A display panel and a bezel substrate thereof are disclosed. The bezel substrate includes a bending section and a plurality of wirings. Each of the wirings includes a first line section and a second line section, the first line section and the second line section are disposed on the bending section, a width of the first line section to each of the wirings is greater than a width of the second line section of the wirings, and the first line sections of the adjacent wirings are staggered with respect to each other.

A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.

A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.

An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.

Apparatus having at least one breakout structure are provided. In one example, an apparatus includes a dielectric layer, first and second contact pads, and first and second vias. The first and second contact pads are disposed on the dielectric layer. The first via is disposed through the dielectric layer and coupled to the first contact pad. The first via is offset from the first contact pad in a first direction. The second contact pad is immediately adjacent the first via. The second via is disposed through the dielectric layer immediately adjacent the first contact pad and coupled to the second contact pad. The second via is offset from the second contact pad in a second direction that is opposite of the first direction. The first and the second contact pads define a first differential pair of contact pads that is configured to transmit a first differential pair of signals.

Methods for producing a printed circuit board and printed circuit boards are disclosed, including a method in which a slot is formed in a substrate, the substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. The conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

A transmission line substrate includes a stacked body that includes insulating base materials, first and second signal lines, and first and second ground conductors. The second signal line is provided on a layer different from the layer of the first signal line and extends in parallel with the first signal line. The first ground conductor is provided on the same layer as the layer of the second signal line and overlapped with the first signal line when viewed in the Z-axis direction. The second ground conductor is provided on the same layer as the layer of the first signal line and overlapped with the second signal line when viewed in the Z-axis direction. A first transmission line includes the first signal line, the first ground conductor, and an insulating base material, and a second transmission line includes the second signal line, the second ground conductor, and the insulating base material.

A circuit board has an electrical circuit and a connector that is attached to the circuit board. The connector has metal contacts. A housing of the connector has an embedded reference metal layer that is disposed under a single-ended metal contact or differential metal contacts. The reference metal layer sets the impedance of the single-ended metal contact or the differential metal contacts.

A wiring board includes core substrate, a first build-up layer on first surface of the substrate and including conductive and insulating resin layers, and a second build-up layer on second surface of the substrate and including conductive and insulating resin layers. The first build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of a conductive layer on a non-outermost resin layer, and the second build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of a conductive layer on a non-outermost resin layer.

An electrical connector assembly comprises a printed circuit board and a data transmission cable. The printed circuit board has a substrate and a routing structure, the substrate has a welding region and a routing region, the routing structure comprises a plurality of bonding pads. The data transmission cable comprises several juxtaposed wires, a plastic layer and a metallic layer formed by a metal material belt, each wire has a conductor, the metallic layer has at least an aluminum foil layer and a bonding layer. The metallic layer is bonded to the outer side of the plastic layer via the bonding layer. The wires are soldered with corresponding bonding pads, the center distance between every two neighboring wires is same as the center distance between every two neighboring bonding pads.