H05K2201/0969

Circuit board structure and conductive transmission line structure thereof

A conductive transmission line structure includes a first conductive transmission line and a second conductive transmission line. A first segment and a second segment of the first conductive transmission line are respectively disposed adjacent to a third segment and a fourth segment of the second conductive transmission line. Line widths of the first segment and the third segment are respectively smaller than line widths of the second segment and the fourth segment. A spacing between the first segment and the third segment is smaller than a spacing between the second segment and the fourth segment. The first segment and the third segment provide a first impedance, and the second segment and the fourth segment provide a second impedance. The first impedance is smaller than the second impedance. The first and the third signal transmission nodes receive a differential signal pair.

DISPLAY DEVICE
20200241704 · 2020-07-30 ·

A display device includes a first substrate including a display area and a non-display area, which is on the periphery of the display area, a light-emitting element disposed on the first substrate and in the display area, a display signal line which is disposed on the first substrate and in the display area, extends in a first direction, and transmits a signal to the light-emitting element, a common voltage supply line disposed on the first substrate and in the non-display area, a pad disposed on the first substrate and in the non-display area, and electrically connected to the display signal line, and an indentation pad disposed on the first substrate and in the non-display area, and electrically connected to the common voltage supply line, where the indentation pad is disposed closer than the pad to edges of the first substrate in a second direction, which intersects the first direction.

Ceramic electronic component
10729009 · 2020-07-28 · ·

A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer, a surface electrode on a surface of the electronic component body, and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has an opening or a thin portion.

FLEXIBLE DISPLAY PANEL, DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

A flexible display panel, a display device and a manufacturing thereof are disclosed. Hollow patterns are arranged in the lead wires in the bent region of the flexible display panel between the display region and the binding region. The hollow patterns can dissipate the stress accumulated on the lead wires during the bending and help the lead wires to release the stress when they are bent, thereby preventing breakage of the lead wires and improving the quality and reliability of the flexible display panel.

Electrical components attached to fabric

An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

Backlight bar, backlight module and display device

A backlight bar includes a flexible circuit board and backlight lamp, the flexible circuit board includes a circuit board base and an electrostatic shielding structure, the electrostatic shielding structure is disposed on a first surface of the circuit board base and located in a non-marginal region, and the backlight lamp disposed on a second surface of the circuit board base, the first surface disposed opposite to the second surface. A backlight module and a display device are also provided.

Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers

A device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical energy to the contact pads of the flexible printed circuit board.

WIRING BOARD

A wiring board includes: an insulator layer composed mainly of ceramic; a conductor extending through the insulator layer in a thickness direction thereof; and an electrode pad disposed on a first surface of the insulator layer and connected electrically with the conductor, wherein: the electrode pad includes through holes extending through the electrode pad in a thickness direction thereof; and each of the through holes is positioned to avoid overlapping with the conductor in the thickness direction of the insulator layer.

CURRENT REDISTRIBUTION IN A PRINTED CIRCUIT BOARD

In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.

CIRCUIT BOARD STRUCTURE AND CONDUCTIVE TRANSMISSION LINE STRUCTURE THEREOF

A conductive transmission line structure includes a first conductive transmission line and a second conductive transmission line. A first segment and a second segment of the first conductive transmission line are respectively disposed adjacent to a third segment and a fourth segment of the second conductive transmission line. Line widths of the first segment and the third segment are respectively smaller than line widths of the second segment and the fourth segment. A spacing between the first segment and the third segment is smaller than a spacing between the second segment and the fourth segment. The first segment and the third segment provide a first impedance, and the second segment and the fourth segment provide a second impedance. The first impedance is smaller than the second impedance. The first and the third signal transmission nodes receive a differential signal pair.