A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.

A method is described for method for patterning a metal layer interfaced with a transparent conductive film, in which the method comprises contacting a structure through a patterned mask with an etching solution comprising Fe.sup.+3 ions, wherein the structure comprises the metal layer comprising copper, nickel, aluminum or alloys thereof covering at least partially a transparent conductive film with conductive elements comprising silver, to expose a portion of the transparent conductive film. Etching solutions and the etched structures are also described.

A conductive component includes: a first electrode pattern which is made of metal thin wires, the first electrode pattern including a plurality of first conductive patterns that extend in a first direction. Each first conductive pattern includes, at least, inside thereof, a sub-nonconduction pattern that is electrically separated from the first conductive pattern. An area A of each first conductive pattern and an area B of each sub-nonconduction patterns satisfy a relation of 5%<B/(A+B)<97%. The conductive component may be included in a conductive sheet and a touch panel to provide a high detection accuracy.

A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 m or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 .Math.cm or less.

A wiring board manufacturing method and a wiring board in which a pattern can be simply and easily formed even when using a coating composition having a high surface tension are provided. The method includes a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred; and a conductor pattern forming step of applying a conductive coating composition onto a pattern transfer surface of the base material to form a conductor pattern, the base material having a pattern of a high surface free energy region and a low surface free energy region, and the high surface free energy region having a surface free energy of more than 62 mJ/m.sup.2.

Methods and structures are provided for implementing embedded wire repair for printed circuit board (PCB) constructs. A repair wire layer is provided within the PCB stack with reference planes on opposite sides of the repair wire layer. When a repair connection is required, an appropriate plated through hole (PTH) is drilled to form the repair connection using the repair wire layer.

According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

A stretchable board includes: a substrate having a stretching property; and a conductor portion provided on the substrate, wherein the conductor portion comprises: conductor wires intersecting with each other; and an opening surrounded by the conductor wires.

Examples are disclosed that relate to electronically functional yarns. One example provides an electronically functional yarn comprising a core, a sheath at least partially surrounding the core, and an electronic circuit formed on the core. The circuit includes three or more control lines and more than three diode-containing circuit elements controllable by the three or more control lines, each circuit element being controllable via a corresponding set of two of the three or more control lines.

Embodiments include apparatuses, methods, and systems including an electronic apparatus including an inductor within a circuit package affixed to a printed circuit board (PCB) having a ground layer, where the ground layer includes a mesh area that is substantially void along a contour of the inductor. An electronic apparatus may include a circuit package with an inductor, and a PCB, where the circuit package may be affixed to the PCB. The PCB may have a plurality of layers including a ground layer and a power layer, where the ground layer may be between the power layer and the inductor. The ground layer may include a mesh area that may be substantially void along a contour of the inductor within the circuit package. Other embodiments may also be described and claimed.