An arrangement for exchanging heat between two bodies comprises a circuit board, having at least one first via and at least one second via, wherein at least one heat exchange structure is integrated in the circuit board, wherein the at least one heat exchange structure comprises two heat exchange layers and an intermediate layer arranged between the two heat exchange layers, wherein the two heat exchange layers are thermally joined to each other and electrically separated from each other by the intermediate layer, wherein a first heat exchange layer is associated with the first body and can be brought into thermal contact with it and a second heat exchange layer is associated with the second body and can be brought into thermal contact with it, wherein the at least one first via and the at least one second via are each led through the two heat exchange layers and the intermediate layer arranged between the two heat exchange layers, wherein the at least one first via is in contact only with the first heat exchange layer and is insulated from the second heat exchange layer, and wherein the at least one second via is in contact only with the second heat exchange layer and is insulated from the first heat exchange layer.

The disclosure relates to a filter circuit on an electric motor which has electrical connections at a connection end for connection to a supply voltage (U). The filter circuit consists of at least one capacitor bridge arranged between the connections of the electric motor for radio interference suppression. For increased electromagnetic compatibility (EMC), the filter circuit is arranged on a circuit board and held on the connection end of the electric motor. The circuit board has a capacitor bridge with interference suppression capacitors, which is connected between the electrical connections of the electric motor, wherein an interference suppression capacitor has a longitudinal axis between its electrical connections in the longitudinal direction. The interference suppression capacitors are arranged on the circuit board with their longitudinal axes aligned in different spatial directions.

A device that includes a first board, a second board, and coaxial cable coupled to the first board and the second board. The coaxial cable includes a multi-line coaxial cable configured to provide at least two electrical paths for electrical currents between the first board and the second board. A first plug is coupled to the first board. A second plug is coupled to the second board. The coaxial cable includes a first receptacle and a second receptacle. The first receptacle is configured to couple to the first plug. The second receptacle is configured to couple to the second plug. The coaxial cable is configured to provide (i) a first electrical path for a first electrical current between the first board and the second board, and (ii) a second electrical path for a second electrical current between the first board and the second board.

A cable connection apparatus, a connection assembly, and a method for manufacturing the connection assembly are provided. The cable connection apparatus includes: a back plate and a connection member. The back plate includes a plate body and a ground layer. The plate body defines a through hole and a plurality of shielding holes. The plurality of shielding holes are defined at a periphery of the through hole. The ground layer is arranged on each of two opposite sides of the plate body and is connected to each of the plurality of shielding holes. The connection member abuts against or connects to a surface of a side of the back plate arranged with the ground layer. The connection member is arranged with a signal pin, and the signal pin is received in the through hole.

An circuit board assembly includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch.

A substrate connection member according to various embodiments of the present invention can comprise a printed circuit board which has a plurality of layers that are stacked and which comprises a front surface, a rear surface, and a side surface encompassing the front surface and the rear surface. The printed circuit board can comprise: an opening part which encompasses a partial region of the printed circuit board and which is penetratingly formed from the front surface to the rear surface; at least one bridge connected between the partial region and the printed circuit board by crossing at least a portion of the opening part; and at least one through-hole wire formed in the partial region from the front surface to the rear surface, wherein the inner surface of the opening part and the side surface of the bridge can be formed from a conductive member. Other various embodiments, in addition to the embodiments disclosed in the present invention, are possible.

Provided is an example of a technology capable of accurately controlling impedance.

Provided is a substrate including a first through hole that penetrates a substrate from a first face to a second face of the substrate, and is electrically connected to a transmission line through which a signal is transmitted, a second through hole that is provided adjacent to the first through hole in plan view of the substrate, penetrates the substrate from the first face to the second face, and is electrically connected to a ground, and an adjustment unit that adjusts a distance between the first through hole and the second through hole in plan view of the substrate to adjust an impedance of a connection end of the first through hole with the transmission line.

An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.

A method for controlling a target switch assembly in a chain of switch assemblies includes distributing the chain of switch assemblies in a wellbore; placing a controller at a head of the wellbore; making a first decision, at the controller, to actuate a corresponding detonator of the target switch assembly; transmitting, from the controller to the target switch assembly, a fire command to activate the corresponding detonator; and making a second decision, locally, at the target switch assembly, to activate the detonator, after the fire command from the controller is received.

An electronic device includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch.