A printed circuit board includes a printed wiring board, and a first element and a second element mounted on the printed wiring board. The printed wiring board includes a plurality of first signal lines and a plurality of second signal lines. The plurality of first signal lines each include a first main line, a first branch line, and a second branch line. The plurality of second signal lines each include a second main line, a third branch line, and a fourth branch line. The first branch line includes a first conductor pattern disposed in a first conductor layer. The second branch line includes a second conductor pattern disposed in the first conductor layer. The third branch line includes a third conductor pattern disposed in a second conductor layer. The fourth branch line includes a fourth conductor pattern disposed in the second conductor layer.

A PCB having a first surface and a second surface includes a trench extending through the PCB, a plurality of conductive traces on one or more sidewalls of the trench. The plurality of conductive traces extends through the PCB and may be arranged in pairs across from one another along at least a portion of the length of the trench. A first set of conductive contacts are arranged in a first zig-zag pattern around a perimeter of the trench. A second set of conductive contacts are arranged in a second zig-zag pattern around the perimeter of the trench. In some cases, the first and second zig-zag patterns are arranged with respect to one another around the perimeter of the trench in an alternating fashion. A chip package is also disclosed having a pin arrangement that couples to the corresponding arrangement of conductive contacts on the PCB.

A circuit board includes a protective film of such a type that a mating contact slides on the protective film and rides over a pad, and is prevented from deteriorating due to attachment and detachment. A circuit board 10 includes a plate-shaped base body 40, a pad 20 formed on a surface of the base body 40 and responsible for electrical contact with a mating contact, and a protective film 30 that spreads on the surface of the base body 40 in contact with an edge of the pad 20. The edge of the pad 20 and a portion, which contacts the edge of the pad 20, of the protective film 30 respectively have heights consecutive to each other. The pad 20 contacts, by causing the mating contact that has slid in a sliding direction in contact with the protective film 30 to ride over the pad 20, the mating contact that has ridden over the pad 20.

A board mount connector includes: a housing having a press-fitting hole; and a terminal press-fitted into the press-fitting hole. The terminal includes: a first terminal portion including a first contact portion contacting and conductively connected to the counterpart terminal when the first contact portion is connected to the counterpart terminal, and a press-fitting portion that is press-fitted into the press-fitting hole; and a second terminal portion including a bent portion extending from the first terminal portion and bent around a bending axis along an axis line of the first terminal portion, and a second contact portion located at a position offset from the first contact portion in an intersecting direction intersecting the axis line of the first terminal portion and conductively connected to the conductor pattern when the boar mount connector is mounted on the circuit board.

A printed circuit board includes a first board including a plurality of first insulating layers and a plurality of first wiring layers disposed between the plurality of first insulating layers, respectively; and a second board disposed on one surface of the first board and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers, respectively. At least one of the plurality of first insulating layers has a thickness less than a thickness of at least one of the plurality of second insulating layers. The first board further includes a through-via penetrating each of the plurality of first insulating layers and connected to one of the plurality of second wiring layers.

A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.

An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.

A flexible circuit package. The circuit package includes a termination point on a flexible base substrate. The termination point is connected with an interface by conductive material on the base substrate. The conductive material extends across the surface area of the base substrate in multiple individual connections, which are in communication with each other and separated by voids in the conductive material for mitigating communication failure between the termination point and the interface during or following flexion, stretching, compression or other deformation of the base substrate and the circuit package. The termination point may include an input module such as a sensor, switch or other input. The termination point may include an output module such as a light, vibrator or other output. The interface may include an output interface for receiving data or an input interface for sending a command or other signal.

Apparatus having at least one breakout structure are provided. In one example, an apparatus includes a dielectric layer, first and second contact pads, and first and second vias. The first and second contact pads are disposed on the dielectric layer. The first via is disposed through the dielectric layer and coupled to the first contact pad. The first via is offset from the first contact pad in a first direction. The second contact pad is immediately adjacent the first via. The second via is disposed through the dielectric layer immediately adjacent the first contact pad and coupled to the second contact pad. The second via is offset from the second contact pad in a second direction that is opposite of the first direction. The first and the second contact pads define a first differential pair of contact pads that is configured to transmit a first differential pair of signals.

A flexible circuit package. The circuit package includes a termination point on a flexible base substrate. The termination point is connected with an interface by conductive material on the base substrate. The conductive material extends across the surface area of the base substrate in multiple individual connections, which are in communication with each other and separated by voids in the conductive material for mitigating communication failure between the termination point and the interface during or following flexion, stretching, compression or other deformation of the base substrate and the circuit package. The termination point may include an input module such as a sensor, switch or other input. The termination point may include an output module such as a light, vibrator or other output. The interface may include an output interface for receiving data or an input interface for sending a command or other signal.