An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The bottom side of the first circuit structure has at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.

Embodiments herein relate to systems, apparatuses, or processes to using vias, or plated through holes (PTH), within a substrate or within a sub laminate to create capacitors. The interior of a via may have a first layer, or coating, of an electrically conductive material such as copper, formed on the sides of the via. A second layer including a dielectric material is placed on the first layer of the electrically conductive material. A third layer of electrically conductive material may then be placed on the second layer of the dielectric material. Other embodiments may be described and/or claimed.

A multi-gear brightness adjustment circuit board, and a multi-gear battery holder structure, which through adding the automatic control gear AUTO conductive contact piece and a light spot dot-circle pattern composite conductive contact piece on the circuit board, the gear can be automatically adjusted when the solar cell is used for power supply. Ensuring that the output light power meets the needs of ambient light, rationally use electric energy, which is conducive to energy saving; at the same time, the mode switching of the shooting target is integrated, which reduces the parts of the sight and makes the sight more compact.

A paddle card includes a printed circuit board and a twin-axial cable. The PCB includes a first signal pad on a top surface of the PCB and a second signal pad on a bottom surface of the PCB. The second signal pad is directly below the first signal pad. The twin-axial cable includes a first signal conductor coupled to the first signal pad and a second signal conductor coupled to the second signal pad.

The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An electronic apparatus is provided. The electronic apparatus includes a printed circuit board (PCB), an antenna module mounted on a surface of the printed circuit board, and a radio frequency integrated circuit (RFIC) module mounted on another surface of the printed circuit. The printed circuit board includes a coaxial plated through-hole (PTH) electrically connected with the antenna module and the RFIC.

The present disclosure relates to a printed circuit board. The printed circuit board includes a core layer; a through portion penetrating through the core layer; a first via disposed to be spaced apart from an inner wall of the through portion within the through portion; and a second via disposed in the first via and having a diameter different from that of the first via.

A switch assembly, which is part of a chain of switch assemblies, includes a communication unit (CU) configured to receive, from an external controller, a fire command to activate a detonator and a computing core (CC) configured to locally make a decision whether or not to activate the detonator, after receiving the fire command to activate the detonator.

An arrangement for exchanging heat between two bodies comprises a circuit board, having at least one first via and at least one second via, wherein at least one heat exchange structure is integrated in the circuit board, wherein the at least one heat exchange structure comprises two heat exchange layers and an intermediate layer arranged between the two heat exchange layers, wherein the two heat exchange layers are thermally joined to each other and electrically separated from each other by the intermediate layer, wherein a first heat exchange layer is associated with the first body and can be brought into thermal contact with it and a second heat exchange layer is associated with the second body and can be brought into thermal contact with it, wherein the at least one first via and the at least one second via are each led through the two heat exchange layers and the intermediate layer arranged between the two heat exchange layers, wherein the at least one first via is in contact only with the first heat exchange layer and is insulated from the second heat exchange layer, and wherein the at least one second via is in contact only with the second heat exchange layer and is insulated from the first heat exchange layer.

A circuit board is disclosed, including a circuit board body and at least one via apparatus provided on the circuit board body. The via apparatus includes a via (101) formed on the circuit board body, a via pad (201) surrounding the via and separately provided from the via, and an electrical conductor (301) electrically connecting the via pad (201) with the via (101).

The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An electronic apparatus is provided. The electronic apparatus includes a printed circuit board (PCB), an antenna module mounted on a surface of the printed circuit board, and a radio frequency integrated circuit (RFIC) module mounted on another surface of the printed circuit. The printed circuit board includes a coaxial plated through-hole (PTH) electrically connected with the antenna module and the RFIC.