Patent classifications
H05K2201/09754
Method for producing a radome and corresponding radome
The invention relates to a method for producing a radome, a flexible printed circuit board having a metallic structure being used. Said flexible printed circuit board is embossed and is back-molded with a thermoplastic material and electric contact elements are connected to the flexible printed circuit board. A connector skirt is placed on the contact elements prior to back-molding.
Electronic component mounting structure and method
Provided is an electronic component mounting structure and method for mounting electronic components on the side of a printed circuit board by means of simple fabrication and enlarging the surface area for mounting electronic components. A cut face of a conductive plating layer, which is obtained by cutting along a via in which a conductive plating layer covering an inner wall face of a via hole is electrically connected to a conductive pattern layer of the printed circuit board, is exposed at a cut end face and used as a land pattern which is solder-connected to a mount connecting portion of the electronic component. The end face at which the land pattern is exposed is a surface parallel to the side of the printed circuit board, and therefore electronic components can be mounted on the end face parallel to the side.
LOW INSERTION FORCE CONTACT AND METHOD OF MANUFACTURE
A low insertion force contact includes a conductive base layer extending to a mating end including a mating interface configured for mating electrical connection to a mating contact. A silver coating layer is provided on the conductive base layer. The silver coating layer is provided at the mating end. A silver sulfide surface layer forms a solid lubricant directly on the silver coating layer. The silver sulfide surface layer forms a film defining a surface of the low insertion force contact having a controlled thickness at the mating interface.
Printed circuit board stack structure and method of forming the same
A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.
Textile electronic device for smart clothing
A textile electronic device configured to be connected to a conductive zone of a textile, the device including: an electronic circuit; at least a first mechanical and electrical connection means configured to be connected to the conductive zone of a textile; a textile substrate having at least a second electrical connection means, the at least one second electrical connection means being electrically connected to the electronic circuit and to the at least one first mechanical and electrical connection means; and a flexible envelope totally or partially including said electronic circuit, the at least one first mechanical and electrical connection means and the textile substrate, the at least one first mechanical connection means and electric being at least partially accessible through the flexible envelope. Also, a manufacturing method of the textile electronic device.
PLUG CONNECTOR
A plug connector includes: an insulative housing including a main body, a reinforcement projecting forward from the main body, and a pair of baffle plates; and a printed circuit board partially received in the insulative housing, the printed circuit board extending forward from the main body and beyond the reinforcement, the reinforcement wrapping on the printed circuit board, wherein a width of a front end of the printed circuit board exposed outside the main body in a horizontal direction is greater than a width of the reinforcement, and a limiting groove is formed between the baffle plate and the printed circuit board for guiding the plug connector to mate with a socket connector.
PLUG CONNECTOR
A plug connector used to mate with the socket connector includes: a housing; a printed circuit board received in the housing, the circuit print board having plural soldering points; and a cable electrically connected to the soldering points of the printed circuit board, wherein the soldering points are provided with glue blocks to protect a connection between the printed circuit board and the cable.
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD
Provided is an electronic component mounting structure and method for mounting electronic components on the side of a printed circuit board by means of simple fabrication and enlarging the surface area for mounting electronic components. A cut face of a conductive plating layer, which is obtained by cutting along a via in which a conductive plating layer covering an inner wall face of a via hole is electrically connected to a conductive pattern layer of the printed circuit board, is exposed at a cut end face and used as a land pattern which is solder-connected to a mount connecting portion of the electronic component. The end face at which the land pattern is exposed is a surface parallel to the side of the printed circuit board, and therefore electronic components can be mounted on the end face parallel to the side.
Edge connector and printed circuit board assembly
The present invention relates to an edge connector (1) for a printed circuit board (50), comprising an at least two-part housing (10) with a first housing part (20) and a second housing part (30), wherein the first housing part (20) has a recess (25) in which at least one conductor (15) is arranged, said at least one conductor (15) having a first limb (16) with a first end (17) and a second limb (18) with a second end (19), wherein the housing (10) comprises a first region (12) in a first plane (11), in which each first end (17) protrudes out of the housing (10) in an assembly direction (5) in order to connect to a conductor track (54) of the printed circuit board (50), and the housing (10) has a second region (14) in a second plane (13) which is arranged parallel and at a distance to the first plane (11) in the assembly direction (5), wherein the second limb (18) is arranged at an angle of 90 to the first limb (16), and the second limb (18) protrudes into a mating plug recess (35) in the second housing part (30) in a plug-in direction (6). The present invention additionally relates to a printed circuit board assembly (2) with at least one such edge connector.
PRINTED CIRCUIT BOARD STACK STRUCTURE AND METHOD OF FORMING THE SAME
A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.