A circuit board structure includes a substrate, a third dielectric layer, a fourth dielectric layer, a first external circuit layer, a second external circuit layer, a conductive through hole electrically connected to the first and second external circuit layers, a first annular retaining wall surrounding the conductive through hole, and a second annular retaining wall surrounding the conductive through hole. The first annular retaining wall is electrically connected to the first external circuit layer and a first inner circuit layer. The second annular retaining wall is electrically connected to the second external circuit layer and a second inner circuit layer. A first ground circuit, the first annular retaining wall, and the first inner circuit layer define a first ground path surrounding a first signal circuit. A second ground circuit, the second annular retaining wall, and the second inner circuit layer define a second ground path surrounding a second signal circuit.

A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: conductor layers and protective layers to form a multiple-layered structure of wiring patterns; a band-shaped main strip to be located to extend in a stacking direction of cells; and a band-shaped branch strip branched from the main strip. The branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a connection portion disposed closer to an end of the branch strip than the bent portion and connected to the corresponding busbar. The bent portion has a thin-layer portion having a shape formed by removing, from the flexible circuit board, a part of the protective layers corresponding to a part of the conductor layers without being used as the wiring pattern in the branch strip.

A method of manufacturing a printed circuit board includes providing a printed circuit board (PCB) substrate including at least one insulating layer and first and second conductive layers separated from one another by the at least one insulating layer, forming a first via hole in the PCB substrate extending from the first conductive layer to the second conductive layer, where the first via hole is defined by a first sidewall of the PCB substrate, forming a second via hole in the PCB substrate, where the second via hole is defined by a second sidewall of the PCB substrate, and selectively plating the first sidewall and the second sidewall to form a first via and a second via, respectively, where the first via and the second via have different via sidewall thicknesses.

A wiring board for a fingerprint sensor includes an insulating board including insulating layers; outer strip electrodes disposed on the insulating layer in an uppermost layer, and side by side in a first direction; inner strip electrodes disposed on the insulating layer in a next layer contacting the insulating layer in the uppermost layer, and side by side in a second direction orthogonal to the first direction; a pad electrode disposed on the insulating layer in the uppermost layer, and on the inner strip electrodes and between the outer strip electrodes; and a via conductor extending through the insulating layer in an outermost layer between the pad electrode and the inner strip electrodes and electrically connecting the pad electrode and the inner strip electrodes to each other. The via conductor has an elliptical shape that is long in the first direction in top view.

A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a further part of the exposed metal layer; and thereafter v) carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer. A component carrier made by the method is further described.

A bonded substrate includes a substrate, a metal plate forming a stacked state with the substrate, and bonding member. The metal plate has a first surface on the substrate side and a second surface opposite; wherein an edge of the first surface is located outside an edge of the second. The bonding member is disposed between the substrate and plate to bond the plate and substrate, and protrudes from the edge over an entire periphery of the plate. In cut surfaces obtained by cutting the bonded substrate, a peripheral surface length (A) from a portion corresponding to a peripheral edge of the first surface to a corresponding portion of the second, protrusion length of the bonding member, and thickness (C) of the metal plate satisfy first and second expressions.
0.032≤B/(A+B)≤0.400  (First Expression)
0.5(mm)≤C≤2.0(mm)  (Second Expression)

Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

A method of manufacture of a circuit board without annular through-hole rings and thus allowing a higher component density includes a base layer, a first wire pattern layer, and a second wire pattern layer on both sides of the base layer. A portion of the base layer not covered by the first wire pattern layer defines at least one first hole. The circuit board further includes a wire layer. The wire layer includes at least a first portion and a second portion connecting to the first portion. The first portion is filled in the first hole. The second portion is formed on the first portion extending away from the base layer. A diameter of the second portion is less than an aperture diameter of the first hole. The wire layer is electrically conductive between the first wire pattern layer and the second wire pattern layer through the first portion.

The present disclosure relates to a method for manufacturing a printed circuit board. The method includes the steps as follows. First, a substrate including a base layer and a copper foil layer on a surface of the base layer is provided. Second, a conductive layer is formed on portions of the copper foil layer. Third, portions of the copper foil layer exposed from the conductive layer are removed by an etching process, and the conductive layer is thinner by the etching process. The reserved portions of the copper foil layer and the conductive layer form a conductive pattern to obtain a printed circuit board without plating wires. A printed circuit board without plating wires made by the above method is also provided.

A circuit board includes a protective film of such a type that a mating contact slides on the protective film and rides over a pad, and is prevented from deteriorating due to attachment and detachment. A circuit board 10 includes a plate-shaped base body 40, a pad 20 formed on a surface of the base body 40 and responsible for electrical contact with a mating contact, and a protective film 30 that spreads on the surface of the base body 40 in contact with an edge of the pad 20. The edge of the pad 20 and a portion, which contacts the edge of the pad 20, of the protective film 30 respectively have heights consecutive to each other. The pad 20 contacts, by causing the mating contact that has slid in a sliding direction in contact with the protective film 30 to ride over the pad 20, the mating contact that has ridden over the pad 20.