A circuit board includes a circuit substrate, a heat dissipation dielectric film and a ground circuit board stacked orderly. At least one conductive structure passes through the heat dissipation dielectric film to electrically connect the circuit substrate and the ground circuit board. An insulating layer is disposed on a side of the circuit substrate facing away from the heat dissipation dielectric film. The circuit board further includes at least one connecting unit. Each connecting unit passes through the insulating layer to be electrically connected to the circuit substrate. A height of each connecting unit is gradually increased from a center of the connecting unit to a periphery of the connecting unit. A method for manufacturing a circuit board is provided.

A printed wiring board according to an embodiment includes a wiring board body, a first connection part and a second connection part. In the first connection part, a heat-receiving front surface is a first land formed on a front surface of the wiring board body. A heat-receiving back surface is formed on a back surface of the wiring board body. A main-heat conducting part is a through-hole that inter-connects the heat-receiving front surface and the heat-receiving back surface. In the second connection part, a second land is formed on the front surface of the wiring board body. The second land is not connected to any conductor pattern formed on the back surface of the wiring board body.

The present disclosure provides a printed circuit board including a plurality of conductive layers separated by insulating medium and a plurality of connection structures. Each connection structure penetrates each of the conductive layers. The plurality of conductive layers comprises a first conductive layer in which first signal lines are located and a second conductive layer in which second signal lines are located, and the first and second signal lines are connected via the connection structures. Anti-pads surrounding the connection structures are provided on others of the plurality of conductive layers except the first and the second conductive layers. For a same connection structure, the anti-pads surrounding the connection structure include adjacent anti-pads and nonadjacent anti-pads. Size of the adjacent anti-pads in any direction parallel to the conductive layers is smaller than that of the nonadjacent anti-pads. The present disclosure also provides a display apparatus.

In a printed circuit board (1), thermal vias (19) are formed between the lower surface (A) and an upper surface (B) of the substrate plate (10) of the printed circuit board through the steps of: applying a respective solder resist mask (21, 31) to the lower surface (A) and the upper surface (B); applying solder to the lower surface (A) and reflow soldering the solder, wherein the solder penetrates into the boreholes (20) and forms convex menisci (26) protruding beyond the edge (22) of the respective boreholes on the lower surface (A); and creating regions (35) on the upper surface (B), which are freed from solder resist material, and which are intended for contacting at least one electronic component (17) on the upper surface and each of which comprise at least one of the thermal vias. Subsequently, the upper surface (B) can be provided with electrical components (17) on these regions (35). The first solder resist mask (21) has a respective region (23) that is free of solder resist on the lower surface around the edge of every borehole (20).

An interposer and method of providing spatial and arrangement transformation are described. An electronic system has an electronic package, a motherboard and an interposer between the package and the motherboard. The interposer has signal and ground contacts on opposing surfaces that are respectively connected. The contacts opposing the package has a higher signal to ground contact ratio than the contacts opposing the motherboard, as well as different arrangements. Ground shielding vias in the interposer, which are connected to a ground plane, electrically isolate the signals through the interposer. The package may be mounted on a shielded socket such that signal and ground pins are mounted respectively in signal and ground socket mountings, ground shielding vias are between the signal socket mountings, and the ground socket mountings contain plated socket housings.

Methods, systems, and apparatus, including printed circuit boards (PCBs) with trace routing topologies are disclosed. In one aspect, a PCB includes an external layer that includes multiple integrated circuit (IC) installation regions that are each configured to receive an IC, a first trace routing layer having a first conductive trace that is routed along a first path from a first IC installation region to a second IC installation region, a second trace routing layer having a second conductive trace that is routed along a second path from the first IC installation region to the second IC installation region, a first via region having one or more first vias that extend from the first trace routing layer to the second trace routing layer, and a second via region having one or more second vias that extend from the first trace routing layer to the second trace routing layer.

A circuit board includes a first conductive circuit layer, a cover layer, and a second conductive circuit layer. The cover layer includes an adhesive layer and a base film. The first conductive circuit layer is embedded within the adhesive layer. One side of the first conductive circuit layer is revealed from the adhesive layer. The second conductive circuit layer is located on a side of the base film facing away from the adhesive layer. The cover layer defines a first through hole and a second through hole passing through the cover layer. A diameter of the first through hole is greater than a diameter of the second through hole. The first through hole is filled with a copper post adjacent to the first conductive circuit layer and an electroplating layer adjacent to the second conductive circuit layer. The second through hole is filled with the electroplating layer.

In one embodiment, an apparatus includes a plurality of layers in a circuit board, each of the layers comprising a fiber weave, two plated holes extending through the layers and connecting two or more of the layers, and a non-plated hole interposed between the plated holes. The non-plated hole passes through a potential CAF (Conductive Anodic Filament) migration path along the fiber weave to prevent CAF formation between the plated holes.

Methods, systems, and apparatus, including printed circuit boards (PCBs) with trace routing topologies are disclosed. In one aspect, a PCB includes an external layer that includes multiple integrated circuit (IC) installation regions that are each configured to receive an IC, a first trace routing layer having a first conductive trace that is routed along a first path from a first IC installation region to a second IC installation region, a second trace routing layer having a second conductive trace that is routed along a second path from the first IC installation region to the second IC installation region, a first via region having one or more first vias that extend from the first trace routing layer to the second trace routing layer, and a second via region having one or more second vias that extend from the first trace routing layer to the second trace routing layer.

An interposer and method of providing spatial and arrangement transformation are described. An electronic system has an electronic package, a motherboard and an interposer between the package and the motherboard. The interposer has signal and ground contacts on opposing surfaces that are respectively connected. The contacts opposing the package has a higher signal to ground contact ratio than the contacts opposing the motherboard, as well as different arrangements. Ground shielding vias in the interposer, which are connected to a ground plane, electrically isolate the signals through the interposer. The package may be mounted on a shielded socket such that signal and ground pins are mounted respectively in signal and ground socket mountings, ground shielding vias are between the signal socket mountings, and the ground socket mountings contain plated socket housings.