An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.

A wiring substrate has a substrate body formed by a single or a plurality of insulating layers and having front and back surfaces located at opposite sides of the substrate body; a plurality of pads formed on at least one of the front surface, the back surface and an inner layer surface that is located between the front and back surfaces, and having a staggered arrangement in plan view; and a plurality of via conductors formed at each of the pads, extending in a thickness direction of the substrate body with the plurality of via conductors being parallel to each other and connecting the pads located on different surfaces. Arrangement, in plan view, of the plurality of via conductors connecting to the pad and arrangement, in plan view, of the plurality of via conductors connecting to an adjacent pad located on the same surface are different from each other.

The present disclosure describes an expansion card interface for a printed circuit board. The expansion card interface includes a substrate having an edge. The expansion card interface further includes a plurality of signal pins configured to communicate one or more signals to and from the printed circuit board. The expansion card interface further includes a plurality of ground pins adjacent to the plurality of signal pins configured to provide a ground. At least one signal pin of the plurality of signal pins extends closer to the edge of the substrate than at least one ground pin of the plurality of ground pins.

Systems and methods disclosed herein include a light engine circuit board including a flexible substrate having a first interconnect region located at a first end of the flexible substrate and a second interconnect region located at a second end of the flexible substrate, in which the first interconnect region and the second interconnect region each comprise one or more solder strips, and one or more LEDs on the flexible substrate.

A circuit board and an electrical connector with the same are disclosed in the present invention. The circuit board includes a first line layer, a first insulating layer, a second line layer, an insulating substrate, a third line layer, a second insulating layer and a fourth line layer, which are stacked from top to bottom. A first metal line and a second metal line are formed on the first line layer and the second line layer, respectively, and together constitute a first differential line pair. A third metal line and a fourth metal line are formed on the third line layer and the fourth line layer, respectively, and together constitute a second differential line pair. Two metal lines constituting each differential line pair are arranged up and down and have different widths, thereby reducing signal crosstalk between adjacent differential line pairs.

An electrical connector assembly comprises a printed circuit board and a data transmission cable. The printed circuit board has a substrate and a routing structure, the substrate has a welding region and a routing region, the routing structure comprises a plurality of bonding pads. The data transmission cable comprises several juxtaposed wires, a plastic layer and a metallic layer formed by a metal material belt, each wire has a conductor, the metallic layer has at least an aluminum foil layer and a bonding layer. The metallic layer is bonded to the outer side of the plastic layer via the bonding layer. The wires are soldered with corresponding bonding pads, the center distance between every two neighboring wires is same as the center distance between every two neighboring bonding pads.

A printed circuit board includes a printed wiring board, and a first element and a second element mounted on the printed wiring board. The printed wiring board includes a plurality of first signal lines and a plurality of second signal lines. The plurality of first signal lines each include a first main line, a first branch line, and a second branch line. The plurality of second signal lines each include a second main line, a third branch line, and a fourth branch line. The first branch line includes a first conductor pattern disposed in a first conductor layer. The second branch line includes a second conductor pattern disposed in the first conductor layer. The third branch line includes a third conductor pattern disposed in a second conductor layer. The fourth branch line includes a fourth conductor pattern disposed in the second conductor layer.

The present disclosure provides a device that includes a cable. A first cable pin and a second cable pin are spaced apart from one another in a first pin region on a first face of the film. A third cable pin and a fourth cable pin are spaced apart from one another in a second pin region on a second face of the film that is opposite the first face. A first cable signal line on the first face of the film is connected to the first cable pin, and a second cable signal line on the first face of the film is connected to the second cable pin. A third cable signal line on the second face of the film is connected to the third cable pin, and a fourth cable signal line on the second face of the film is connected to the fourth cable pin.

A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.

A wiring board includes core substrate, a first build-up layer on first surface of the substrate and including conductive and insulating resin layers, and a second build-up layer on second surface of the substrate and including conductive and insulating resin layers. The first build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of each conductive layer on a non-outermost resin layer, and the second build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of each conductive layer on a non-outermost resin layer.