A flexible circuit board includes a flexible substrate having a first portion, a second portion, and a first side defining part of the first portion and the second portion. Electrical components are disposed on the first side in the first portion and in the second portion. The flexible substrate is folded between the first portion and the second portion such that the first portion overlays the second portion and the first side is directed outwards.

A connector device that includes a circuit board; a connector attached to the circuit board; and a molded resin that covers the entire circuit board and part of the connector, wherein: a housing of the connector contains a resin material and fibrous inorganic fillers, a groove is formed in a region of a surface of the housing that is covered with the molded resin, the groove being formed by removing the resin material with the inorganic fillers remaining, and extending in a direction that intersects a mounting direction in which a counterpart connector is to be mounted to the connector, the groove has a depth and a width in a range from 50 m to 150 m inclusive, and the groove is filled with the molded resin.

According to one embodiment, a magnetic disk device includes a housing having a box-shaped base with a bottom wall, a first connection portion provided inside the bottom wall, a second connection portion provided outside the bottom wall and electrically connected to the first connection portion, a control circuit board provided outside the housing, a third connection portion fixed to an inner surface of the control circuit board facing the bottom wall, and abutting on and electrically connecting to the second connection portion, and a reinforcement member positioned between the control circuit board and the bottom wall and provided around the third connection portion.

A cable connector assembly includes a plug for mating with a docking connector, a printed circuit board electrically connected to the plug and a cable electrically connected to the connector, the plug includes a plurality of conductive terminals, the cable includes a plurality of high speed signal cores for transmitting high speed signals and low speed signal cores for transmitting low speed signals, wherein the electrical path of the high speed signal cores connected to the corresponding conductive terminals is shorter than the electrical path of the low speed signal cores connected to the corresponding conductive terminals.

The present disclosure relates to a method for positioning at least two circuit boards in a housing having a non-conductive surface, a first securement location for securing the first circuit board, and a second securement location for securing the second circuit board, wherein at least one conductive trace is arranged in the housing and is connected non-releasably with the housing, and wherein the conductive trace electrically contacts the first securement location with the second securement location, the method comprising securing the circuit boards in the securement locations of the housing such that the first circuit board is electrically in contact with the first securement location and the second circuit board is electrically in contact with the second securement location, wherein the first circuit board and the second circuit board are electrically in contact with one another via the at least one conductive trace.

A circuit board module for being assembled to a case is provided. The circuit board module includes an electronic connector and a circuit board. The electronic connector is fixed to the circuit board. The circuit board has at least one first slot. The at least one first slot is configured for a fixing element to pass through and for the circuit board to be assembled to a case. The size of the at least one first slot allows the fixing element to move in a direction parallel to a surface of the circuit board in the at least one first slot. An electronic device having the circuit board module is also provided.

An electronic device is provided. The electronic device includes a housing, a communication circuit disposed on one side of the housing, a multi-layered printed circuit board (PCB) disposed on one side of the housing and electrically connected to the communication circuit and an antenna radiator disposed on one side of the housing or defining at least a portion of an outer surface of the housing, and is electrically connected to the communication circuit and the multi-layered printed circuit board, wherein the multi-layered printed circuit board comprises a first conductive pattern disposed in at least one of a plurality of layers thereof to form a capacitance, a second conductive pattern disposed in at least another one of the plurality of layers thereof to form an inductance and a conductive plate disposed between the at least one and the at least other one of the plurality of layers and is electrically isolated from the first conductive pattern and the second conductive pattern.

A method for manufacturing a multilayer structure, includes obtaining a substrate film for accommodating electronics, providing, preferably at least in part by printed electronics technology, a number of conductive traces, and optionally electronic components, at least on a first side of the substrate film to establish a predetermined circuit design, providing a connector element to said substrate film to electrically connect to the circuit, wherein the substrate film is arranged with at least one hole, preferably through hole, substantially matching the location of the connector element so that a number of electrically conductive contact members of the connector element are accessible from a second, opposite side of the substrate film via said at least one hole, and molding thermoplastic material on said first side of the substrate film and said connector element to substantially cover the established circuit and the side of the connector element facing the material.

A conductor connection structure for a plurality of plate-like routing members includes the plurality of plate-like routing members, a plurality of terminal members, and a circuit board. Each of the plurality of plate-like routing members has a conductor exposed part in which a strip flat conductor is exposed, at a part of an insulating coating member coating an outer circumferential surface of the strip flat conductor. Each of the plurality of terminal members has a board connecting part connected to the conductor exposed part so as to be conducted to the strip flat conductor. The circuit board includes a plurality of circuit conductors, and terminal connecting parts on the plurality of circuit conductors are respectively electrically connected to the board connecting parts.

A method for fabricating a circuit board apparatus includes providing a circuit board that has a socket with at least one plated through-hole and providing a connector that has a housing with first and second connector interfaces that have, respectively, at least first and second connector contacts. The first connector interface opens into an interior of the housing such that there is a vapor path through the first connector interface and interior of the housing to the second connector contact at the second connector interface. The first connector contact is inserted through the resilient seal and into the plated through-hole such that the resilient seal intimately seals around the first connector contact to provide a barrier at the first connector interface into the vapor path.