The coil substrate may include a substrate; a first conductor layer including a plurality of first and second segments periodically disposed on a top and a bottom of the substrate; a second conductor layer including a plurality of first and second segments periodically overlapping the first conductor layer on the top and the bottom of the substrate; a first connection line that connects the first and second segments of the first conductor layer; and a second connection line that connects the first and second segments of the second conductor layer. The first connection line includes a first region exposed on at least one of first and second surfaces that are opposite to each other of the substrate and second and third regions disposed through the substrate from both sides of the first region.

A wiring circuit board includes a base insulating layer; a first wiring disposed on the base insulating layer; an intermediate insulating layer disposed on the base insulating layer so as to cover the first wiring; a second wiring disposed on the intermediate insulating layer; a single layer first terminal, disposed on the base insulating layer, and electrically connected to the first wiring; and a single layer second terminal, disposed on the base insulating layer, and electrically connected to the second wiring. The first terminal is continuous with the first wiring. The second terminal is discontinuous from the second wiring. The wiring circuit board further includes a connecting portion disposed on the base insulating layer and continuous with the second terminal to electrically connect to the second wiring.

A single-layer redistribution plate functioning as a space translator between a device under testing (“DUT”) and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.

A single-layer redistribution plate functioning as a space translator between a device under testing (“DUT”) and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.

Embodiments of the present disclosure relate to the field of communication device technology, which provide a circuit board including a first signal line and a second signal line that are disposed adjacent to each other, a ground plane, and a conductive layer connected to the ground plane. The conductive layer is disposed between the first signal line and the second signal line. Embodiments of the present disclosure further provide a communication device.

A display device includes: a panel including a display region and a touch region; and a circuit board, and including a first conductive layer, a second conductive layer and a first insulating layer between the first conductive layer and the second conductive layer. The circuit board includes: a plurality of data lines electrically connected with a plurality of data signal lines; a plurality of touch lines electrically connected with a plurality of touch electrodes; and a first ground line disposed between at least two or more of the plurality of data lines and the plurality of touch lines. The first ground line includes a first part of the first conductive layer, a first part of the second conductive layer, and a first via passing through the first insulating layer and connecting the first part of the first conductive layer with the first part of the second conductive layer.

According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.

Eyewear (100) comprising at least one lens (110,120), a lens frame (111,121), a battery (170) and means for wireless charging of said battery (170), which wireless charging means comprises a receiver coil (181) arranged to be remotely powered by a corresponding transmitter coil (340) in a separate charging device (300). The invention is characterised in that the receiver coil (181) is arranged so that it encircles at least one of said one or several lenses (110,120), forming part of or being enclosed in said lens frame (111,121), whereby light passing through the at least one lens (110,120) will also pass through a coil hole.

A printed circuit board (PCB) is provided for transmitting a differential signal. The PCB includes first and second conductive signal layers. The first conductive signal layer includes a first positive trace of the differential signal and a first negative trace of the differential signal. The second conductive signal layer includes a second positive trace of the differential signal and a second negative trace of the differential signal. The first positive trace is adjacent to the first negative trace, and the second positive trace is adjacent to the second negative trace and directly below the first negative trace.

An extensible and contractible wiring board includes first and second extensible and contractible wiring substrates formed by respective wiring at extensible and contractible substrates. Each of the first and second extensible and contractible wiring substrates has a first end having functional units and an intermediate wiring portion, with the wiring and the functional units of the first and second extensible and contractible wiring substrates not electrically connected. Moreover, the first and second extensible and contractible wiring substrates are electrically independent extensible and contractible wiring substrates, and the wirings and the functional units do not overlap at the first ends of the first and second extensible and contractible wiring substrates in top view of the extensible and contractible wiring board, and the intermediate wiring portions of the first and second extensible and contractible wiring substrates overlap in top view of the extensible and contractible wiring board.