An electronic device is disclosed and includes a base substrate, a first circuit layer and a plurality of light-emitting elements. The base substrate has a first surface and a second surface opposite to each other. The first circuit layer includes a first portion and a second portion. The first portion is disposed on the first surface of the base substrate, and the second portion is disposed on the second surface of the base substrate. The light-emitting elements are disposed on the first portion of the first circuit layer. At least one of the second surface of the base substrate and the first portion of the first circuit layer includes at least one microstructure.

A wiring board includes a substrate, a surface protection film laminated on the substrate and having an opening portion, and a conductor block embedded in the substrate and having a pad portion exposed by the opening portion of the surface protection film. The conductor block has an annular groove formed such that the annular groove is surrounding the pad portion of the conductor block, and the surface protection film is formed such that a portion of the surface protection film is extending into the annular groove.

According to one embodiment, a semiconductor device comprises a circuit board and a semiconductor package mounted on the circuit board. The semiconductor package comprises a semiconductor chip, a first connector on a bottom surface of the semiconductor package and electrically connected to the semiconductor chip, and a metal bump coupled to the first connector and electrically connected to a second connector on the circuit board. The first connector has a contact surface facing the second connector. The contact surface has a recessed portion into which the metal bump extends.

The present invention relates to electric components of interventional devices. In order to provide further miniaturization of medical interventional devices, an electric component (10) of an interventional device is provided. The component comprises a flat carrier base (12), at least one electric circuit (14) provided on a substrate (16) and at least one electric wire (18) connected to the electric circuit by a wire connection (20). The substrate is attached to the carrier base. Further, for the wire connection, the carrier base is provided with at least one opening (22) that is provided at least partly with a conductive edge portion (24), which edge portion is connected to the at least one electric circuit. Still further, the substrate is provided with at least one recess (26) aligned with the location of the at least one opening in the carrier base. Furthermore, an end portion of the wire is arranged in the at least one recess; and the end portion of the wire is conductively coupled to the conductive edge portion by electrically conductive material (30).

A card, e.g. a printed circuit board (PCB), has one or more conductive layers and one or more non-conductive layers disposed and alternating upon one another to form a stack. One or more of the conductive layers has one or more wiring elements within the conductive layer. The PCB/card has one or more card edges. The PCB also has a plurality of dual-level pad structures on each of one or more of the card edges. The dual-level pad structures each have an upper level, a lower level, and two or more walls. The lower level is a conductive pad with conductive surface. At least one of the conductive pads electrically connects to one or more of the wiring elements and/or one or more vias. In each of the dual-level pad structures, the walls and upper level may be made of an electrically non-conductive, insulating, or dielectric material or may be covered with a conductive material that electrically connects to conductive surface. There are different non-limiting embodiments of the structures and methods of making the structures.

An electronic device includes a substrate, a first conductive pad and a chip. The first conductive pad is disposed on the substrate. The chip includes a second conductive pad electrically connected to the first conductive pad, and the first conductive pad is disposed between the substrate and the second conductive pad. The first conductive pad has a first groove.

An electrical element includes a pair of conducting elements spaced from one another, a recess receiving an electrical component, and a trough extending from a first conducting element of the pair of conducting elements to a second conducting element of the pair of conducting elements. The conducting elements are at least partially exposed in the recess.

An example apparatus includes a cover to shield, at least partly, a conductive trace on a surface of a circuit board from electromagnetic interference. The cover includes a conductive surface that faces the conductive trace. The cover at least partly encloses a volume over the conductive trace. The volume is for holding air over the conductive trace. One or more contacts electrically connect the conductive surface of the cover to electrical ground on the circuit board.

A method is provided for mounting a semiconductor IC to a substrate without a socket or solder. The method includes disposing a guide structure on the substrate. The substrate has multiple contact pads disposed thereon. The substrate also has multiple nuts formed therein for connecting to one or more bolts. The method also includes placing the semiconductor IC inside the guide structure such that the semiconductor IC makes contact with the contact pads. A top plate is disposed on the semiconductor IC. Further, the top plate and the semiconductor IC are fastened to the substrate.

A card, e.g. a printed circuit board (PCB), has one or more conductive layers and one or more non-conductive layers disposed and alternating upon one another to form a stack. One or more of the conductive layers has one or more wiring elements within the conductive layer. The PCB/card has one or more card edges. The PCB also has a plurality of dual-level pad structures on each of one or more of the card edges. The dual-level pad structures each have an upper level, a lower level, and two or more walls. The lower level is a conductive pad with conductive surface. At least one of the conductive pads electrically connects to one or more of the wiring elements and/or one or more vias. In each of the dual-level pad structures, the walls and upper level may be made of an electrically non-conductive, insulating, or dielectric material or may be covered with a conductive material that electrically connects to conductive surface. There are different non-limiting embodiments of the structures and methods of making the structures.