A connection apparatus for electrically conductive pads includes a first substrate and a second substrate arranged in opposition, wherein a plurality of first electrically conductive pads are arranged on the inside of the first substrate, and a plurality of second electrically conductive pads are arranged on the inside of the second substrate. An electrically conductive glue is arranged between the first electrically conductive pads and the second electrically conductive pads, and the first electrically conductive pads each include a first body, the second electrically conductive pads each include a second body, and the first body and/or the second body includes a hollow portion or portions. The electrically conductive pads with a hollow portion(s) allowing light rays to illuminate and solidify the electrically conductive for bonding and interconnecting the upper and lower electrically conductive pads.

An electronic device may have a housing with a lid that rotates relative to a base. A display in the lid may have a thin-film transistor layer. Display driver circuitry may be mounted to the thin-film transistor layer. A display timing controller integrated circuit may be mounted in the base. A rigid flex printed circuit may have a rigid portion in the base to which the display timing controller integrated circuit is mounted and may have a rigid portion in the lid. A flexible printed circuit portion of the rigid flex printed circuit may be used to couple the rigid printed circuit portion in the lid to the thin-film transistor layer. A flexible printed circuit portion of the rigid flex printed circuit that extends between the lid and the base may be formed from a double-shield-layer single-signal-line-layer flexible printed circuit.

The disclosure is related to a flexible printed circuit board. The flexible printed circuit board comprises a connecting area and a plurality of gold fingers disposed inside the connecting area, wherein the widths of the gold fingers are different. By the above manner, the disclosure is able to increase the number of the gold fingers without changing the size of the flexible printed circuit board so as to solve the impedance matching problem of the gold fingers of the flexible printed circuit board.

A liquid crystal display panel and a testing method thereof are provided. A circuit is shared for a box test and an array test, and a plurality of test lines and a plurality of test pads are not needed to be disposed in the liquid crystal display panel separately for the box test and the array test, that is, areas for disposing the plurality of test lines and the plurality of test pads are not needed to be reserved for the box test and the array test, which can increase a cuttable size of the liquid crystal display panel and increase a number of extractions from the liquid crystal display panel.

An object of the present disclosure is to provide a component crimping device and a component crimping method that make it possible to improve accuracy of attaching a component onto a substrate by preventing the component from being excessively elongated due to rapid thermal expansion when the component is pressed against the substrate. A lower surface side of a substrate-side terminal part of a substrate held by a substrate holding table is supported by a support, a component placed on a placing table is picked up by a crimping head while heating the component, the component is compressed against a compressing table so as to be elongated, and then the component is pressed against the substrate-side terminal part.

The present disclosure discloses a wiring board used to connect a driving chip and a display panel, a flexible display panel and a display device. Signal output ends on the driving chip and signal input ends on the display panel may be arranged in pairs; and the wiring board may include fanout lines each of which is configured to connect a pair of signal output end and the signal input end. The wiring board may include a substrate; a plurality of segments of first connection lines having first resistivity is arranged on a first surface of the substrate; a plurality of segments of second connection lines having second resistivity is arranged on a second surface of the substrate opposite to the first surface. At least parts of the fanout lines are formed by connecting the first connection lines and the second connection lines.

Provided is an electronic device that makes it possible to minimize decreases in mounting yield. In the electronic device, an OLED panel and an FPC are crimped and connected using an ACF. The FPC comprises a pattern that is symmetrical with respect to a line corresponding to a direction perpendicular to a straight line that connects electrodes connected to the OLED panel within the range in which the OLED panel is mounted.

A wiring substrate includes an insulating base that has a plate surface; a first circuit that is provided on the plate surface; a first terminal that is provided on the plate surface, and to which a mounting member is attached; a second terminal that is provided on the plate surface; a first wiring that connects the first circuit and the first terminal to each other; and a second wiring that connects the first terminal and the second terminal to each other, is electrically connected to the first wiring in the first terminal, and has a parallel section in which the second wiring is disposed close to and parallel to the first wiring without being electrically connected to the first wiring outside the first terminal.

The present invention relates to an electronic device including a display module and an electronics module arranged in a common housing, wherein the common housing is completed by a front cover, wherein the display module is arranged directly adjacent to the front cover, wherein the electronics module includes a printed circuit board having multiple layers and a plurality of electronic components attached to the printed circuit board, wherein the electronics module is arranged adjacent to the display module and wherein the printed circuit board includes a first layer and a second layer delimiting the printed circuit board on opposing sides, wherein the first layer is an electromagnetic interference shielding layer and the first layer is arranged facing the display module.

A touch panel includes: an adhesive layer formed on a base film; a protective layer formed on the adhesive layer; a touch sensor portion formed on the protective layer; a bonding pad portion comprising a plurality of unit bonding pads formed on the protective layer as electrically connected to the touch sensor portion; and a first insulating layer formed on the protective layer to extend from a unit bonding pad while filling separation regions between the unit bonding pads. Since the deformations in the elements of the touch panel during the process of bonding the touch panel and the flexible printed circuit board are prevented, there are effects that the degradation in the performance of the touch panel is prevented, and the structural stability of the junction structure of the touch panel and the flexible printed circuit board is secured.