A printed circuit board includes a printed wiring board, a semiconductor element, and conductive members. The printed wiring board includes an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. The semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. The conductive members filled in the through-holes connect the element terminals and the wiring.

An optical module includes a circuit board and a light emitting assembly. The circuit board includes a first circuit board ground line, a second circuit board ground line and a circuit board signal line. The light emitting assembly is connected to the circuit board, and the light emitting assembly includes a spacer and a laser chip. The spacer includes a first spacer ground line, a second spacer ground line and a spacer signal line. The first spacer ground line is connected to the second spacer ground line through a fourth connection line; or the first spacer ground line is connected to the second circuit board ground line through a fifth connection line; or the second spacer ground line is connected to the first circuit board ground line through a sixth connection line; or the first circuit board ground line is connected to the second circuit board ground line through a seventh connection line.

A redundant circuit device including a first system circuit and a second system circuit having identical function, the redundant circuit device comprises: a substrate that is partitioned into a first region in which a part of the first system circuit is provided and a second region in which a part of the second system circuit is provided, each of the first region and the second region having a printed wiring; a first mount component that is included in the first system circuit, has three or more pins, and is surface-mounted on one surface of the substrate; and a second mount component that is included in the second system circuit, has an identical number of pins as that of the first mount component and having an identical function as that of the first mount component, and is surface-mounted on the one surface.

An embedded component structure includes a board, an electronic component, and a dielectric material layer. The board has a through cavity. The board includes an insulating core layer and a conductive member. The insulating core layer has a first surface and a second surface opposite thereto. The through cavity penetrates the insulating core layer. The conductive member extends from a portion of the first surface along a portion of the side wall of the through cavity to a portion of the second surface. The electronic component includes an electrode. The electronic component is disposed in the through cavity. The dielectric material layer is at least filled in the through cavity. The connection circuit layer covers and contacts the conductive member and the electrode. A manufacturing method of an embedded component structure is also provided.

A circuit board, a display panel and a display apparatus are provided. The circuit board includes a main circuit board and an adapter circuit board stacked on the main circuit board. The adapter circuit board is provided with at least one first pad region, and the first pad region includes a hollowed region penetrating through the adapter circuit board and multiple first pads distributed around the hollowed region. The main circuit board is provided with at least one second pad region including multiple second pads, and the first pads of each of the first pad regions are respectively soldered to the multiple second pads of a corresponding second pad region.

A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.

A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

An anti-interference circuit board and a terminal are provided. The circuit board specifically includes a substrate (10). The substrate (10) has a first surface, and a first region (14) for placing a magnetometer (2) is disposed on the first surface. A plurality of circuit layers (11, 12, 15) are disposed in the substrate (10), and the plurality of circuit layers (11, 12, 15) are disposed in a stacked manner. For example, at least a first functional circuit (20) that is configured to generate a magnetic field in a first direction and a second functional circuit (30) that is configured to generate a magnetic field in a second direction are disposed in a stacked manner and are disposed in the substrate (10). When positions of the first functional circuit (20) and the second functional circuit (30) are specifically disposed, the following is met: the first region (14) is located in vertical projections of the first functional circuit (20) and the second functional circuit (30) on the first surface. It can be learned from the foregoing descriptions that the first functional circuit (20) and the second functional circuit (30) are disposed to compensate for interference to the magnetometer (2) in the first region (14), and during disposing, the first functional circuit (20) and the second functional circuit (30) are located below the magnetometer (2), to reduce an occupied surface area of the anti-interference circuit board.

High-current circuit having a printed circuit board comprising a non-conductive substrate 2, a conductor layer 4 applied to the substrate 2 and an insulation layer 6 applied to the conductor layer, contact pads 8, 10, 12, 20, 22, 24 in each case interrupting the insulation layer 6 being arranged on both sides of the conductor plate, and the contact pads 8, 10, 12, 20, 22, 24 making contact with one another via vias 14 through the substrate 2, and the vias 14 being arranged in the area of the contact pads 8, 10, 12, 20, 22, 24, 10, 12, 20, 22, 24, characterized in that at least a first one of the contact pads 8 is arranged on a first side of the printed circuit board and a first semiconductor switch 28 is connected directly to at least a second one of the contact pads 20 on a second side of the printed circuit board, and in that the semiconductor switch 28 is connected to the first contact pad 8 directly via the vias 14 and the second contact pad 20, without further conductor tracks.

A circuit pattern of a power line and a circuit pattern of a signal line are disposed in a first layer of a laminated circuit board device, a circuit pattern of the signal line to be protected is disposed in a second layer, and a circuit pattern of a power line is disposed in a third layer. The shapes of the first circuit pattern of the power line of the first layer and the second circuit pattern of the power line of the third layer are substantially matched with each other with respect to a portion of the second layer lacing the circuit pattern of the signal line. The direction of the current of the first circuit pattern coincides with the direction of the current of the second circuit pattern.