A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body, a peripheral section of the surface electrode having an opening therein; and a covering ceramic layer covering the peripheral section of the surface electrode and the opening therein.

A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body; and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has a thin portion located on a central side of the surface electrode and which is thinner than a central section of the surface electrode, and a width of the thin portion is 20% or more of a width of the peripheral section of the surface electrode that is covered by the covering ceramic layer.

Embodiments herein relate to systems, apparatuses, processes or techniques directed to an impedance cushion coupled with a power plane to provide voltage for a system, where the impedance cushion is dimensioned to suppress resonance of the power plane to mitigate RFI or EMI emanating from the power plane during operation.

A printed circuit board (PCB) includes a dielectric plane and a ground plane parallel to and spaced apart from the dielectric plane. The dielectric plane includes a pair of signal traces and a 3-dimensional (3D) grounded (GND) fence located between the pair of signal traces. The 3D GND fence is electrically connected to the ground plane, and protrudes perpendicularly from the dielectric plane. The 3D GND fence is located equidistant from each of the pair of signal traces, and the 3D GND fence is configured to block electromagnetic interference (EMI) from a first of the pair of signal traces to a second of the pair of the signal traces. The pair of signal traces is configured to form part of a noise-sensitive electronic circuit. The 3D GND fence may have a rectangular configuration.

Method for providing an electrical connection, comprising connecting a first cable to a first conducting structure on a printed circuit board, connecting a second cable to a second conducting structure on the printed circuit board, comparing a propagation delay of a first signal path comprising the first cable and the first conducting structure on the printed circuit board, and a propagation delay of a second signal path comprising the second cable and the second conducting structure on the printed circuit board; and removing conductive material of the first conducting structure and/or of the second conducting structure, in order to modify an electrical length of the first conducting structure and/or of the second conducting structure, to obtain a first conducting path and a second conducting path, in dependence on a result of the comparison, in order to reduce a difference of the propagation delays between the first signal path and the second signal path.

A resin multilayer substrate includes a first resin layer including a thermoplastic resin as a main material, a second resin layer including the thermoplastic resin as a main material and superposed on the first resin layer, a first interlayer-connection conductor passing through the first resin layer in a thickness direction, and a first conductor pattern at an area including a region in which the first interlayer-connection conductor is exposed at the surface of the first resin layer between the first resin layer and the second resin layer. The first conductor pattern includes a portion in or at which a portion of the first interlayer-connection conductor is disposed. The first conductor pattern includes a first portion covering the region exposed at the surface of the first resin layer; and a second portion disposed surrounding the first portion. The first portion and the second portion have different thicknesses from each other.

A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 m and a narrowest vertical thickness of the bridge structure is at least 20 m.

A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer, a surface electrode on a surface of the electronic component body, and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has an opening or a thin portion.

Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.

A multi-layer circuit board is formed multiple layers of a catalytic layer, each catalytic layer having an exclusion depth below a surface, where the cataltic particles are of sufficient density to provide electroless deposition in channels formed in the surface. A first catalytic layer has channels formed which are plated with electroless copper. Each subsequent catalytic layer is bonded or laminated to an underlying catalytic layer, a channel is formed which extends through the catalytic layer to an underlying electroless copper trace, and electroless copper is deposited into the channel to electrically connect with the underlying electroless copper trace. In this manner, traces may be formed which have a thickness greater than the thickness of a single catalytic layer.