H05K2201/09754

MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS
20180359860 · 2018-12-13 ·

A method for manufacturing a multilayer structure, includes obtaining a substrate film for accommodating electronics, providing, preferably at least in part by printed electronics technology, a number of conductive traces, and optionally electronic components, at least on a first side of the substrate film to establish a predetermined circuit design, providing a connector element to said substrate film to electrically connect to the circuit, wherein the substrate film is arranged with at least one hole, preferably through hole, substantially matching the location of the connector element so that a number of electrically conductive contact members of the connector element are accessible from a second, opposite side of the substrate film via said at least one hole, and molding thermoplastic material on said first side of the substrate film and said connector element to substantially cover the established circuit and the side of the connector element facing the material.

METHOD FOR PRODUCING A RADOME AND CORRESPONDING RADOME

The invention relates to a method for producing a radome, a flexible printed circuit board having a metallic structure being used. Said flexible printed circuit board is embossed and is back-molded with a thermoplastic material and electric contact elements are connected to the flexible printed circuit board. A connector skirt is placed on the contact elements prior to back-molding.

INTERFACES FOR COUPLING A MEMORY MODULE TO A CIRCUIT BOARD, AND ASSOCIATED DEVICES, MODULES, AND SYSTEMS
20240306331 · 2024-09-12 ·

This disclosure relates generally to interfaces between memory modules and circuit boards. More specifically, this disclosure relates to interfaces for coupling a memory module to a circuit board such that the memory module is arranged in a plane that is substantially parallel with a plane of the circuit board. Various embodiments disclosed herein include interfaces, memory modules including interfaces or portions of interfaces, and/or circuit boards including interfaces and/or portions of interfaces. Associated devices and systems are also disclosed.

ELECTRICAL CONNECTORS, CIRCUIT BOARDS, AND FABRICATION TECHNIQUES
20180263119 · 2018-09-13 ·

A printed electrical connector is fabricated via additive manufacturing technology. According to configuration, the printed electrical connector design includes two flat patterned thermoplastic plates printed with mechanical registration features that align conductive traces on the two plates of the electrical connector. A top plate is printed with a plurality of raised pedestals and a plurality of metallic traces. A bottom plate is printed with a plurality of recessed channels and a corresponding plurality of metallic traces. The plurality of recessed channels of the bottom plate are configured to mate with the plurality of raised pedestals on the top plate. The pedestals and channels of the top and bottom plates, respectively, serve to align the metallic traces that comprise the electrical connector. The printed electrical connector design allows printed electrical/electronic circuits and/or devices to be manufactured and interfaced with other printed electrical/electronic circuits and/or devices. In this way, the printed electrical connector can be employed as an integral part of a printed circuit board for any suitable kind of circuit, including, but not limited to, digital, analog, and/or microwave circuits.

Multilayer structure and related method of manufacture for electronics

Multilayer structure, including a substrate film having a first and second opposite side, said substrate film including electrically insulating material, conductive traces on the first side of the substrate film for establishing a predetermined circuit design, a connector element laid upon the first side of, said substrate film, one side of the connector element facing the structure internals and the other, opposite side facing the environment on the second side of the substrate film including a number of electrically conductive contact members electrically connected to the circuit on the first side of the substrate film and configured to contact one or more electrical contact members of an external element responsive to mating the external element with the connector element, and a plastic layer molded onto the substrate film and the connector element so as to cover said one side of the connector element and the circuit.

Circuit board interconnection device and circuit board assembly

A printed circuit board connecting device (1) for connecting printed circuit boards (3, 5) includes a non-conductive plate (21) having a top side and a bottom side, and a plurality of interface connections (23) which are arranged in the plate (21) so as to be spaced apart from one another. Each interface connection (23) has grouped-together conductors (41) which extend through the plate (21) and which are laterally enclosed by the plate material and the end regions of which protruding on the top side and lower side from the plate (21) can be fixed to interfaces (13) of two printed circuit boards (3, 5) to be connected. Therefore, the conductors (41) form both a mechanical and an electrical connection between the interfaces (13) of the printed circuit boards (3, 5).

AC socket, power cord and display apparatus having the same

A display apparatus in which a height of an AC socket protruding to a rear side of a printed circuit board is reduced and a power cord is provided to be in close contact with a product to provide a display apparatus in which a creeping distance is increased to prevent the printed circuit board from being damaged by a high voltage or a stroke of lightning.

CONNECTOR, CONNECTOR ASSEMBLY, CONNECTING STRUCTURE, AND CONNECTING METHOD
20240388027 · 2024-11-21 ·

The connector includes a sheet member extending in a direction orthogonal to the fitting direction and having flexibility and insulating property, a plurality of contacts retained by the sheet member at positions distanced from each other in a predetermined direction along a surface of the sheet member, and a plurality of flexible conductors disposed on the sheet member and configured to electrically connect the plurality of contacts to the plurality of wiring portions of the mounting object, the sheet member being stretchable at least in the predetermined direction, with a portion of the sheet member situated between the plurality of contacts being elastically stretched in the predetermined direction, the connector being fitted to the counter connector, the plurality of contacts separately making contact with and being electrically connected to the plurality of counter contacts due to a shrinking force generated in the sheet member.

CONTACT ELEMENT AND CONTACT STRUCTURE FOR ELECTRONIC DEVICE

In accordance with an aspect of the present disclosure, a contact structure for an electronic device may include a printed circuit board (PCB) including at least one hole vertically formed through the PCB, a housing (e.g., a mechanical part) on which the PCB is seated, and a contact element, at least part of which is brought into contact with the housing disposed on a side of the hole of the PCB and below the same. The contact element may include a contact part soldered on a peripheral portion around the hole, and a protrusion passing through the hole and making contact with the housing disposed below the PCB.

SIGNAL TRANSMISSION SYSTEM, CONNECTOR APPARATUS, ELECTRONIC DEVICE, AND SIGNAL TRANSMISSION METHOD

A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.