An electrical connector includes an insulating housing, at least one flexible printed circuit board mounted in the insulating housing, at least one location block disposed to a middle of an outer surface of the at least one flexible printed circuit board, at least one elastic structure disposed on an outer surface of the at least one location block, and a shell. The at least one flexible printed circuit board includes an outer ground layer, a signal layer and an inner ground layer. The signal layer has a plurality of traces. Each trace has a main portion, at least one contact portion and a soldering portion. The shell surrounds the insulating housing, the at least one flexible printed circuit board, the at least one location block and the at least one elastic structure.

A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.

Disclosed are a display panel and a display device. The display panel includes a display area, a wiring area, and a bending area connecting the display area and the wiring area; the bending area includes a first boundary on a side closer to the display area; in the first direction, an extension length of the first boundary is less than an extension length of the wiring area; in the second direction, a vertical projection of the first boundary in the wiring area is located within the coverage of the wiring area; in the second direction, the display area includes sub-pixel rows, and the last sub-pixel row is located on a side of the display area closer to the wiring area; in the first direction, a first sub-pixel in the last sub-pixel row is located on a side of the wiring area boundary closer to the center of the display panel.

A stretchable conductive substrate includes a substrate and a circuit layer. The substrate has a plurality of predetermined areas. The circuit layer is formed on the substrate and defines a conductive contact group and at least one elastic wire structure connected to the conductive contact group in each of the predetermined areas. The at least one elastic wire structure has at least one patterned wire segment and a stretch rate thereof along a length direction of the substrate is from 0% to 60%.

A method of making an electrically-conductive film is provided. The method includes providing a release layer, optionally having a topologically structured surface, and depositing at least one electrically-conductive layer on the release layer whereby the at least one electrically-conductive layer has an outer surface that substantially replicates the topologically structured surface. The electrically-conductive layer can be peeled away from the release layer to obtain the electrically-conductive film. Such electrically-conductive films can be useful in lightning strike applications.

A flexible circuit may be provided that allows for the monitoring of a physical object. The flexible circuit includes a plurality of flexible conductive segments that are disposed in a geometric pattern. The flexible conductive segments include nodes, and the physical object is monitored by analyzing changes in electrical resistance in the conductive segments between the nodes. The flexible circuit may also include sensors disposed on the nodes for monitoring additional conditions. A processor monitors the flexible conductive segments and sensors. and may provide an output regarding the status of the physical object.

A multilayer resin substrate includes a stacked body including first resin layers made of a thermoplastic resin, conductor patterns on the stacked body, and a protective layer including a second resin layer made of a thermosetting resin. The stacked body includes first and second main surfaces, and a bent portion. One of the conductor patterns located at the bent portion is located only inside the stacked body. The protective layer covers at least the bent portion, on the main surface of the stacked body.

A semiconductor device and a method for manufacturing the semiconductor device. The semiconductor device includes an insulating substrate, a semiconductor chip, a plate member, and a cooler. The insulating substrate includes insulating ceramics serving as an insulating plate, and conductive plates provided on opposite surfaces of the insulating ceramics. The semiconductor chip is provided on an upper surface of the insulating substrate. The plate member is bonded to a lower surface of the insulating substrate. The cooler is bonded to a lower surface of the plate member. At least one of bonding between a lower surface of the insulating substrate and the plate member and bonding between a lower surface of the plate member and the cooler is performed via a bonding member composed mainly of tin. Also, a cyclic stress of the plate member is smaller than a tensile strength of the bonding member.

To suppress occurrence of a difference in transmission time due to a difference in length between signal lines, there is provided a printed wiring board having: an insulating substrate (10); a first signal line (L31) formed on the insulating substrate (10); a second signal line (L32) having a shorter length than that of the first signal line (L31); and a ground layer (30) formed for the first signal line (L31) and the second signal line (L31) via an insulating material (10). The ground layer (30) includes a first ground layer (G31) corresponding to a first region (D1) and a second ground layer (G32) corresponding to a second region (D2). The first region (D1) is defined based on the first signal line (L31) and has a first predetermined width (W31). The second region (D2) is defined based on the second signal line (L32) and has a second predetermined width (W32). The first ground layer (G31) has a remaining ratio lower than a remaining ratio of the second ground layer (G32).

A wiring body includes an adhesive layer and a mesh-like electrode layer having a shape of a mesh formed by fine wires intersecting each other is formed on the adhesive layer. The mesh-like electrode layer includes an intersection region intersecting the fine wires with each other and a non-intersection region corresponding to a region except for the intersection region. A depression recessed toward the adhesive layer is formed in the intersection region.