The present specification relates to a manufacturing method of a circuit board. More particularly, the present specification relates to a circuit board and a manufacturing method of an electronic device including the same.

According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

An electronic package can include modulated mesh planes for reducing crosstalk between adjacent signal wires within the electronic package. Modulated mesh planes above and below a wiring plane can include sets of adjacent wires arranged in an orientation parallel to signal wires within the wiring plane, and sets of adjacent wires arranged in an orientation perpendicular to the signal wires. The sets of wires in each of the mesh planes are each electrically interconnected and insulated by a dielectric layer from the signal wires. The electronic package also includes a region of the mesh planes having the adjacent wires that are arranged in an orientation perpendicular to the signal wires separated by a first distance, and another region of the mesh planes having adjacent wires perpendicular to the signal wires separated by a distance greater than the first distance.

An electronic package including modulated mesh planes can reduce crosstalk between adjacent signal wires. Modulated mesh planes above and below a wiring plane include sets of adjacent wires arranged parallel to signal wires within the wiring plane, and sets of adjacent wires arranged perpendicular to the signal wires. The wires in each of the mesh planes are electrically interconnected and insulated from the signal wires by a dielectric layer. The electronic package also includes a region of the mesh planes having the adjacent wires that are perpendicular to the signal wires separated by a first distance, and another region of the mesh planes having adjacent wires perpendicular to the signal wires separated by a distance greater than the first distance. A set of rectangular mesh areas of the mesh planes can be populated with supplemental wires and via interconnect structures which can further reduce crosstalk.

A flexible conductive film and its manufacturing method are provided. A flexible touch screen and a flexible touch display panel including the flexible conductive film are also provided. The manufacturing method of a flexible conductive film includes: providing a first substrate; applying a first conductive metal ink on the first substrate and forming a first conductive metal pattern; applying a polyimide varnish on a surface of the first substrate having the first conductive metal pattern; soaking the first substrate in deionized water after the polyimide varnish has been solidified; and detaching the solidified polyimide varnish and the first conductive metal pattern from the first substrate to obtain the flexible conductive film. The flexible conductive film prepared can be used in a flexible touch screen and a flexible display panel to improve the adhesion of nanosilver material to a flexible substrate, and to improve its stability of mechanical strength.

This disclosure provides a stretchable conductor structure, a garment with a stretchable conductor structure, and a method for producing a stretchable conductor structure. The conductive structure includes a set of conductive wires and a stretchable laminate. The set of conductive wires, each including a protective surface, the set of conductive wires patterned in a mesh structure to accommodate a manipulation while providing electrical conductivity across the set of conductive wires. The stretchable laminate encapsulates the mesh structure, the stretchable laminate can return the mesh structure of the set of conductive wires to an original state after the manipulation.

A method of manufacturing an electrode substrate for a transparent light emitting device display that includes laminating copper foil on a transparent base material; forming a copper foil pattern by etching the copper foil; forming a transparent photosensitive resin composition layer on a front surface of the transparent base material and the copper foil pattern; and exposing at least a part of the copper foil pattern by removing at least a part of the transparent photosensitive resin composition layer provided on the copper foil pattern.

Embodiments of the present disclosure are directed towards electro-magnetic interference (EMI) shielding techniques and configurations. In one embodiment, an apparatus includes a first substrate, a die having interconnect structures coupled with the first substrate to route input/output (I/O) signals between the die and the first substrate and a second substrate coupled with the first substrate, wherein the die is disposed between the first substrate and the second substrate and at least one of the first substrate and the second substrate include traces configured to provide electro-magnetic interference (EMI) shielding for the die. Other embodiments may be described and/or claimed.

An apparatus includes a plurality of conductive layers and a plurality of traces configured to carry a plurality of signals through a change of direction. The traces may be routed parallel to each other in a first trace segment in a first of the conductive layers toward the change of direction. The traces may be routed parallel to each other in a second trace segment in a second of the conductive layers in the change of direction. One of the traces in a third trace segment in the first conductive layer may cross over another of the traces in the second trace segment in the second conductive layer in the change of direction. The traces may be routed parallel to each other in the third trace segment in the first conductive layer away from the change of direction.

The invention relates to an improved electromagnetic band gap (EBG) structure. The invention also relates to an electromagnetic band gap (EBG) component for use in an EBG structure according to the invention. The invention further relates to an antenna device comprising at least one EBG structure according to the invention.