electrically connected between the first conductor and the second conductor; a plane where the second conductor and the third conductor are positioned has a preset angle in relation to the first conductor, and the preset angle is between 0° and 180°. Further disclosed is a method for manufacturing the elastic connecting component, an elastic electronic device and a method for manufacturing the same. A three-dimensional configuration of the elastic conductor in the elastic connecting component enables the elastic conductor to have a better tensile elongation performance.