An electronic package including modulated mesh planes can reduce crosstalk between adjacent signal wires. Modulated mesh planes above and below a wiring plane include sets of adjacent wires arranged parallel to signal wires within the wiring plane, and sets of adjacent wires arranged perpendicular to the signal wires. The wires in each of the mesh planes are electrically interconnected and insulated from the signal wires by a dielectric layer. The electronic package also includes a region of the mesh planes having the adjacent wires that are perpendicular to the signal wires separated by a first distance, and another region of the mesh planes having adjacent wires perpendicular to the signal wires separated by a distance greater than the first distance. A set of rectangular mesh areas of the mesh planes can be populated with supplemental wires and via interconnect structures which can further reduce crosstalk.

A novel and useful system wiring apparatus and related techniques that address the

need to feed power and electronic signals to and from a sample board between the cold, low pressure region in a vacuum chamber and outside room temperature and atmospheric pressure. The wiring apparatus balances electrical resistance with the thermal conductivity of the power and signal conductors. Printed flexible cables are used having an annular sealing region which together with O-rings provide vacuum sealing while allowing electrical signals to pass between integrated circuit(s) inside the vacuum chamber and equipment outside the chamber. A thermal anchor is placed along the printed flexible cable to maintain a desired temperature along the cable. The printed flexible circuits are multilayer with two outer layers serving as an RF shield while two inner layers comprise the signal lines which typically require shielding, electrical isolation from each other and from external electromagnetic fields.

A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.

A conductive component includes a first electrode pattern made of metal thin wires, and includes a plurality of first conductive patterns that extend in a first direction alternating with first non-conductive patterns. Each first conductive pattern includes break parts in portions other than intersection parts of the thin metal wires. The conductive component further includes a second electrode pattern made of thin metal wires, and includes a plurality of second conductive patterns that extend in a second direction orthogonal to the first direction and alternating with second non-conductive patterns. Each second conductive pattern includes break parts in portions other than intersection parts of thin metal wires.

A method of making an electrically-conductive film is provided. The method includes providing a release layer, optionally having a topologically structured surface, and depositing at least one electrically-conductive layer on the release layer whereby the at least one electrically-conductive layer has an outer surface that substantially replicates the topologically structured surface. The electrically-conductive layer can be peeled away from the release layer to obtain the electrically-conductive film. Such electrically-conductive films can be useful in lightning strike applications.

A display device includes a display panel, a data driver which transmits a data voltage to the display panel, a first flexible printed circuit board attached to the display panel and including an input side wiring electrically connected to the data driver, a first printed circuit board (PCB) electrically connected to the input side wiring to transmit a high-speed driving signal to the data driver, and a metal tape overlapping the input side wiring in a plan view and attached on the first flexible printed circuit board, where a part of the metal tape overlapping the input side wiring in the plan view defines an opening.

An occupant or object sensing system in a vehicle includes electrical circuits for capacitive sensing and corresponding circuits shielding the sensing system from interference. A sensing circuit and a shielding circuit may be printed by screen printing with conductive ink on opposite sides of a non-conductive substrate. The substrate is a plastic film or other fabric that has an elastic memory structure that is resilient to stretching. The conductive inks used to print circuits onto the substrate have a similar resilience to stretching such that the substrate and the circuits thereon can be subject to deforming forces without breaking the printed circuits. The substrate may be covered with a carbon polymer layer to provide alternative conductive paths that enable fast recovery for conduction in the presence of any break in the printed conductive traces on the substrate.

A wiring substrate which includes a base member having a first surface, a first differential signal line disposed on the first surface of the base member and a second differential signal line disposed adjacent to the first differential signal line on the first surface of the base member. A ground layer which faces the first and second differential signal lines, has a plurality of openings continuously arranged along a predetermined direction. In a planar view of the wiring substrate, where a length of each of the plurality of openings in a direction along the signal lines is a length L1, a length of the opening in a direction orthogonal to L1 is a length L2, and a distance between the first and second differential signal lines is a length L3, L1 is equal to or greater than four times L2, and L2 is equal to or less than L3.

Various embodiments relate to an apparatus. The apparatus may include: a first printed circuit board including a first ground layer having one or more openings formed therein and a wiring layer on which a signal wire is disposed; a second printed circuit board including a second ground layer having one or more openings formed therein; a first area and a third area in which the first printed circuit board and the second printed circuit board are connected to each other via an insulating layer; and a second area, which extends from the first area to the third area, and in which the first printed circuit board and the second printed circuit board are spaced apart from each other, with an air layer interposed therebetween. Various other embodiments may be possible.

An occupant or object sensing system in a vehicle includes electrical circuits for resistive and/or capacitive sensing and corresponding circuits shielding the sensing system from interference. A sensing circuit and a shielding circuit may be printed by screen printing with conductive ink on opposite sides of a non-conductive substrate. The substrate is a plastic film or other fabric that has an elastic memory structure that is resilient to stretching. The conductive inks used to print circuits onto the substrate have a similar resilience to stretching such that the substrate and the circuits thereon can be subject to deforming forces without breaking the printed circuits. The substrate may be covered with a carbon polymer layer to provide alternative conductive paths that enable fast recovery for conduction in the presence of any break in the printed conductive traces on the substrate.